Provided are solar cell, preparation method thereof and photovoltaic module. Solar cell includes: segmented solar cells formed by segmenting same whole solar cell in first direction, whole solar cell has front surface and back surface oppositely arranged in second direction, each segmented solar cell has front sub-surface and back sub-surface oppositely arranged in second direction, front sub-surfaces of two segmented solar cells formed based on same solar cell are partial regions of front surface, and back sub-surfaces of two segmented solar cells formed based on same solar cell are partial regions of back surface; segmented solar cell has segmentation surface formed by segmentation, two angles supplementary to each other are formed between segmentation surface and plane where back sub-surface is located, and one angle is acute angle; and passivation layer at least located on segmentation surface. Present disclosure are beneficial to improving photoelectric conversion efficiency of solar cell including segmented solar cell.

A photosensitive die and a manufacturing method thereof are provided. The manufacturing method includes the following steps. First, a wafer is cut to form a plurality of photosensitive dies. Secondly, the photosensitive dies are pasted onto an adhesive film. Then, the adhesive film is stretched to increase the distances between the photosensitive dies. Finally, at least one optical film is provided to cover the surfaces of the photosensitive dies.

A photodiode and a manufacturing method thereof are provided. The manufacturing method of the photodiode comprises the following steps: providing a wafer with a plurality of photodiode structures, attaching a protective film to the wafer, cutting the protective film and the wafer to form a plurality of cutting lanes on the protective film and the wafer to separate each photodiode structure, coating a light-shielding solution on the protective film so that the light-shielding solution covers each cutting lane, and curing the light-shielding solution so that a light-shielding sidewall are formed to completely cover the sidewall of each photodiode structure to block any light from penetrating the sidewall.

A sensor package structure, a sensing module, and a manufacturing method of a sensing module are provided. The sensing module includes a sensor chip and a cap. A top surface of the sensor chip has a sensing region and a carrying region arranged outside of the sensing region. The cap includes a light-permeable sheet and an opaque adhesive layer. An inner surface of the light-permeable sheet has a light-permeable region and a processing region that surrounds the light-permeable region. The opaque adhesive layer has an annular shape and is adhered onto the processing region. The opaque adhesive layer is configured to allow a laser beam to pass therethrough. The cap is adhered to the carrying region through the opaque adhesive layer, such that the cap and the sensor chip jointly define an enclosed space, and the light-permeable region faces toward the sensing region of the sensor chip.

A photovoltaic cell includes: a first surface, a second surface opposing the first surface, and a third surface connecting the first surface with the second surface; a passivation layer, formed over the third surface, wherein the passivation layer comprises a metal oxide, and the metal oxide comprises at least one metal element of Al, Ti, Zn, Zr, Hf, Mo, W, and Ni; and a protective layer, formed on a side of the passivation layer away from the third surface, wherein the protective layer comprises a nitride, and the nitride comprises one element from Group III elements.