A lighting device disclosed in an embodiment of the invention includes a heat dissipation plate having a recess portion; a circuit board accommodated in the recess portion of the heat dissipation plate and having pads; a light source portion having bonding pads; connection members respectively connecting between the pads and the bonding pads; and an adhesive member that adheres the light source portion to the heat dissipation plate. The light source portion includes a support member; light emitting devices having light emitting chips and a wavelength conversion layer; and a resin member. Each of the connection members has a ribbon shape, and a width of each of the connection members is more than twice the thickness of each of the connection members, and each of the connection members may include two ends respectively connected to the bonding pads and the pads, and a center portion extending convexly between the two ends.

Provided is a light emitting device including: a plurality of light emitters including semiconductor layers; and a heat conductor unit that provides a light emitter arrangement region in which the plurality of light emitters are arranged, in which the heat conductor unit includes a heat-dissipation heat conductor for dissipating heat generated from the plurality of light emitters, and an area of the heat-dissipation heat conductor, in a plan view, is larger than an area of the light emitter arrangement region.

A display device includes a first type heat dissipation layer having a high emissivity disposed on a lower surface of a display panel, an upper surface of an inner plate and/or a lower surface of the inner plate facing to a lower frame, and a second type heat dissipation layer having a lower emissivity disposed on the lower surface of the inner plate corresponding to a driving circuit board. The heat generated in the display panel can be efficiently dissipated to an outside and heat generated in the driving circuit board can be transferred to the display panel in a minimized form.

A packaging structure is provided. The packaging structure includes a dielectric structure, a redistribution structure, a plurality of light-emitting elements, a color conversion layer, and a metal barrier wall. The redistribution structure is disposed in the dielectric structure. The plurality of light-emitting elements is disposed on the dielectric structure and electrically connected to the redistribution structure. The color conversion layer is disposed on the plurality of light-emitting elements. The metal barrier wall is disposed on the dielectric structure and surrounds the color conversion layer.