Patent classifications
C04B35/5833
Binderless cBN sintering with cubic press
A method of sintering a binderless cBN body includes providing a boron nitride particle mixture into a pressure chamber, the boron nitride particle mixture having a first type of boron nitride particles and boron nitride filler particles, and the boron nitride filler particles having a different size and/or type than the first type of boron nitride particles, and sintering the boron nitride particle mixture in the pressure chamber to form the cBN body by generating a pressure in the pressure chamber of less than 7.7 GPa and heating the boron nitride particle mixture to a temperature ranging from about 1900° C. to about 2300° C., wherein the cBN body has a density of at least 97 percent.
Formed hexagonal boron nitride body, hexagonal boron nitride granulates for making the same, and process for producing the same
Provided are formed bodies comprising hexagonal boron nitride wherein the formed body has a Brinell hardness of at least 2 HBW 2,5/2, and wherein the formed body is obtainable by a process at temperatures of at most 100 C., and wherein the Brinell hardness is measured according to DIN EN ISO 6506-1 (2013). Further provided are processes for making said formed body.
Powder for additive modeling, structure, semiconductor production device component, and semiconductor production device
A material powder for additive modeling including a nitride, and a eutectic oxide, the nitride having an average density lower than an average density of the eutectic oxide, is used to produce a structure using an additive modeling method.