A method includes providing a rail, a first conveying unit movably mounted on the rail, and a central controller configured to control the first conveying unit; displacing the first conveying unit along the rail at a first speed; obtaining a first vibration measurement upon the displacement of the first conveying unit along the rail at the first speed; analyzing the first vibration measurement; transmitting a first signal based on the analysis of the first vibration measurement to the central controller; providing a second conveying unit movably mounted on the rail; transmitting a first feedback signal based on the first signal from the central controller to the second conveying unit; and displacing the second conveying unit along the rail at a second speed based on the first feedback signal.

A transfer machine that charges a substrate contained in a substrate container to a substrate holder; a drive member that operates the transfer machine; and an operation controller that monitors whether a torque value detected from the drive member is kept within a torque limit value of the transfer machine by comparing the torque value with the torque limit value which is set individually for each of an interference area and a non-interference area excluding the interference area relative to conveyance operation in which the transfer machine is moved toward at least one of the substrate container and the substrate holder. The torque limit value in the non-interference area is set larger than the torque limit value in the interference area where a part of the transfer machine interferes with at least one of the substrate container and the substrate holder.

A teaching method according to an embodiment is for a transfer device including a substrate holding unit including a suction port for holding a substrate by applying suction, an actuation mechanism for moving the substrate holding unit, and a pressure detecting unit for detecting a pressure in a suction path communicating with the suction port. The method includes: moving the substrate holding unit under the substrate; moving the substrate holding unit upward toward the substrate, while applying suction to the suction path and detecting the pressure in the suction path; determining whether or not the substrate holding unit has touched the substrate, based on the pressure in the suction path; and storing, as a standard position, a position of the substrate holding unit at a time of determining that the substrate holding unit has touched the substrate.

Substrate holding hand attached to hand tip portion of manipulator and configured to hold substrate having circular plate shape and placed in vertical or inclined postures, including: base plate spreading from base toward tip end sides, part of base plate located at base end side, fixed to hand tip portion, holding position at base plate; engaging claw at part of base plate located at tip end side, engaging claw configured to engage part of edge of substrate in vertical or inclined postures, part of edge located lower than center of substrate; moving portion at base end side of holding position and configured to move toward tip end side; and plurality of rotating bodies at the moving portion, being pressed by movement against edge of substrate located lower than holding position and engaged with claw, and plurality of rotating bodies pushing substrate upward holding position while rotating along edge of substrate.

Substrate holding hand attached to hand tip portion of manipulator and configured to hold substrate having circular plate shape and placed in vertical or inclined postures, including: base plate spreading from base toward tip end sides, part of base plate located at base end side, fixed to hand tip portion, holding position at base plate; engaging claw at part of base plate located at tip end side, engaging claw configured to engage part of edge of substrate in vertical or inclined postures, part of edge located lower than center of substrate; moving portion at base end side of holding position and configured to move toward tip end side; and plurality of rotating bodies at the moving portion, being pressed by movement against edge of substrate located lower than holding position and engaged with claw, and plurality of rotating bodies pushing substrate upward holding position while rotating along edge of substrate.

To provide a transfer chamber capable of replacing a chemical filter without affecting an internal atmosphere, and shortening or eliminating stop time of a transfer process of a wafer (W) associated with replacement of the chemical filter.

The transfer chamber transfers the wafer (W) to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL1) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) provided in the midstream of the circulation path (CL1), and a connecting and disconnecting means (8) which switches connection and disconnection of the chemical filter unit (7) to and from the circulation path (CL1).

To provide a transfer chamber capable of replacing a chemical filter without affecting an internal atmosphere, and shortening or eliminating stop time of a transfer process of a wafer (W) associated with replacement of the chemical filter.

The transfer chamber transfers the wafer (W) to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL1) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) provided in the midstream of the circulation path (CL1), and a connecting and disconnecting means (8) which switches connection and disconnection of the chemical filter unit (7) to and from the circulation path (CL1).

Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. The mounting member of the present invention includes an aggregate of carbon nanotubes for forming a mounting surface, wherein when the mounting member is placed on a silicon wafer so that a carbon nanotube aggregate-side surface thereof is brought into contact with the silicon wafer, and the resultant is left to stand for 30 seconds while a load of 100 g is applied from above the mounting member, a number of particles each having a diameter of 0.2 m or more transferred onto the silicon wafer is 100 particles/cm.sup.2 or less.

Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. The mounting member of the present invention includes an aggregate of carbon nanotubes for forming a mounting surface, wherein when the mounting member is placed on a silicon wafer so that a carbon nanotube aggregate-side surface thereof is brought into contact with the silicon wafer, and the resultant is left to stand for 30 seconds while a load of 100 g is applied from above the mounting member, a number of particles each having a diameter of 0.2 m or more transferred onto the silicon wafer is 100 particles/cm.sup.2 or less.

A substrate processing method includes processing a substrate, which has a first main surface to which a protection tape is attached, from a side of a second main surface thereof, which is opposite from the first main surface; and transferring the substrate in a state that an electrostatic supporter configured to be attracted by an electrostatic attraction force is connected to the substrate after being processed in the processing of the substrate. Since the substrate after being processed is transferred in the state that the electrostatic supporter is connected thereto, weakness of the substrate can be supported by the electrostatic supporter, so that deformation or damage of the substrate during the transfer thereof can be suppressed.