A cage can be positioned around a medical balloon, such as an angioplasty balloon, to assist in a medical procedure. The cage can include a plurality of strips, each extending between a set of rings including first and second rings. As the balloon expands, the first and second rings move closer together and allow the strips to expand outward. The cage may have wedge dissectors on the strips.

A cage can be positioned around a medical balloon, such as an angioplasty balloon, to assist in a medical procedure. The cage can include a plurality of strips, each extending between a set of rings including first and second rings. As the balloon expands, the first and second rings move closer together and allow the strips to expand outward. The cage may have wedge dissectors on the strips.

A packaging assembly is provided with a base that is sized to receive at least one shower door glass pane. At least one shower door glass pane is received within the base. A handle is mounted to the base. A plurality of projections extends from a bottom surface of the base to rest upon an underlying support surface and to reduce friction between the packaging assembly and the underlying support surface. The base includes a box with an opening formed in opposed surfaces of the box to expose a portion of the at least one shower door glass pane.

A packaging assembly is provided with a base that is sized to receive at least one shower door glass pane. At least one shower door glass pane is received within the base. A handle is mounted to the base. A plurality of projections extends from a bottom surface of the base to rest upon an underlying support surface and to reduce friction between the packaging assembly and the underlying support surface. The base includes a box with an opening formed in opposed surfaces of the box to expose a portion of the at least one shower door glass pane.

Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

A packaging system and method for securing a product within a shipping container includes providing a shipping container appropriately sized for the product, attaching at least a first shock absorption member to the shipping container for serving as a locator for the product and for positioning the product on the shipping container. Attaching at least a second shock absorption member to the shipping container for, together with the at least a first shock absorption member, securing the product on the shipping container. The shipping container is closed about the product, which is itself suspended by the at least a first shock absorption member and the at least a second shock absorption member.

A packaging system and method for securing a product within a shipping container includes providing a shipping container appropriately sized for the product, attaching at least a first shock absorption member to the shipping container for serving as a locator for the product and for positioning the product on the shipping container. Attaching at least a second shock absorption member to the shipping container for, together with the at least a first shock absorption member, securing the product on the shipping container. The shipping container is closed about the product, which is itself suspended by the at least a first shock absorption member and the at least a second shock absorption member.

An embodiment relates to a loading cassette and a target substrate loading method to which same is applied. The loading cassette according to the embodiment comprises: an upper plate; a lower plate facing the upper plate while having a space therebetween; an edge support part for connecting the upper plate to the lower plate and supporting the left and right edges of a target substrate; and a rear surface support part for connecting the upper plate to the lower plate and supporting the center and the rear surface-edge of the target substrate.

An embodiment relates to a loading cassette and a target substrate loading method to which same is applied. The loading cassette according to the embodiment comprises: an upper plate; a lower plate facing the upper plate while having a space therebetween; an edge support part for connecting the upper plate to the lower plate and supporting the left and right edges of a target substrate; and a rear surface support part for connecting the upper plate to the lower plate and supporting the center and the rear surface-edge of the target substrate.

A packaging combination is disclosed that includes a box and at least first and second planar objects in the box. At least first and second shock absorbing clips are attached to the planar objects in the box. At least one of the first clips is fastened to the first planar object and the clip is positioned between one wall of the box and the second planar object. At least one of the second clips is fastened to both planar objects and is positioned between opposite walls of the box.