A lens protective film includes a base layer, a buffer layer, and a protective layer. The buffer layer and the protective layer are laminated on the base layer. The base layer includes a main body and a first handle extending from the main body. An opening is defined in each of the main body and the buffer layer. The openings of the main body and the buffer layer overlap to form the receiving structure. The receiving structure is used to receive a raised part of a lens. The lens protective film can prevent the buffer layer and the protective layer from being broken and generating debris.

In an embodiment a storage device includes a base carrier extending along a main surface having a surface structuring, a carrier foil including a first main surface and a second main surface, wherein the first main surface is fixable to or arrangeable on the main surface of the base carrier, and wherein the components are fixable to the second main surface and a fixing frame fixing the carrier foil, which is fixed or positioned to the main surface of the base carrier, to the base carrier and acting as a releasable clamp so that the carrier foil is clampable and securable in or to the base carrier.

The present invention discloses a storage container for electronic devices, especially for wafer frames. The storage container includes a body and a stop rod that is provided to open or close a pick-and-place path in the body. The pick-and-place path is open to allow the wafer frames placed in the body to be taken out when a recess of the stop rod is located in the pick-and-place path. On the contrary, the pick-and-place path is closed when a blocking part of the stop rod is located in the pick-and-place path so as to protect the wafer frames placed in the body from falling out from the storage container.

The present invention discloses a storage container for electronic devices, especially for wafer frames. The storage container includes a body and a stop rod that is provided to open or close a pick-and-place path in the body. The pick-and-place path is open to allow the wafer frames placed in the body to be taken out when a recess of the stop rod is located in the pick-and-place path. On the contrary, the pick-and-place path is closed when a blocking part of the stop rod is located in the pick-and-place path so as to protect the wafer frames placed in the body from falling out from the storage container.

Disclosed herein is a display apparatus packing material. The display apparatus packing material includes a first area configured to cover a front surface of a display apparatus; a second area configured to cover sides of the display apparatus, and extending from edges of the first area; and a third area disposed between the first area and the second area such that the second area is bendable with respect to the first area, wherein the second area covers sides of the display apparatus when the second area is bent, and includes an adhesive member configured to be attached on the sides of the display apparatus.

Disclosed herein is a display apparatus packing material. The display apparatus packing material includes a first area configured to cover a front surface of a display apparatus; a second area configured to cover sides of the display apparatus, and extending from edges of the first area; and a third area disposed between the first area and the second area such that the second area is bendable with respect to the first area, wherein the second area covers sides of the display apparatus when the second area is bent, and includes an adhesive member configured to be attached on the sides of the display apparatus.

A system for securely storing semiconductor die and devices employing a waffle pack lid configured to mate with a waffle pack tray. The lid body has an interior surface with a cavity including a shock absorbing layer. There is at least one electrostatic dissipative layer comprising attached to the shock absorbing layer such that the electrostatic dissipative layer seals the compartments on the waffle pack tray.

A system for securely storing semiconductor die and devices employing a waffle pack lid configured to mate with a waffle pack tray. The lid body has an interior surface with a cavity including a shock absorbing layer. There is at least one electrostatic dissipative layer comprising attached to the shock absorbing layer such that the electrostatic dissipative layer seals the compartments on the waffle pack tray.

A reticle storage device includes a top lid having a ceiling and a cover surrounding the ceiling, and a bottom lid having a carrier and a peripheral structure surrounding the carrier. When the top lid engages with the bottom lid, a passage is defined therebetween and therefore the reticle storage device is not sealed.

A reticle storage device includes a top lid having a ceiling and a cover surrounding the ceiling, and a bottom lid having a carrier and a peripheral structure surrounding the carrier. When the top lid engages with the bottom lid, a passage is defined therebetween and therefore the reticle storage device is not sealed.