A controller is described with an adjacent electronic display which allows users to input building plans, and to design where devices (e.g., equipment and sensors) are to go. The controller has access to databases of the devices including wiring diagrams and protocols, such that the controller can automatically create a wiring diagram that can be used to wire the building and the controller. The adjacent display can be moved to show controller wiring, while the display shows a wiring diagram which describes a diagram of the controller wiring including devices that are connected, and wiring information about the devices.

The present disclosure is directed to methods for generating a multichip, hybrid node stacked package designs from single chip designs using artificial intelligence techniques, such as machine learning. The methods disclosed herein can facilitate heterogenous integration using advanced packaging technologies, enlarge design for manufacturability of single chip designs, and/or reduce cost to manufacture and/or size of systems provided by single chip designs. An exemplary method includes receiving a single chip design for a single chip of a single process node, wherein the single chip design has design specifications and generating a multichip, hybrid node design from the single chip design by disassembling the single chip design into chiplets having different functions and different process nodes based on the design specifications and integrating the chiplets into a stacked chip package structure.

Tools and techniques are described to attach a device to a controller, whereby the controller analyzes the device inputs, looks up information about the device in a database, and then determines which inputs on the device match the defined device inputs. It then may translate information received from the device into an intermediate language. It may also use the information received from the device, the location of the device, and information about the device to create a digital twin of the device.

Semiconductor devices, packaging architectures and associated methods are disclosed. In one embodiment, an integrated circuit (IC) base die is disclosed. The IC base die is configured to couple to a stack of memory die and includes a first port including a die-to-die (D2D) interface to couple to an IC device. A second port includes a memory interface to access a memory other than the stack of memory die. Memory control circuitry controls memory access operations directed to the memory other than the stack of memory die.

A simulation system and a method thereof are disclosed. In the simulation system, a system power transmission model, and analog current time-domain model and digital current time-domain model are connected to obtain power noise generated after a supply current is obtained; jitter time-domain information of each interface connection circuit model under the power noise is obtained based on transmission of a clock signal outputted from a phase lock loop, by a simulation program; next, a voltage step response of a voltage measurement point when a clock terminal of each interface connection circuit model receives an ideal signal, is simulated by the simulation program to generate a first voltage time-domain model; a system waveform is generated based on the jitter time-domain information of each interface connection circuit model under the power noise, the first voltage time-domain model and data transmission, thereby obtaining an eye diagram and time-domain jitter distribution.