The present invention relates to a diacrylate compound represented by general formula (1), a composition thereof, and a cured product of the compound/composition. ##STR00001## In the formula, R denotes a hydrogen atom or a methyl group; R.sup.1, R.sup.2, R.sup.3, and R.sup.4 each independently denote a C.sub.1-6 linear or branched alkyl group, with the proviso that R.sup.1, R.sup.2, R.sup.3, and R.sup.4 are not all methyl groups. The present invention provides: a novel diacrylate compound which can provide a cured product having an excellent balance of physical properties such as low curing shrinkage, flexibility, resistance to bending, and low curling properties, and which can be used as a photo- or thermal-radical polymerizable monomer; a composition of the compound; and a cured product of the compound/composition.

Conventional electroconductive adhesives had difficulty to have simultaneously storage stability and low temperature curability, and to have at the same time exhibition of adhesion strength and electric conductivity for poorly-adhesive metal adherends such as gold and nickel. The present invention accordingly provides an isotropic electroconductive adhesive that has low temperature curability in an atmosphere of 80 to 130 C. A thermocurable electroconductive adhesive containing component (A) to component (E) such that the component (E) is contained at 100 parts by mass or more and 1000 parts by mass or less relative to 100 parts by mass of the total of the component (A) and component (B); component (A): a urethane modified oligomer having a (meth)acrylic group component (B): a monomer having one (meth)acrylic group in the molecule component (C): an organic peroxide having specific structure component (D): a phosphoric acid ester compound component (E): electroconductive particles that are surface-treated with stearic acid.