Systems and methods are disclosed for automated generation of integrated circuit designs and associated data. These allow the design of processors and SoCs by a single, non-expert who understands high-level requirements; allow the en masse exploration of the design-space through the generation processors across the design-space via simulation, or emulation; allow the easy integration of IP cores from multiple third parties into an SoC; allow for delivery of a multi-tenant service for producing processors and SoCs that are customized while also being pre-verified and delivered with a complete set of developer tools, documentation and related outputs. Some embodiments, provide direct delivery, or delivery into a cloud hosting environment, of finished integrated circuits embodying the processors and SoCs.

A process is disclosed that automatically creates a network-on-chip (NoC) very quickly using a set of constraints, which are requirements for the NoC. The process takes a set of constraints as inputs and produces a NoC with all its elements configured and a placement of such elements on the floorplan of the chip.

A routing structure and a method of a wafer substrate with standard integration zone for integration on-wafer, which comprises a core voltage network, an interconnection signal network, a clock signal network and a ground network, wherein the core voltage network and the interconnection signal network belong to a top metal layer, the clock signal network is located in a inner metal layer, and the ground network is located in a bottom metal layer. The pins provided on the standard zone include core voltage pins, interconnection signal pins, clock signal pins, ground pins, and complex function pins. The complex function pins are directly connected to the outside of the system by TSV at the bottom of the wafer, and the other pins are connected by their signal networks. The present disclosure solves the yield problem with few metal layers of the wafer substrate for SoW.

Methods, systems, and computer program products are described for generating synthesizable netlists from register transfer level (RTL) designs to aid with semiconductor device design. These netlists provide RTL design information corresponding to a portion of a semiconductor device. A configuration tracer generates behavior information associated with the RTL design. A register compiler compiles a set of semiconductor devices based on one or more technologies and power, performance, and area (PPA) information related to the semiconductor device. Semiconductor devices generated by the register compiler that meet predefined power, performance, and area conditions are identified. Structural information for aligning the input/output ports of the semiconductor device is generated. A set of one or more synthesizable semiconductor device configurations is created based on user defined parameters such that one of the synthesizable semiconductor device designs may by selected to generate a design netlist with structure-synthesizable input/output boundary compatible semiconductor device modules.

A shared memory is provided between simulation processors and emulation processors within an emulation chip. The shared memory is configured to enable the simulation processors and the emulation processors to exchange simulation data and emulation data respectively with each other during simulation and emulation operations. The simulation processors and the emulation processors may update their respective simulation and emulation operations in response to the simulation data and the emulation data exchanged via the shared memory.

The present disclosure is directed to methods for generating a multichip, hybrid node stacked package designs from single chip designs using artificial intelligence techniques, such as machine learning. The methods disclosed herein can facilitate heterogenous integration using advanced packaging technologies, enlarge design for manufacturability of single chip designs, and/or reduce cost to manufacture and/or size of systems provided by single chip designs. An exemplary method includes receiving a single chip design for a single chip of a single process node, wherein the single chip design has design specifications and generating a multichip, hybrid node design from the single chip design by disassembling the single chip design into chiplets having different functions and different process nodes based on the design specifications and integrating the chiplets into a stacked chip package structure.

Disclosed are systems and methods that include accessing design parameters to configure an integrated circuit design. The integrated circuit design may include a transaction source or processing node to be included in an integrated circuit. The transaction source or processing node may be configured to transmit memory transactions to memory addresses. A compiler may compile the integrated circuit design with the transaction source or processing node to generate a design output. The design output may be configured to route memory transactions based on their targeting cacheable or non-cacheable memory addresses. The design output may be used to manufacture an integrated circuit.

Disclosed is an operating method of an electronic device which includes a processor executing a semiconductor layout simulation module based on machine learning. The operating method includes receiving, at the semiconductor layout simulation module executed by the processor, a layout image, inferring a wafer image based on the layout image and a fabrication device information image of a semiconductor fabrication device fabricating a semiconductor integrated circuit based on a final layout image, adjusting the layout image when the wafer image is not acceptable, and confirming the layout image as the final layout image when the wafer image is acceptable.