A system includes one or more semiconductor processing chambers, and a processing fluid supply system which includes an input portion configured to receive a first fluid from a first fluid source, and a heated flow portion configured to deliver a heated processing fluid including the first fluid to the one or more semiconductor processing chambers. A waste system is configured to receive hot waste fluid from the heated flow portion and/or the one or more semiconductor processing chambers. A heat pump includes a source loop and a load loop, the source loop being thermally coupled to an external heat source. A first heat exchanger includes a first supply-side flow path in fluid communication with the input portion, and a first heat delivery-side flow path in fluid communication with the load loop such that the heat exchanger heats the first fluid before the first fluid enters the heated flow portion.

A system includes one or more semiconductor processing chambers, and a processing fluid supply system which includes an input portion configured to receive a first fluid from a first fluid source, and a heated flow portion configured to deliver a heated processing fluid including the first fluid to the one or more semiconductor processing chambers. A waste system is configured to receive hot waste fluid from the heated flow portion and/or the one or more semiconductor processing chambers. A heat pump includes a source loop and a load loop, the source loop being thermally coupled to an external heat source. A first heat exchanger includes a first supply-side flow path in fluid communication with the input portion, and a first heat delivery-side flow path in fluid communication with the load loop such that the heat exchanger heats the first fluid before the first fluid enters the heated flow portion.

A system includes one or more semiconductor processing chambers, and a processing fluid supply system including an input portion configured to receive a first fluid from a first fluid source, a heater fluidly coupled to the input portion and configured to heat the first fluid, and a heated flow portion fluidly coupled to the heater and configured to deliver a heated processing fluid including the first fluid heated by the heater to the one or more semiconductor processing chambers. A waste system is configured to receive hot waste fluid from the heated flow portion and/or a semiconductor processing chamber. A heat exchanger includes a supply-side flow path in fluid communication with the input portion and a heat delivery-side flow path in fluid communication with the waste system. The heat exchanger is configured to transfer thermal energy from the waste system to the input portion to heat the first fluid.

A system includes one or more semiconductor processing chambers, and a processing fluid supply system which includes an input portion configured to receive a first fluid from a first fluid source, and a heated flow portion configured to deliver a heated processing fluid including the first fluid to the one or more semiconductor processing chambers. A waste system is configured to receive hot waste fluid from the heated flow portion and/or the one or more semiconductor processing chambers. Cascaded heat pumps include a source loop and a load loop, the source loop being thermally coupled to an external heat source. A first heat exchanger includes a first supply-side flow path in fluid communication with the input portion, and a first heat delivery-side flow path in fluid communication with the load loop such that the heat exchanger heats the first fluid before the first fluid enters the heated flow portion.

A system includes one or more semiconductor processing chambers, and a processing fluid supply system which includes an input portion configured to receive a first fluid from a first fluid source, and a heated flow portion configured to deliver a heated processing fluid including the first fluid to the one or more semiconductor processing chambers. A waste system is configured to receive hot waste fluid from the heated flow portion and/or the one or more semiconductor processing chambers. Cascaded heat pumps include a source loop and a load loop, the source loop being thermally coupled to an external heat source. A first heat exchanger includes a first supply-side flow path in fluid communication with the input portion, and a first heat delivery-side flow path in fluid communication with the load loop such that the heat exchanger heats the first fluid before the first fluid enters the heated flow portion.

A flue gas waste heat recovery system includes a heat-exchange device arranged at a flue gas outlet of a fresh feed heater, a first heating plate, a second heating plate and a control unit. A heat-collection assembly is arranged in the heat-exchange device, and is provided with a water inlet pipe and a water outlet pipe. A temperature sensor is arranged in the water outlet pipe. The first heating plate communicates with the inlet and outlet pipes via a first pipeline loop, and is sleeved outside a buffer tank. An internal chamber of the second heating plate communicates with the inlet and outlet pipes via a second pipeline loop, and is sleeved outside an air inlet pipe of the fresh feed heater. The control unit is configured to control operation of the first and second pipeline loops based on a detected value of the temperature sensor.

A flue gas waste heat recovery system includes a heat-exchange device arranged at a flue gas outlet of a fresh feed heater, a first heating plate, a second heating plate and a control unit. A heat-collection assembly is arranged in the heat-exchange device, and is provided with a water inlet pipe and a water outlet pipe. A temperature sensor is arranged in the water outlet pipe. The first heating plate communicates with the inlet and outlet pipes via a first pipeline loop, and is sleeved outside a buffer tank. An internal chamber of the second heating plate communicates with the inlet and outlet pipes via a second pipeline loop, and is sleeved outside an air inlet pipe of the fresh feed heater. The control unit is configured to control operation of the first and second pipeline loops based on a detected value of the temperature sensor.

A jet-type direct-fired preheating system, comprising a direct-fired furnace and a preheating furnace. The direct-fired furnace comprises a furnace casing, a direct-fired heating area being provided in the furnace casing. The preheating furnace comprises: a furnace body, wherein the upper portion of the furnace body is connected to the upper portion of the direct-fired furnace by means of a communicating pipe, the bottom of the furnace body is provided with a strip steel inlet, a sealing apparatus and a steering roller, an upper collection chamber of direct-fired waste gas and a secondary combustion chamber of direct-fired combustion waste gas are provided at the upper portion in the furnace body, and a lower collection chamber of the direct-fired waste gas is provided at the lower portion in the furnace body; and a plurality of heat exchange and jet bellows units, provided in the furnace body in the height direction of the furnace body, a threading channel being formed in the middle. Each heat exchange and jet bellows unit comprises: a bellows body, a heat exchange pipe being provided in the bellows body, and a nozzle being provided on the side surface opposite to the threading channel; a secondary waste gas mixing chamber provided between the bellows bodies; and a circulating fan, an inlet pipeline port being formed in the threading channel, and an outlet pipeline port being located in the bellows body. According to the present invention, strip steel can be quickly preheated to 350 or above and quickly heated to 750 or above; and waste heat of the waste gas is fully utilized, such that an over-thick oxide layer can be prevented from being generated on the surface of the strip steel.

A jet-type direct-fired preheating system, comprising a direct-fired furnace and a preheating furnace. The direct-fired furnace comprises a furnace casing, a direct-fired heating area being provided in the furnace casing. The preheating furnace comprises: a furnace body, wherein the upper portion of the furnace body is connected to the upper portion of the direct-fired furnace by means of a communicating pipe, the bottom of the furnace body is provided with a strip steel inlet, a sealing apparatus and a steering roller, an upper collection chamber of direct-fired waste gas and a secondary combustion chamber of direct-fired combustion waste gas are provided at the upper portion in the furnace body, and a lower collection chamber of the direct-fired waste gas is provided at the lower portion in the furnace body; and a plurality of heat exchange and jet bellows units, provided in the furnace body in the height direction of the furnace body, a threading channel being formed in the middle. Each heat exchange and jet bellows unit comprises: a bellows body, a heat exchange pipe being provided in the bellows body, and a nozzle being provided on the side surface opposite to the threading channel; a secondary waste gas mixing chamber provided between the bellows bodies; and a circulating fan, an inlet pipeline port being formed in the threading channel, and an outlet pipeline port being located in the bellows body. According to the present invention, strip steel can be quickly preheated to 350 or above and quickly heated to 750 or above; and waste heat of the waste gas is fully utilized, such that an over-thick oxide layer can be prevented from being generated on the surface of the strip steel.

A device for thermal treatment comprises at least a preheater, a calciner, and a materials cooler, wherein a solids stream is guided into the preheater, from the preheater into the calciner, from the calciner into the materials cooler, and out of the materials cooler, wherein a gas stream is guided into the materials cooler, from the materials cooler into the calciner, from the calciner into the preheater, and out of the preheater, wherein the device comprises a combustion chamber, wherein the gas stream from the materials cooler is guided at least partially through the combustion chamber into the calciner, wherein a residence time device is arranged between the combustion chamber and the calciner.