A substrate transfer device according to an embodiment includes: a holding part configured to hold a substrate having a pattern formed on a front surface thereof; and a supply part configured to supply an inert gas, which locally keeps the front surface of the substrate held by the holding part in a low oxygen state, to the front surface of the substrate.

A substrate processing system comprising: a first chamber comprising loading tables, on which a plurality of substrates are to be loaded; a second chamber comprising loading tables, on which a plurality of substrates are to be loaded; a first transfer device comprising a plurality of blades configured to hold a plurality of substrates in a lengthwise direction thereof, and configured to transfer a plurality of substrates loaded on the loading tables of the first chamber to the loading tables of the second chamber with the substrates held at the same height; a substrate sensor provided on paths, along which the blades enter the second chamber, and configured to detect a substrate held by the blades; and a controller configured to control the first transfer device.

A substrate processing system comprising: a first chamber comprising loading tables, on which a plurality of substrates are to be loaded; a second chamber comprising loading tables, on which a plurality of substrates are to be loaded; a first transfer device comprising a plurality of blades configured to hold a plurality of substrates in a lengthwise direction thereof, and configured to transfer a plurality of substrates loaded on the loading tables of the first chamber to the loading tables of the second chamber with the substrates held at the same height; a substrate sensor provided on paths, along which the blades enter the second chamber, and configured to detect a substrate held by the blades; and a controller configured to control the first transfer device.

A conveying mechanism includes a suction part that has a suction pad and sucks and holds a target object by the suction pad, a bracket connected to the suction part through a joint that is swingable, an elastic component in which one end part is fixed to the suction part and the other end part is fixed to the bracket, a negative pressure control unit that controls generation of a negative pressure at the suction part, and a movement unit that moves the bracket. The elastic component permits a swing of the suction part according to tilt or deformation of the target object that is sucked and held and, when suction holding of the target object is released, the elastic component returns the orientation of the suction pad to a predetermined orientation when the suction pad is not sucking and holding the target object.

A conveying mechanism includes a suction part that has a suction pad and sucks and holds a target object by the suction pad, a bracket connected to the suction part through a joint that is swingable, an elastic component in which one end part is fixed to the suction part and the other end part is fixed to the bracket, a negative pressure control unit that controls generation of a negative pressure at the suction part, and a movement unit that moves the bracket. The elastic component permits a swing of the suction part according to tilt or deformation of the target object that is sucked and held and, when suction holding of the target object is released, the elastic component returns the orientation of the suction pad to a predetermined orientation when the suction pad is not sucking and holding the target object.

A semiconductor manufacturing apparatus includes one or more process modules, a scheduler, and a transfer controller. A product wafer of a lot that is transferred from a load port to one of the one or more process modules is replenished such that a total number of wafers that are simultaneously processed in the one or more process modules becomes N. When an advance lot being processed and a post lot to be processed subsequent to the advance lot have a same processing condition, the scheduler creates the transfer plan to replenish with the product wafer of the post lot instead of a dummy wafer such that the transfer controller transfers the product wafer and the dummy wafer to the one or more process modules according to the created transfer plan.

A semiconductor manufacturing apparatus includes one or more process modules, a scheduler, and a transfer controller. A product wafer of a lot that is transferred from a load port to one of the one or more process modules is replenished such that a total number of wafers that are simultaneously processed in the one or more process modules becomes N. When an advance lot being processed and a post lot to be processed subsequent to the advance lot have a same processing condition, the scheduler creates the transfer plan to replenish with the product wafer of the post lot instead of a dummy wafer such that the transfer controller transfers the product wafer and the dummy wafer to the one or more process modules according to the created transfer plan.

A method includes providing a rail, a first conveying unit movably mounted on the rail, and a central controller configured to control the first conveying unit; displacing the first conveying unit along the rail at a first speed; obtaining a first vibration measurement upon the displacement of the first conveying unit along the rail at the first speed; analyzing the first vibration measurement; transmitting a first signal based on the analysis of the first vibration measurement to the central controller; providing a second conveying unit movably mounted on the rail; transmitting a first feedback signal based on the first signal from the central controller to the second conveying unit; and displacing the second conveying unit along the rail at a second speed based on the first feedback signal.

A method includes providing a rail, a first conveying unit movably mounted on the rail, and a central controller configured to control the first conveying unit; displacing the first conveying unit along the rail at a first speed; obtaining a first vibration measurement upon the displacement of the first conveying unit along the rail at the first speed; analyzing the first vibration measurement; transmitting a first signal based on the analysis of the first vibration measurement to the central controller; providing a second conveying unit movably mounted on the rail; transmitting a first feedback signal based on the first signal from the central controller to the second conveying unit; and displacing the second conveying unit along the rail at a second speed based on the first feedback signal.

A carrier spacer includes an annular main body, a first tapered part formed on an inner peripheral part of a front surface of the main body, a second tapered part formed on the inner peripheral part of a reverse surface of the main body, a flat surface formed on the outer peripheral side of the first tapered part on the front surface of the main body and holding the reverse surface of the outer peripheral part of a semiconductor wafer, a peripheral edge part formed on the outer peripheral side of the flat surface of the main body and provided with a step having a height position higher than a height position of the flat surface, an arcuate cutout part formed from the peripheral edge part to the flat surface of the main body, and a pair of handles protruding from the peripheral edge part toward the outer peripheral side.