A yarn tensioner is designed for adjusting tension in a running yarn. The yarn tensioner includes a rotatable tension wheel having opposing yarn-contacting surfaces formed along an annular region thereof and configured to frictionally contact opposite sides of the running yarn such that the running yarn causes rotational movement of the tension wheel. An elongated wheel shaft is directly affixed to the tension wheel. A tension adjustment assembly frictionally contacts the wheel shaft, and creates select rotation resistance between adjacent parts of the assembly and the wheel shaft such that rotation of the tension wheel is adjustably frictionally controlled, thereby adjusting tension in the running yarn.

A yarn tensioner is designed for adjusting tension in a running yarn. The yarn tensioner includes a rotatable tension wheel having opposing yarn-contacting surfaces formed along an annular region thereof and configured to frictionally contact opposite sides of the running yarn such that the running yarn causes rotational movement of the tension wheel. An elongated wheel shaft is directly affixed to the tension wheel. A tension adjustment assembly frictionally contacts the wheel shaft, and creates select rotation resistance between adjacent parts of the assembly and the wheel shaft such that rotation of the tension wheel is adjustably frictionally controlled, thereby adjusting tension in the running yarn.

Provided is a strap guide including: a first module including a first base, a strap boss formed on the first base and including a first slot through which a strap passes, and at least one protrusion accommodation part located at an outer circumferential portion of the strap boss and including a bore; and a second module having a second base, a second slot formed in the second base, and at least one coupling protrusion located at an outer circumferential portion of the second slot and configured to form a pair with the protrusion accommodation part, wherein the first module and the second module are coupled to form an opening having a single closed surface.

Provided is a strap guide including: a first module including a first base, a strap boss formed on the first base and including a first slot through which a strap passes, and at least one protrusion accommodation part located at an outer circumferential portion of the strap boss and including a bore; and a second module having a second base, a second slot formed in the second base, and at least one coupling protrusion located at an outer circumferential portion of the second slot and configured to form a pair with the protrusion accommodation part, wherein the first module and the second module are coupled to form an opening having a single closed surface.

A system includes a trailer frame, a lifting mechanism coupled to the trailer frame, wherein the lifting mechanism is configured to raise or lower a coil of pipe or a reel of pipe, a braking mechanism configured to apply pressure to the pipe while the pipe is being deployed by the system, and a hydraulic power unit configured to hydraulically power the system.

A system includes a trailer frame, a lifting mechanism coupled to the trailer frame, wherein the lifting mechanism is configured to raise or lower a coil of pipe or a reel of pipe, a braking mechanism configured to apply pressure to the pipe while the pipe is being deployed by the system, and a hydraulic power unit configured to hydraulically power the system.

There is provided a shield plate fabrication apparatus capable of fabricating a shield plate easily. The shield plate is included in a sample milling apparatus which mills a sample by shielding a part of the sample with the shield plate and irradiating the sample with a charged particle beam. The fabrication apparatus includes: a base plate holding shaft for rotatably holding a base plate and winding tape around the base plate; and a tension mechanism for applying tension to the tape while it is being wound around the base plate.

There is provided a shield plate fabrication apparatus capable of fabricating a shield plate easily. The shield plate is included in a sample milling apparatus which mills a sample by shielding a part of the sample with the shield plate and irradiating the sample with a charged particle beam. The fabrication apparatus includes: a base plate holding shaft for rotatably holding a base plate and winding tape around the base plate; and a tension mechanism for applying tension to the tape while it is being wound around the base plate.

An electroplating method for producing magnetic conducting materials, such as charging coils used in induction charging of electronic devices, comprising the following steps: constant tension releasing conducting material, such as cooper wire, the conducting material then undergo these process: alkaline washing then clean water washing, degreasing, acidic washing then clean water washing, continuous plating, clean water washing, drying, infrared measuring the diameter and retracting the conducting material. The method allows electroplating preparation of uniform and dense distribution of iron and nickel coating layer on the surface of conducting material, wherein, the thickness of the coating layer is 210 m. Since the conducting material is non-magnetic, but through the electroplating preparation, the entire charging coil is magnetized to become magnetic material, which when used during induction charging provides the coil with electro resistance that reducing high-frequency skin effect and improving electro induction.

Apparatus for aligning magnetic wire aligns magnetic wires on a wire alignment substrate along its base lines, which are positions the magnetic wires are aligned with, with a small interval and without inducing torsional stresses. A microscope is used to detect misplacement between the base line and a reference line that is the magnetic wire taking a form of a straight line under application of tensile force and pulled out by a wire chuck. The misplacement is corrected using a position adjustment device of a substrate attaching base to which the wire alignment substrate is attached. The magnetic wires are temporarily fixed to the wire alignment substrate by magnetic power, and then permanently fixed to the wire alignment substrate using resin while free from the torsional stresses.