End effectors and methods for gripping a curvilinear sheet of material are disclosed herein. The curvilinear sheet of material defines a first sheet side having a curvilinear first side topography and a second sheet side having a curvilinear second side topography. The end effector includes a negative mating shaped first sheet-engaging surface configured to operatively support the first sheet side and having a curvilinear first sheet-engaging surface topography that corresponds to the curvilinear first side topography. The end effector also includes a second sheet-engaging surface configured to operatively support the second sheet side and having a curvilinear appropriately mating negative shaped second sheet-engaging surface topography that corresponds to the curvilinear second side topography. The end effector further includes an actuation mechanism configured to selectively transition the end effector between an open orientation and a gripping (converging) orientation. The methods include methods of utilizing the end effectors.

A substrate tray for accommodating at least one ceramic substrate therein including: an accommodation part including a first opening part of which the upper side is open so that the ceramic substrate can be accommodated and withdrawn; and a support part formed on the circumference of the accommodation part so as to support the side wall circumference of the ceramic substrate, wherein the support part includes: an inner wall in contact with at least one surface of the ceramic substrate; an outer wall spaced a predetermined distance from the inner wall; an upper surface for connecting the inner wall to the outer wall; and a second opening part formed to be open in the direction opposite to the first opening part at a location facing the upper surface between the inner wall and the outer wall.

A substrate tray for accommodating at least one ceramic substrate therein including: an accommodation part including a first opening part of which the upper side is open so that the ceramic substrate can be accommodated and withdrawn; and a support part formed on the circumference of the accommodation part so as to support the side wall circumference of the ceramic substrate, wherein the support part includes: an inner wall in contact with at least one surface of the ceramic substrate; an outer wall spaced a predetermined distance from the inner wall; an upper surface for connecting the inner wall to the outer wall; and a second opening part formed to be open in the direction opposite to the first opening part at a location facing the upper surface between the inner wall and the outer wall.

An apparatus, system and method for providing a manufacturing gripping nozzle. The apparatus, system and method for gripping an in-process component during processing may include: a chuck; at least two walls extending from the chuck; at least two peripheral guides having a size and shape correspondent to a periphery of the component and placed atop the at least two walls distal from the chuck, wherein the at least two peripheral guides are capable of positionally maintaining the periphery during the processing; and at least one Bernoulli cup within a cavity bounded by the chuck, the at least two walls, and the component, wherein the at least one Bernoulli cup non-contactedly grips the component.

Embodiments herein generally relate to inspection systems for substrates or wafers for solar cell applications. The inspection system is configured to analyze substrates or wafers for chips, cracks, and other defects. The system includes conveyor apparatuses, and the conveyor apparatuses include one or more conveyor elements. The conveyor elements are configured to transport rectangular wafers having a width between about 175 mm to about 250 mm. The conveyor elements include a first conveyor belt and second conveyor belt to transport the substrates. The spacing of the belts reduces vibrations of the substrate edge.

The present application provides a transfer device and a transfer method. The transfer device includes: a frame; a module transfer arm, arranged above the frame and with a number of at least one; a pre-inspection station, arranged on the frame at an initial placement position in a conveying direction of the module transfer arm, and configured to place thereon a target object to be inspected; a post-inspection station, arranged on the frame at a finish-placement position in the conveying direction of the module transfer arm, and configured to place thereon the target object after being inspected; an inspection station, respectively arranged on the frame and between the pre-inspection station and the post-inspection station, and configured to place thereon and inspect the target object; a feed mechanism.

Provided is a substrate holding device that inhibits drop in holding accuracy of a substrate. A Bernoulli chucking pad suctions and holds a front surface or a back surface of a substrate S. A position determiner 54 is capable of pushing the substrate S in contact with a side surface 82 of the substrate S, and positioning the suctioned substrate S. A pin 66 enables the position determiner 54 to come in contact with the side surface 82 of the substrate S. The pin 66 brings the position determiner 54 into contact with the side surface 82 of the substrate S, and the position determiner 54 thereby positions the substrate S.

Provided is a substrate holding device that inhibits drop in holding accuracy of a substrate. A Bernoulli chucking pad suctions and holds a front surface or a back surface of a substrate S. A position determiner 54 is capable of pushing the substrate S in contact with a side surface 82 of the substrate S, and positioning the suctioned substrate S. A pin 66 enables the position determiner 54 to come in contact with the side surface 82 of the substrate S. The pin 66 brings the position determiner 54 into contact with the side surface 82 of the substrate S, and the position determiner 54 thereby positions the substrate S.

A die ejection apparatus operable to eject a die from a support has at least two ejector components configured to lift a die located on the support. The ejector components are moveable to a position in which a lifting force is exertable by the ejector components on the support, so as to lift a die located on the support. Movement of the die ejector components is initiated towards the support, and a moment when each of the die ejector components reaches the position is determined. A height offset of each die ejector component relative to a height of another die ejector component is determined upon reaching the said position, and relative heights of the die ejector components are adjusted in dependence upon the evaluated height offset.

A method of separating an edge portion from a glass substrate includes applying a scoring tool of a scoring apparatus to a glass substrate to cause the scoring tool to score the glass substrate along a score line as the glass substrate moves relative to the scoring apparatus and applying a breaker bar of a breaker apparatus to the glass substrate as the glass substrate moves relative to the breaker bar to separate an edge portion from the glass substrate along the score line.