A manufacturing method of an electronic device includes providing a first substrate, wherein the first substrate includes a circuit layer; cutting the first substrate; forming a wire on a first surface which is exposed after cutting the first substrate and on a second surface of the first substrate, wherein the first surface is adjacent to the second surface, and the wire is electrically connected to the circuit layer; disposing an electronic element on the circuit layer; bonding the first substrate after cutting and a second substrate to form an electronic module; and disposing a driving element on the second surface of the first substrate to be electrically connected to the wire.