A method of forming a brazed joint is described. The method includes pressing a non-molybdenum component, such as a cross pin of a battery case assembly, against a molybdenum component, such as a terminal pin of the battery case assembly, and applying one or more electrical pulses to form an interface liquid layer between the components that cools to form the brazed joint. At least one of the electrical pulses has a constant voltage over a pulse time. A contact resistance between the components can decrease during the pulse time, and thus, the constant voltage can cause an uncontrolled electrical current of the electrical pulse to increase. The increasing electrical current heats the components sufficiently to form the interface liquid layer having a predetermined thickness that provides a required bend strength. Removal of surface oxides provide consistent mechanical strength for this joint. Other embodiments are also described and claimed.

In various examples, a component is for use in an implantable medical device. The component includes a pin including a first material attached to a lead including a second material different from the first material of the pin. At least a portion of the lead includes a channel in which at least a portion of the pin sits, the channel including a channel opening defined at least partially by opposing first and second channel sides extending a channel length. At least a first joint is formed along at least a portion of the first channel side. The first joint includes the second material of the lead deformed to at least partially close the channel opening to retain the pin within the channel to attach the lead to the pin. In some examples, the first material includes molybdenum and the second material includes aluminum.

A heater includes an aluminum nitride (AlN) substrate and a heating layer. The heating layer is made from a molybdenum material and is bonded to the AlN substrate via transient liquid phase bonding. The heater can also include a routing layer and a plurality of first conductive vias connecting the heating layer to the routing layer. The routing layer and the plurality of first conductive vias can be made from the molybdenum material and at least one of the routing layer and the plurality of first conductive vias are bonded to the AlN substrate via a transient liquid phase bond. A plurality of second conductive vias connecting the routing layer to a surface of the AlN substrate can be included and the plurality of second conductive vias are made of the molybdenum material and can be bonded to the AlN substrate via a transient liquid phase bond.

The present disclosure is directed to a multi-segment device, such as an intravascular guide wire. The multi-segment device includes an elongate first portion comprising a first metallic material, an elongate second portion comprising a different metallic material, the first and second elongate portions being directly joined together end to end by a solid-state weld, and a heat affected zone surrounding an interface of the weld where the first and second portions are joined together, wherein the heat affected zone has an average thickness of less than about 0.20 mm.

A method produces at least one defined connecting layer between two components, wherein the first component is produced from a first metallic material and the second component is produced from a second metallic material and the first and/or second component has a coating of a third metallic material, the melting temperature of which is lower than the melting temperature of the first and second materials. In this case, the coating of at least one of the components is heated locally to a connecting temperature, which lies above the melting temperature of the third material and lies below the melting temperature of the first material and below the melting temperature of the second material, and is cooled down in order to form a defined connecting layer when the coating solidifies.

As may be implemented in accordance with one or more approaches herein, a plurality of metal alloy samples are formed on a surface, in which each sample has a different metal alloy composition relative to the others. Elemental metal powders are provided from hoppers at respective delivery rates and mixed, such that the mixture for each sample is set via the respective delivery rates and is different than the mixture for the other samples. Multiple layers of each mixture are deposited by dispensing and melting the mixture to form the respective samples, and one or more layer of each of the samples is remelted

A first member and a second member are formed of metal materials of the same type and a third member is formed of a material of a different type that is difficult to weld to the first member and the second member. The first member and the second member are laser welded to each other such that respective regions of the first member and the second member which correspond to the spacer are welded via a through hole with the third member interposed therebetween. The spacer is formed of a filler material jointed to the second member by arc welding and is formed such that a central portion protrudes toward the first member more than an outer peripheral portion.

A laser processing apparatus includes: a laser oscillator configured to oscillate a laser pulse; a first laser deflection unit configured to deflect the laser pulse emitted from the laser oscillator in a two-dimensional direction; a second laser deflection unit having a slower operation speed and configured to deflect the laser pulse emitted from the first laser deflection unit in a two-dimensional direction on a same plane; a laser oscillation control unit configured to control the laser oscillator; and first and second laser deflection control units respectively configured to control operations of the first and second laser deflection units. The first laser deflection control unit controls the first laser deflection unit to successively irradiate the laser pulse to multiple sites along a predetermined track in each of the processing positions in turn, and to change energy of the laser pulse emitted therefrom in a middle of repeated irradiation.

A method of processing a thin film structure comprising: providing a thin film structure comprising a stack of two or more thin film layers supported on a surface of a substrate, the stack having a depth orthogonal to the substrate surface; and forming a cut through the depth of the stack by using a direct write laser technique to scan a laser beam along a scan path covering an area of a desired cut line on a surface of the stack to ablate material of the stack along the cut line and through the depth of the stack at least to the surface of the substrate; wherein the direct write laser technique is implemented using an ultrashort pulsed laser outputting pulses with a duration of 1000 femtoseconds or less, at a wavelength in the range of 100 to 1500 nm, and delivering a fluence in the range of 50 to 100,000 mJ/cm2.

The present invention relates to methods of enhancing the surface properties of soft alloys by using a high energy beam. In particular embodiments, the methods can also allow for beam-based welding of such soft alloys to another metal component.