Disclosed is a light emitting display device and a light emitting display panel. The light emitting display device includes a first column spacer and a second column spacer disposed on a bank layer. The first column spacer has a different shape form the second column spacer, and at least one of the first column spacer and the second column spacer includes a light-shielding material. The column spacer with the light-shielding material is disposed apart from a reflective electrode of a light emitting diode so that a metal component in the reflective electrode is not reacted with a component with the light-shielding material in the column spacer. Light reflected from metal electrodes and external light is blocked by the column spacer so that the light emitting display device with beneficial luminous efficiency is realized.

A micro LED array includes a plurality of micro LED structures, wherein each of the micro LED structure includes: a mesa structure; a first thermal conductive layer formed surrounding a sidewall of the mesa structure, wherein a material of the first thermal conductive layer is an electrically insulative material with high thermal conductivity; and a bottom connect structure provided at a bottom of the mesa structure to electrically connect the mesa structure to a bottom pad of an integrated circuit (IC) backplane.

A micro LED display panel includes an integrated circuit (IC) backplane including a bottom pad array and a micro LED array comprising a plurality of micro LED structures provided on the IC backplane, one micro LED structure of the plurality of micro LED structures being electrically connected with one bottom pad of the plurality of bottom pads. The micro LED structure includes a mesa structure; a first thermal conductive layer formed surrounding a sidewall of the mesa structure, a material of the first thermal conductive layer being an electrically insulative material with high thermal conductivity; and a second thermal conductive layer filled between adjacent ones of micro LED structures. The IC backplane further includes: one or more heat dissipation structures provided corresponding to an area outside the micro LED structure and passing thought the IC backplane to radiate heat to outside, wherein the heat dissipation structure and the bottom pad are separated.

A micro LED array includes a plurality of micro LED structures, wherein each of the micro LED structures includes: a mesa structure; a bonding layer provided at a bottom of the mesa structure to bond the mesa structure with an integrated circuit (IC) backplane; and a first thermal conductive layer formed surrounding sidewalls of the mesa structure and the bonding layer, wherein a material of the first thermal conductive layer is an electrically insulative material with high thermal conductivity.

A micro LED array includes a plurality of micro LED structures, each of the micro LED structures including: a mesa structure; a bonding layer provided at a bottom of the mesa structure to bond the mesa structure with an integrated circuit (IC) backplane; and a first thermal conductive layer formed surrounding a sidewall of the mesa structure, wherein a material of the first thermal conductive layer is an electrically insulative material with high thermal conductivity.

A micro LED display panel includes an integrated circuit (IC) backplane; a micro LED array provided on the IC backplane, the IC backplane controlling the micro LED array; and a heat dissipation structure provided on the IC backplane and in contact with edges of the micro LED array.

A display device, an electronic device including the display device, and a method for manufacturing the display device are disclosed. The display device may include a display panel, a heat dissipating member below the display panel, and a bottom chassis below the heat dissipating member. The heat dissipating member may include a heat dissipating plate including graphite, an adhesive layer on at least one surface of the heat dissipating plate, wherein the adhesive layer may include a polyurethane, and a base material film spaced and/or apart (e.g., spaced apart or separated) from the heat dissipating plate with the adhesive layer therebetween. The adhesive layer may include a polyol that includes a polycarbonate polyol. The adhesive layer may include a first portion adjacent to the heat dissipating plate and a second portion adjacent to the base material film.

A light-emitting device includes: a first light-emitting unit including: a first light-emitting element having a first element lateral surface, and a first light-transmissive member disposed over the first light-emitting element and having a first lateral surface; a second light-emitting unit including: a second light-emitting element having a second element lateral surface facing the first element lateral surface, and a second light-transmissive member disposed over the second light-emitting element and having a second lateral surface facing the first lateral surface; and a reflective member holding the first light-emitting unit and the second light-emitting unit together, wherein the reflective member includes: a first reflective member and a second reflective member.

A display device includes a first substrate, a plurality of light-emitting units, and a plurality of color filter units. The light-emitting units are disposed on the first substrate and include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit. The first light-emitting unit, the second light-emitting unit, and the third light-emitting unit emit light of different colors respectively. The color filter units are disposed on the light-emitting units and include a first color filter unit, a second color filter unit, and a third color filter unit. The first color filter unit, the second color filter unit, and the third color filter unit overlap the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit respectively. The first color filter unit, the second color filter unit, and the third color filter unit include a scattering particle.

Provided is a light emitting device including: a plurality of light emitters including semiconductor layers; and a heat conductor unit that provides a light emitter arrangement region in which the plurality of light emitters are arranged, in which the heat conductor unit includes a heat-dissipation heat conductor for dissipating heat generated from the plurality of light emitters, and an area of the heat-dissipation heat conductor, in a plan view, is larger than an area of the light emitter arrangement region.