A substrate storing container that stores substrates composed of semiconductor wafers includes: a locked portion that is arranged at a center portion of an upper wall and is locked by a lifting member that can lift a container main body; in which the locked portion includes a plate-like flange portion having a lower face that faces the upper wall and an elastically deformable elastic member provided at a lower face of the flange portion and/or at a rim portion of the flange portion; and in which the locked portion is locked by the lifting member in a state in which the elastic member is sandwiched between the flange portion and the lifting member.

A holding device for a top-opening substrate container includes a holding assembly for pushing a substrate actuator disposed at a substrate to operate. The holding assembly includes a holding body and a pushing actuator. The pushing actuator includes a first guiding sloped surface for pressing against a second guiding sloped surface of an inner surface of a container door structure. The first guiding sloped surface causing corresponding pushing and displacement between the first guiding sloped surface and the second guiding sloped surface according to a supporting force of the container door structure. A pushing section is connected to the first guiding sloped surface, and capable of correspondingly pushing the substrate actuator to operate according to a level of the pushing and displacement of the first guiding sloped surface, such that the substrate actuator displaces substrates and stacks the substrates with another in layers.

A packing box according to an embodiment includes a lower body including a bottom portion and a lower wall portion extending upward from the bottom portion; and an upper body including a cover portion and an upper wall portion extending downward from the cover portion defining an inner space with the lower body in case that combined with the lower body. The upper wall portion includes at least one groove in which an edge portion of a display device is inserted, and the cover portion includes at least one opening abutting with the at least one groove.

An adjustable tilting packaging box is provided for holding a liquid crystal module. A supporting rack is arranged in the box for carrying the liquid crystal module thereon and is connected to a support element for being mounted on a bottom of the box. The support element includes an adjustment mechanism connected to a side of the supporting rack and includes a support pillar having a lower end selectively positionable on a plurality of levels provided on an end of the pull rod having an opposite end extending outside the box, such that a movement of the pull rod allows different ones of the levels to support the support pillar thereon so as to change a position of the supporting rack to thus change an angular position of the liquid crystal module.

A tape feeder is configured such that plural tape suppliers guiding plural component supply tapes to a component pick-up position are individually and detachably mounted on plural slots of the feeder body. A read component ID from a code label of a tape reel is input into a feeder management computer. The feeder management computer performs instruction display of the slot to be mounted among the plural slots to an instruction display section based on component ID. If a mounting confirmation sensor confirms the tape supplier is mounted on one of the slots, the feeder management computer determines whether or not a component in which the component ID is read is supplied from a correct slot depending on whether or not the slot in which the mounting of the tape supplier is confirmed matches the slot in which the instruction display is performed.

Disclosed are a multilayer styrenic resin sheet including 10 to 50 laminated layers which are each made of a styrenic resin composition that includes 29 to 65 mass % of a styrene/conjugated diene copolymer (A), 51 to 15 mass % of a polystyrene resin (B) and 20 to 9 mass % of an impact-resistant polystyrene resin (C) and which each have an average thickness of 2 to 50 m; and a packaging material (such as carrier tape or tray) for electronic components which is formed from the multilayer styrenic resin sheet. The melt tension of the styrenic resin composition at 220 C. is preferably 10 to 30 mN, and the content of the conjugated diene is preferably 10 to 25 mass % relative to 100 mass % of the copolymer (A).

An integrated circuit (IC) device container/carrier includes a cartridge having a plurality of faces and a device housing slot recessed from one or more of the faces, where each slot is configured to house at least one IC device. The container further includes a lid rotatably coupled with the cartridge, the lid having a window recess configured to align with each device housing slot for accessing corresponding IC devices. At least one of the cartridge faces may be configured as a lock face without a corresponding device housing slot recessed from this lock face.

A soft- or hard-sided apparatus for temporarily storing a plurality of electronic devices that transmit electromagnetic signals that would, if not suppressed, interfere with other electronic devices or make the devices accessible to outsiders. The apparatus includes a container, such as a soft-sided bag, that is sized for holding the plurality of electronic devices and is specially adapted to be normally RF-tight to suppress the electromagnetic signals transmitted by the plurality of electronic devices to prevent them from interfering with other electronic devices. The container further includes a small opening assembly in the container that opens and closes, such as a trap door, outfitted with magnets. The first small opening assembly is adapted to be RF-tight when closed so that a user can push an electronic device through the assembly, into the container, after which all the electronic devices are silenced inside of the container. The container further includes a second larger opening assembly to allow removal of all of the electronic devices as a group. The soft-sided container can be located in a cardboard shipping box, ready to be emptied nearby or returned to a third-party when full so that the devices can be refurbished and re-used.

A panel packaging tray includes a packaging case including a sidewall which defines a receiving section in which a display panel is accommodated and a plurality of supports disposed on an inside surface of the sidewall, where the supports guide a position of the display panel on a plane crossing the inside surface. A supporter of the supports includes a fixing unit coupled with the sidewall and a buffer unit disposed between the fixing unit and the display panel. The buffer unit includes a straight portion, a corner portion, and a curved portion located between the straight portion and the corner portion, based on a direction parallel to the plane. A curvature of a curved surface included in the curved portion is determined by a maximum tilt angle by which the display panel is allowed to be tilted in a state of being accommodated in the receiving section.

The present invention discloses an inner packaging structure for a network distribution frame, used to package a distribution frame body and a bracket, including an isolated protection board. A packaging box for a network distribution frame further includes a cover body and a box body with an open top, and the inner packaging structure is located in the box body. A packaging method for a network distribution frame includes the following steps: placing the distribution frame body and the bracket in the box body, and separating the distribution frame body from the bracket by the isolated protection board; and limiting the distribution frame body and the bracket to complete packaging by using fastening of a top cover of the cover body and the box body. The present invention ensures no abrasion in the transportation process while realizing deplasticization packaging of products, and saves logistics costs for enterprises and customers.