A surface mountable optoelectronic device with side walls including slots filled with a laminated encapsulant material is presented herein. A surface mount technology optoelectronic device includes a substrate, a housing, at least one optoelectronic chip, and an encapsulant material. The substrate includes electrical terminals that facilitate attachment and electrical coupling of the optoelectronic device to a physical circuit. The housing includes an opaque material and a cavity, in which the substrate is positioned at a bottom portion of the cavity, and a top portion of the housing includes a group of slot openings. The at least one optoelectronic chip is electrically connected to the electrical terminals, and is mounted, within the cavity, to the substrate. The encapsulant material is translucent or transparent, and has been included in the cavity and the slot openings.

Light-emitting diode (LED) devices and more particularly coefficient of thermal expansion (CTE) structures in submounts of LEDs are disclosed. Thermal expansion structures include arrangements of vias within submounts that provide variable CTE values across submount surfaces and/or within thicknesses of submounts. Vias may comprise air-filled vias and/or vias filled with various materials that provide variable CTE values. Vias may further be formed with variable thicknesses within submounts to further tailor CTE values. Submounts may include flexible submounts adept for mounting to irregular surfaces with vias structure to provide CTE compensation. Further aspects are described in the context of chip-scale packaging.

An electronic device includes a substrate, a circuit layer, a semiconductor chip, and a sensing element. The circuit layer is disposed on the substrate. The semiconductor chip is disposed over the substrate and the circuit layer, and is electrically connected to the circuit layer. The semiconductor chip includes a semiconductor die, an underfill layer surrounding the semiconductor die, a reflective layer arranged around the underfill layer, and a transparent conductive layer arranged on the semiconductor die and electrically connected to the circuit layer. The sensing element is at least partially overlapped with the substrate.

A method of making a Surface Mount Device (SMD) light-emitting diode (LED) plug-in light string is disclosed. The method includes: connecting positive and negative poles of an SMD to a first and a second metal conductors, respectively; encapsulating at least a top portion of the SMD with a colloid; connecting the first and second metal conductors to first and second wires, respectively; inserting a rear plug in a space between the first and second wires to form a partially-finished assembly; and waterproofing the partially-finished assembly.

An LED light bulb includes a first bent segment is formed at a top end of a first pin, and a second bent segment is formed at a top end of a second pin, the first bent segment and the second bent segment being substantially disposed on a first plane to form a mounting platform, the first plane being substantially perpendicular to an axial direction of a glass shade, the first bent segment and the second bent segment being spaced apart and bent in opposite directions; the LED illuminant is secured on the mounting platform and welded to the first bent segment and the second bent segment in an electrically conductive manner, respectively; and the package body encapsulates the LED illuminant and respective weld joints between the LED illuminant and the first bent segment and between the LED illuminant and the second bent segment.