Provided an automatic feeding device for automotive wheel hub, comprising a separable material rack having material rack units capable of being stacked in turn, a first roller table for conveying the separable material rack containing the wheel hub to a second roller table, and a material rack separating device having a support frame and material rack inserting and taking devices; the second roller table, under which a lifting platform is mounted, is located at a first end of lower part of the material rack inserting and taking device; the material rack inserting and taking device splitting the separable material rack into units, and placing to a third roller table being arranged at a second end of the lower part thereof; a manipulator, for grasping and placing the wheel hub from the material rack unit to a fourth roller table being on a second side thereof.

Systems and methods are disclosed for controlling the rotation of turrets with servo motors within a machine line used in the shaping of articles. Error conditions can be detected using the servo motors for resolving issues with the machine line. Control of the turrets by the servo motors allows for each turret to be rotated relative to the other turrets independently for resolving the issues. Absolute encoders are used to return the servo motors and their respective turrets back to being aligned with a virtual axis for synchronous rotation of the turrets within the machine line, despite the turrets not being mechanically coupled together by a series of gears.

A semiconductor wafer is as wide as the industry standard width A (presently 156 mm+/−1 mm) and is longer than the industry standard A by at least 1 mm and as much as the standard equipment can reasonably accommodate, presently approximately 3-20 mm and potentially longer, thus, gaining significant additional surface area for sunlight absorption. Modules may be composed of a plurality of such larger wafers. Such wafers can be processed in conventional processing equipment that has a wafer retaining portion of industry standard size A and a configuration that also accommodates a wafer with a perpendicular second edge longer than A by at least 1 and typically 3-20 mm. Wet bench carriers and transport and inspection stations can be so used.

A semiconductor wafer is as wide as the industry standard width A (presently 156 mm+/−1 mm) and is longer than the industry standard A by at least 1 mm and as much as the standard equipment can reasonably accommodate, presently approximately 3-20 mm and potentially longer, thus, gaining significant additional surface area for sunlight absorption. Modules may be composed of a plurality of such larger wafers. Such wafers can be processed in conventional processing equipment that has a wafer retaining portion of industry standard size A and a configuration that also accommodates a wafer with a perpendicular second edge longer than A by at least 1 and typically 3-20 mm. Wet bench carriers and transport and inspection stations can be so used.

A storage and order-picking system including a warehouse, wherein the warehouse includes a storage module formed by two racks including one rack aisle therebetween; separation stations associated with the storage module, each separation station having associated therewith a respective pick up location; separate conveying systems for feeding storage containers from the warehouse to the pick up locations of the separation stations, respectively; and a robot arranged between the separate conveyors such that the robot can pick up during one movement cycle from each of the separate conveying systems respectively one article and can deliver between the corresponding article pick up locations one article which has already been picked up to a deposition location.

A storage and order-picking system including a warehouse, wherein the warehouse includes a storage module formed by two racks including one rack aisle therebetween; separation stations associated with the storage module, each separation station having associated therewith a respective pick up location; separate conveying systems for feeding storage containers from the warehouse to the pick up locations of the separation stations, respectively; and a robot arranged between the separate conveyors such that the robot can pick up during one movement cycle from each of the separate conveying systems respectively one article and can deliver between the corresponding article pick up locations one article which has already been picked up to a deposition location.

Provided is a transport robot and a substrate treating apparatus including the transport robot. The substrate treating apparatus includes a transport chamber having a long shape on one side, and for providing a moving space of a substrate, a load lock chamber connected to the transport chamber to provide an exchange space between the transport chamber and a substrate before a process or a substrate after a process, a process unit connected to the transport chamber to perform a process for a substrate transferred from the transport chamber, a track provided in the transport chamber to provide a moving path of a substrate, and a transport robot capable of moving along the track in a non-contact manner, and entering or exiting the load lock chamber to perform a substrate exchange between the load lock chamber and the transport chamber.

A substrate transfer system includes a load lock module, an atmospheric transfer module having a first sidewall adjacent to the load lock module and a second sidewall remote from the load lock module, the atmospheric transfer module being connected to the load lock module, and a substrate transfer robot disposed in the atmospheric transfer module. The substrate transfer robot includes a base configured to reciprocate along the first sidewall, a substrate transfer arm disposed on the base, and a flow rectifier surrounding the base, the flow rectifier being configured, upon movement of the base, to create an obliquely downward air flow in a direction opposite to a moving direction of the base.

A substrate transfer system includes a load lock module, an atmospheric transfer module having a first sidewall adjacent to the load lock module and a second sidewall remote from the load lock module, the atmospheric transfer module being connected to the load lock module, and a substrate transfer robot disposed in the atmospheric transfer module. The substrate transfer robot includes a base configured to reciprocate along the first sidewall, a substrate transfer arm disposed on the base, and a flow rectifier surrounding the base, the flow rectifier being configured, upon movement of the base, to create an obliquely downward air flow in a direction opposite to a moving direction of the base.

An apparatus for transferring a substrate is disclosed herein. More specifically, the apparatus relates to substrate handling systems used in semiconductor device manufacturing, and more particularly, to substrate handling systems having a substrate handler with enclosed moving elements and increased compatibility with post-CMP cleaning modules. The apparatus includes one or more indexing assemblies. Each of the indexing assemblies including an enclosure, an actuator assembly disposed within the enclosure, and two handling blades disposed outside of the disclosure. Each of the two blades are moveable in either of a translational or a rotating manner.