A substrate processing apparatus includes a process chamber and a transfer device configured to transfer a plurality of substrates to a substrate retainer. The transfer device includes a base; a first moving unit capable of linear motion; a first drive unit to drive the first moving unit. The first drive unit includes a first pulley group; a first motor coupled to a first pulley; and a first connecting member coupling the first belt and the first moving unit. A second moving unit is capable of linear motion. A second drive unit is in an enclosure of the first moving unit and drives the second moving unit. The second drive unit includes a second pulley group; a second belt wound on the second pulley group, a second motor coupled to drive a second pulley; and a second connecting member coupling the second belt and the second moving unit.

A substrate gripping hand which grips a substrate with a disc shape, includes a base plate, and a guide member provided at the base plate, and having a L-shape when viewed from a horizontal direction, the guide member having a shape in which a base end portion of a bottom surface has a horizontal portion and a first corner portion which is a corner portion formed by the bottom surface and an inner wall surface has a curve line shape.

A substrate gripping hand which grips a substrate with a disc shape, includes a base plate, and a guide member provided at the base plate, and having a L-shape when viewed from a horizontal direction, the guide member having a shape in which a base end portion of a bottom surface has a horizontal portion and a first corner portion which is a corner portion formed by the bottom surface and an inner wall surface has a curve line shape.

A substrate transfer method includes receiving first and second substrates by a pick of a first transfer device, detecting shift amounts of the first and second substrates, calculating a correction amount of a delivery position of the pick based on the shift amount of the first substrate, and moving the pick to the corrected delivery position to respectively deliver the first and second substrates to a first and second mounting sections, moving a first pick of a second transfer device to a receiving position of the first mounting section to receive the first substrate, calculating a correction amount of a receiving position of a second pick of the second transfer device based on the correction amount of the delivery position and the shift amount of the second substrate; and moving the second pick to the corrected receiving position of the second pick to receive the second substrate.

Provided is a pressure-sensitive adhesive structure including a carbon nanotube aggregate formed on a base material in which carbon nanotubes forming the carbon nanotube aggregate are hardly detached. The pressure-sensitive adhesive structure of the present invention includes: a base material; an intermediate layer; and a carbon nanotube aggregate layer, wherein the carbon nanotube aggregate layer includes a plurality of carbon nanotube aggregates, wherein the intermediate layer includes a layer containing the carbon nanotubes and a fixing agent, and wherein the intermediate layer has a thickness of 100 nm or more.

A teaching method according to an embodiment is for a transfer device including a substrate holding unit including a suction port for holding a substrate by applying suction, an actuation mechanism for moving the substrate holding unit, and a pressure detecting unit for detecting a pressure in a suction path communicating with the suction port. The method includes: moving the substrate holding unit under the substrate; moving the substrate holding unit upward toward the substrate, while applying suction to the suction path and detecting the pressure in the suction path; determining whether or not the substrate holding unit has touched the substrate, based on the pressure in the suction path; and storing, as a standard position, a position of the substrate holding unit at a time of determining that the substrate holding unit has touched the substrate.

A substrate processing device includes shafts, rollers, a gas blowing unit, bearings, and s suction unit. The shafts include internal spaces and first through holes communicated with the internal spaces. The rollers are attached to the shafts to be rotatable about axes of the shafts for conveying a substrate. The gas blowing unit is configured to blow gas to the substrate carried by the rollers. The bearings support the shafts to be rotatable and include second through holes communicated with the first through holes of the shafts. The bearings include inner rings fitted on the shafts, outer rings opposed to outer peripheries of the inner rings, respectively, and rolling components disposed between the inner rings and the outer rings. The suction unit is configured to suck air in the internal spaces of the shafts.

A conveying unit includes a housing; a collision prevention mechanism disposed on a sidewall of the housing; a gripping member configured to hold a carrier for carrying a semiconductor structure; a sensor disposed on the gripping member and configured to measure and collect data associated with vibration of the gripping member; and an unit controller disposed on the gripping member and configured to analyze the data from the sensor and control a movement of the conveying unit.

A conveying unit includes a housing; a collision prevention mechanism disposed on a sidewall of the housing; a gripping member configured to hold a carrier for carrying a semiconductor structure; a sensor disposed on the gripping member and configured to measure and collect data associated with vibration of the gripping member; and an unit controller disposed on the gripping member and configured to analyze the data from the sensor and control a movement of the conveying unit.

Four groups of a three-tier arrangement of processing units, each of the processing units being provided with two processing modules and a load lock module, are provided in the front and rear sides along a Y-guide extending rearward when viewed from an EFEM and in the left and right sides of the Y-guide. An exchange of a substrate between a delivery mechanism on the EFEM side and a substrate transfer mechanism on the processing unit side is performed by a substrate loading part, which is movable along the Y-guide and can move upward and downward, and on which a plurality of wafers can be placed in a shelf-like manner.