This laser welding method involves superposing a first terminal and a second terminal which are composed of a metal material containing copper and aluminum as a main component, and welding and joining the first terminal and the second terminal with a laser, the method including a laser irradiation step for irradiating, with a laser, along the edge of the first terminal, each of a first upper surface which is the opposite surface to a surface of the first terminal superposed on the second terminal, and a second upper surface which is the surface on the same side, of the second terminal superposed on the first terminal, wherein in the laser irradiation step, laser is emitted a plurality of times under the conditions for heat transfer mode welding.

A method for analyzing a weld seam formed by a laser welding process includes thermally exciting the weld seam by radiating at least one laser pulse onto the weld seam, acquiring a decay characteristic of a thermal radiation emitted by the weld seam, and determining whether a welding defect is present based on an evaluation of the acquired decay characteristic.

Systems and methods for welding first and second foils together. A method includes a step of positioning the first and second foils on a lower section of an aluminum fixture. The method further includes a step of compressing the first and second foils together over a first ridge of the lower section via an upper section of the aluminum fixture thereby defining a first weld location coinciding with the first ridge. The method further includes a step of activating a blue or green laser along the first weld location thereby welding the first and second foils together such that the aluminum fixture remains unwelded. Another method includes compressing first and second foils together over an aluminum fixture via a vacuum.

A method of manufacturing a compound object, such as an antenna, is disclosed. The method includes creating, via additive manufacturing, a first component formed at least in part of an oxidizing metal; applying, via vapor deposition, a solderable coating to at least a portion of the first component; and soldering at least a portion of the first component to a second component by applying a solder to the solderable coating of the first component. The oxidizing metal may be a titanium alloy, such as Ti-6Al-4V. The solderable coating may include copper and/or tin-lead.

A method of marking information on a substrate for use in a semiconductor component is provided. The method comprises providing a substrate for use in a semiconductor component, providing a metal layer on a surface of the substrate, and providing a marking within the metal layer. A method of making a die, a radio-frequency module and a wireless mobile device; as well as a substrate, a die, a radio-frequency module and a wireless mobile device is also provided.

A method for welding copper-including members includes laser-welding a first member that includes copper, and a second member that includes copper and is located adjacent to the first member. A welding surface of the first member and a welding surface of the second member are melted by moving an irradiation position of a laser to turn in a spiral shape while approaching a center of the spiral when irradiating the laser on the welding surface of the first member and the welding surface of the second member.

The subject matter relates to a welding device as well as a welding method for producing a material bond connection between a conductor (10) and a connecting part (8), with at least one ultrasonic welding tool (4), wherein at least part of a contact surface (18) of the connecting part (8) contacts at least part of a contact surface (16) of the ultrasonic welding tool (4).