B65D81/05

RETAINER
20220388721 · 2022-12-08 ·

A retainer (1) for releasably retaining an item, such as a bottle, is described. The retainer comprises a housing (19); and a latch. The latch is configurable between: i) an unlocked state for insertion of the item into, or removal of the item from, the housing, in which the latch is movable between an open position and a closed position; and ii) a locked state for retaining the item in the housing, in which the latch is maintained in the closed position. Configuration between the locked state and the unlocked state is effected by a change in orientation of the retainer.

RETAINER
20220388721 · 2022-12-08 ·

A retainer (1) for releasably retaining an item, such as a bottle, is described. The retainer comprises a housing (19); and a latch. The latch is configurable between: i) an unlocked state for insertion of the item into, or removal of the item from, the housing, in which the latch is movable between an open position and a closed position; and ii) a locked state for retaining the item in the housing, in which the latch is maintained in the closed position. Configuration between the locked state and the unlocked state is effected by a change in orientation of the retainer.

SELF-PRESSURIZING FLUID DELIVERY SYSTEMS AND DEVICES AND METHODS OF USING THE SAME
20220387698 · 2022-12-08 ·

Self-pressurizing fluid deliver systems and devices and methods of using the same. An exemplary pressurized sterile fluid storage bag system referenced herein includes a foam cavity formed from a rigid, non-conforming material and an elastic, conforming material and containing a resilient open cell or closed cell foam with capabilities to restore form when compressed, an air valve, a fluid cavity formed from said elastic, conforming material on one side and a material which may be rigid and non-conforming or elastic and conforming, and a fluid valve.

WAFER CONTAINER AND PURGE SYSTEM

In a wafer container, diffusers are positioned such that they are closer to a center line of the wafer container. This improves the distribution of purge gas within the wafer container. The diffusers can be positioned such that their position corresponds to a recessed central panel of the back wall. The diffusers can be positioned such that an angle between the diffusers relative to a center of a wafer contained within the wafer container is 60 degrees or less. The diffusers can be joined to purge ports by offset connectors oriented such that the diffusers are closer to the center line of the wafer container than the purge ports. The distance from each of the diffusers to the center line of the wafer container can be less than one fourth of a diameter of the wafer that the wafer container is configured to accommodate.

Package structure

A package structure comprises a backing plate supporting a target object, at least one pad disposed on the backing plate and fixing the target object, a frame disposed on a lower side of the backing plate, bonded to the backing plate, and supporting the backing plate to fix the pad onto the backing plate, and a side enclosing plate disposed around the backing plate and connected to the pad to fix the pad. The package structure further comprises a magnetic component disposed on the backing plate and attracting a magnetic coating on the target object.

Frame end cap package

A frame package including a back panel, an inside panel tab, a front panel, and an inside panel is provided. The inside panel tab extends from the back panel. The front panel extends from the back panel and defines a region to rest upon a corner portion of a frame. The inside panel extends from the front panel and includes an inside panel tab slot. The back panel, the front panel, and the inside panel are arranged with one another to fold about the corner portion of the frame and for the inside panel to extend through a frame opening such that the corner portion of the frame is covered by at least one of the back panel and the front panel. The inside panel tab is received within the inside panel tab slot to secure the back panel to the inside panel without an additional fastener.

TENSION-ACTIVATED, EXPANDING SHEETS

The present disclosure relates generally to tension-activated, expanding articles, films, and sheets. In some embodiments, these articles, films, and/or sheets are used as cushioning films and/or packaging materials. The present disclosure also relates to methods of making and using these tension-activated, expanding articles, films, and sheets.

TENSION-ACTIVATED, EXPANDING ARTICLES WITH MULTIBEAM SLITS

The present disclosure relates generally to tension-activated, expanding articles that include a plurality of patterned slits. At least some of the plurality of slits are multibeam slits that, when the material into which the slits are formed is tension-activated form one or more multibeams. In some embodiments, these articles are used as cushioning films and/or packaging materials. The present disclosure also relates to methods of making and using these tension-activated, expanding articles.

TENSION-ACTIVATED, EXPANDING ARTICLES WITH CURVED TERMINAL EDGES

The present disclosure relates generally to tension-activated, expanding articles that include a plurality of patterned slits. At least some of the plurality of slits include curved terminal ends. In some embodiments, these articles are used as cushioning films and/or packaging materials. The present disclosure also relates to methods of making and using these tension-activated, expanding articles.

Connective protective packaging
11511509 · 2022-11-29 · ·

A connective protective packaging element is provided. The connective protective packaging element may include a protective body in a high-density supply configuration. The protective body may be configurable into a low-density configuration for cushioning packaged products. The body may include an exposed surface in the low-density configuration. The connective protective packaging element may also include a bonding element attached to the exposed surface that operably bonds the exposed surface to an abutting surface by contact with the bonding element.