A system for a semiconductor fabrication facility includes a manufacturing tool including a load port, a maintenance tool including a first track and at least one maintenance crane on the first track, a rectangular zone overlapping with the load port, a plurality of first sensors on the first track and at corners of the rectangular zone configured to detect a location of the maintenance crane and generate a first location date, a transporting tool including a second track and a OHT vehicle on the second track, at least a second sensor on the OHT vehicle and configured to generate a second location data, at least a third sensor on the load port, and a control unit configured to receive the first location data and the second location data, and send signals to the second sensor and the third sensor or to cut off the signal to the second sensor.

A system for a semiconductor fabrication facility includes a manufacturing tool including a load port, a maintenance tool including a first track and at least one maintenance crane on the first track, a rectangular zone overlapping with the load port, a plurality of first sensors on the first track and at corners of the rectangular zone configured to detect a location of the maintenance crane and generate a first location date, a transporting tool including a second track and a OHT vehicle on the second track, at least a second sensor on the OHT vehicle and configured to generate a second location data, at least a third sensor on the load port, and a control unit configured to receive the first location data and the second location data, and send signals to the second sensor and the third sensor or to cut off the signal to the second sensor.

An apparatus for a semiconductor fabrication facility (FAB) is provided. In one embodiment, the apparatus includes a maintenance tool and a transporting tool configured to transport at least one customized. The maintenance tool includes a first track at a first horizontal plane, at least one maintenance crane movably mounted on the first track, and a plurality of first sensors on the first track. The first sensors are configured to define at least a danger zone and to detect a location of the maintenance crane. The transporting tool includes a second track at a second horizontal plane, at least one overhead hoisting transporting (OHT) vehicle movably mounted on the second track, and at least one second sensor on the OHT vehicle. The second horizontal plane is different from the first horizontal planes. The first horizontal plane and the second horizontal plane at least partially overlap each other from a plane view.

An apparatus for a semiconductor fabrication facility (FAB) is provided. In one embodiment, the apparatus includes a maintenance tool and a transporting tool configured to transport at least one customized. The maintenance tool includes a first track at a first horizontal plane, at least one maintenance crane movably mounted on the first track, and a plurality of first sensors on the first track. The first sensors are configured to define at least a danger zone and to detect a location of the maintenance crane. The transporting tool includes a second track at a second horizontal plane, at least one overhead hoisting transporting (OHT) vehicle movably mounted on the second track, and at least one second sensor on the OHT vehicle. The second horizontal plane is different from the first horizontal planes. The first horizontal plane and the second horizontal plane at least partially overlap each other from a plane view.

The shoe derailment device for use in derailing a conductor shoe assembly of a bridge crane from a conductor rail assembly generally has a wedge head provided at a longitudinal end of a body made of an electrically insulating material, the shoe derailment device being securable to the conductor rail assembly in a derailment position in which the shoe derailment device is positioned outside an operating zone of the bridge crane, with the wedge head facing the operating zone in a manner that if the conductor shoe assembly is moved outside the operating zone, into the area occupied by the shoe derailment device, the conductor shoe assembly is derailed from the conductor rail assembly as the conductor shoe assembly engages the wedge head and is maintained in a derailed state by the electrically insulating material when the conductor shoe assembly is engaged with the body.

The shoe derailment device for use in derailing a conductor shoe assembly of a bridge crane from a conductor rail assembly generally has a wedge head provided at a longitudinal end of a body made of an electrically insulating material, the shoe derailment device being securable to the conductor rail assembly in a derailment position in which the shoe derailment device is positioned outside an operating zone of the bridge crane, with the wedge head facing the operating zone in a manner that if the conductor shoe assembly is moved outside the operating zone, into the area occupied by the shoe derailment device, the conductor shoe assembly is derailed from the conductor rail assembly as the conductor shoe assembly engages the wedge head and is maintained in a derailed state by the electrically insulating material when the conductor shoe assembly is engaged with the body.

An apparatus for a semiconductor fabrication facility (FAB) is provided. In one embodiment, the apparatus includes a maintenance tool and a transporting tool configured to transport at least one customized. The maintenance tool includes a first track at a first horizontal plane, at least one maintenance crane movably mounted on the first track, and a plurality of first sensors on the first track. The first sensors are configured to define at least a danger zone and to detect a location of the maintenance crane. The transporting tool includes a second track at a second horizontal plane, at least one overhead hoisting transporting (OHT) vehicle movably mounted on the second track, and at least one second sensor on the OHT vehicle. The second horizontal plane is different from the first horizontal planes. The first horizontal plane and the second horizontal plane at least partially overlap each other from a plane view.

An apparatus for a semiconductor fabrication facility (FAB) is provided. In one embodiment, the apparatus includes a maintenance tool and a transporting tool configured to transport at least one customized. The maintenance tool includes a first track at a first horizontal plane, at least one maintenance crane movably mounted on the first track, and a plurality of first sensors on the first track. The first sensors are configured to define at least a danger zone and to detect a location of the maintenance crane. The transporting tool includes a second track at a second horizontal plane, at least one overhead hoisting transporting (OHT) vehicle movably mounted on the second track, and at least one second sensor on the OHT vehicle. The second horizontal plane is different from the first horizontal planes. The first horizontal plane and the second horizontal plane at least partially overlap each other from a plane view.

In a transport system, when transporting a suspension means other than at the time of dynamic lift-off when a package is lifted or other than at the time of landing when the package is placed, a third control means executes holding control to perform holding by a holding means, a first control means executes torque control to lower the suspension means when the load increases and to hoist the suspension means when the load decreases, at the time of dynamic lift-off when the package is lifted from the placement surface, or at the time of landing when the package is placed on the placement surface, the third control means executes release control to release the holding by the holding means, and the first control means executes the height control in which the hoisting machine is actuated to control moving the holding means to the target height.

In a transport system, when transporting a suspension means other than at the time of dynamic lift-off when a package is lifted or other than at the time of landing when the package is placed, a third control means executes holding control to perform holding by a holding means, a first control means executes torque control to lower the suspension means when the load increases and to hoist the suspension means when the load decreases, at the time of dynamic lift-off when the package is lifted from the placement surface, or at the time of landing when the package is placed on the placement surface, the third control means executes release control to release the holding by the holding means, and the first control means executes the height control in which the hoisting machine is actuated to control moving the holding means to the target height.