A device for treating substrates has a separation system, with which processed substrates can be separated into one or more waste parts and at least one blank. The device for treating substrates offers improved flexibility. The separation system comprises a transport cylinder and a stripping cylinder associated therewith. The transport cylinder is able to secure replaceable packing, along with first and second openings which, when the packing is secured, are covered at least partially by perforations that may be formed in the packing. A first air supply supplies air to the first openings and a second air supply supplies air to the second openings independently of the supply of the air to the first openings. The first and the second air supply are switchable between a suction air supply and a blower air supply.

An image forming system includes: an image forming apparatus configured to form an image on a recording medium; a post-processing apparatus configured to perform post-processing on the recording medium on which an image is formed by the image forming apparatus; a relay apparatus having a function of changing a transport speed of the recording medium on which an image is formed by the image forming apparatus to a transport speed of the post-processing apparatus and transporting the recording medium to a subsequent stage; and a charge eliminating apparatus configured to perform charge elimination on the recording medium that is charged, by reducing a charge amount of the charged recording medium, and the charge eliminating apparatus is provided at a stage that is after the relay apparatus and before the post-processing apparatus.

Machines are provided for removing masking from regions of glazing panes. Also provided are methods of removing masking from regions of glazing panes. The machines can include a head assembly and a processing station. The head assembly can have various combinations and/or configurations of features, including one or more of a plurality of cutters, a plurality of belts, and at least one pressurized gas nozzle.

Machines are provided for removing masking from regions of glazing panes. Also provided are methods of removing masking from regions of glazing panes. The machines can include a head assembly and a processing station. The head assembly can have various combinations and/or configurations of features, including one or more of a plurality of cutters, a plurality of belts, and at least one pressurized gas nozzle.

Provided is a method for releasing a resin film which is capable of mechanically easily releasing without laser irradiation to the resin film formed on a supporting substrate, or without carrying out the complicated step of partially forming an adhesive layer or a release layer. Preparation for separation is made for separating a supporting substrate into a first part and a second part (S3). In a state in which the resin film comes into intimate contact (adhesion) with a surface of the second part of the supporting substrate, the first part of the supporting substrate and at least an end edge on a side of the first part of the second part are relatively moved so as to be spaced from each other in a vertical direction to the surface (S4). Afterwards, by a blowing tool in a parallel direction to the supporting substrate and in a widthwise direction of the resin film, a flowing force with a gas or a liquid at a constant pressure is applied to an end part of an intimate contact (adhered) surface between a resin film exposed by a partial release of the resin film and the first part of the supporting substrate (S5).

A resin film is released from a supporting substrate without using light irradiation, with ease, and without damaging the resin film or the like. Preparation for separating the supporting substrate on which the resin film is cohesively formed into a first part and a second part; and at least one of the first part and the second part is allowed or caused to move in a direction parallel to an one surface of the first part while the first part of the supporting substrate and at least an edge of the second part facing the first part being moved with respect to one another, while a close contact between the resin film and an one surface of the second part of the supporting substrate being maintained, such that the first part and the edge of the second part are separated along a perpendicular direction to the one surface of the first part.

A device for processing substrates improves processing quality during separation or punching of such substrates. The device has a first processing cylinder and a second processing cylinder for treating substrates, and between which the substrate can be inserted. The substrate undergoes processing as it passes through the cylinder nip between the processing cylinders by use of tool parts that are active therein, and which may be chosen from a group composed of cutting tools, punching tools, creasing tools, perforating tools and grooving tools. The first processing cylinder has a sheet holding system and one of the first processing cylinder and the second processing cylinder has a tool carrier for receiving a tool part. An impression cylinder, which is in surface contact with the second processing cylinder, is assigned to the second processing cylinder, on the side thereof that faces away from the first processing cylinder.

A device for processing substrates improves processing quality during separation or punching of such substrates. The device has a first processing cylinder and a second processing cylinder for treating substrates, and between which the substrate can be inserted. The substrate undergoes processing as it passes through the cylinder nip between the processing cylinders by use of tool parts that are active therein, and which may be chosen from a group composed of cutting tools, punching tools, creasing tools, perforating tools and grooving tools. The first processing cylinder has a sheet holding system and one of the first processing cylinder and the second processing cylinder has a tool carrier for receiving a tool part. An impression cylinder, which is in surface contact with the second processing cylinder, is assigned to the second processing cylinder, on the side thereof that faces away from the first processing cylinder.

The present invention relates to a device for treating substrates which device is modular and versatile in use. The device for treating substrates comprises a feeder and one or more first sub-structure modules which each comprise a pressure cylinder with devices for fixing a lift and a sheet-conveying device and one or more second sub-structure modules which respectively have a transport cylinder with openings formed on the cover surface thereof, and having devices for fixing a lift and a sheet conveying device. All of the first or second sub-structure modules have the same intersection point for connecting the sub-structure modules on one of the inlet and the exit side and they all can be equipped with an attachment module.

The present invention relates to a device for treating substrates which device is modular and versatile in use. The device for treating substrates comprises a feeder and one or more first sub-structure modules which each comprise a pressure cylinder with devices for fixing a lift and a sheet-conveying device and one or more second sub-structure modules which respectively have a transport cylinder with openings formed on the cover surface thereof, and having devices for fixing a lift and a sheet conveying device. All of the first or second sub-structure modules have the same intersection point for connecting the sub-structure modules on one of the inlet and the exit side and they all can be equipped with an attachment module.