C04B35/596

Powder for additive modeling, structure, semiconductor production device component, and semiconductor production device

A material powder for additive modeling including a nitride, and a eutectic oxide, the nitride having an average density lower than an average density of the eutectic oxide, is used to produce a structure using an additive modeling method.

Sintered material and cutting tool including same

A sintered material includes a first material and a second material, the first material being partially stabilized ZrO.sub.2 having a crystal grain boundary or crystal grain in which 5 to 90 volume % of Al.sub.2O.sub.3 is dispersed with respect to a whole of the first material, the second material including at least one of SiAlON, silicon nitride and titanium nitride, the sintered material including 1 to 50 volume % of the first material.