An aluminum boat hoist carrier is configured to lift a vessel above a ground surface. The boat hoist carrier has a first aluminum c-channel having a first plurality of block attachment openings, at least one first channel grease opening, a first plurality of structure attachment openings, and a second plurality of structure attachment openings. Two billet aluminum pillow blocks are attached to the first and second plurality of structure attachment openings. A second c-aluminum channel has a second plurality of block attachment openings, at least one second aluminum channel grease opening, a third plurality of structure attachment openings attached to the first billet aluminum pillow block, and a fourth plurality of structure attachment openings attached to the second billet aluminum pillow block.

A line roller assembly is provided including a base assembly including a clamping assembly configured to clamp the base assembly to a parapet wall surrounding a roof of a structure or other installation, a carriage assembly slidably mounted on the base assembly, said carriage assembly including at least one arm including a roller at a distal end, said carriage assembly movable between at least one extended position and a medial position, and said at least one roller includes a groove configured to receive a line for aiding the line over the parapet wall, wherein in the at least one extended position the at least one arm extends a pre-determined distance over an edge of an outer wall of the structure or the at least one arm extends a pre-determined distance over an inner edge of the parapet wall of the structure over the roof.

A line roller assembly is provided including a base assembly including a clamping assembly configured to clamp the base assembly to a parapet wall surrounding a roof of a structure or other installation, a carriage assembly slidably mounted on the base assembly, said carriage assembly including at least one arm including a roller at a distal end, said carriage assembly movable between at least one extended position and a medial position, and said at least one roller includes a groove configured to receive a line for aiding the line over the parapet wall, wherein in the at least one extended position the at least one arm extends a pre-determined distance over an edge of an outer wall of the structure or the at least one arm extends a pre-determined distance over an inner edge of the parapet wall of the structure over the roof.

A method and an extraction system for extracting an electronic device from a container filled with an immersion cooling liquid are disclosed. The extraction system includes a lifting device for lifting the electronic device from an open end of the container, a liquid dispersing device for dispersing immersion cooling liquid from the electronic device by generating an air flow, and a nozzle configured to be positioned above the open end of the container to limit a spread of immersion cooling liquid caused by the liquid dispersing device.

A method and an extraction system for extracting an electronic device from a container filled with an immersion cooling liquid are disclosed. The extraction system includes a lifting device for lifting the electronic device from an open end of the container, a liquid dispersing device for dispersing immersion cooling liquid from the electronic device by generating an air flow, and a nozzle configured to be positioned above the open end of the container to limit a spread of immersion cooling liquid caused by the liquid dispersing device.

A heat sink for collecting thermal energy from a heat generating component. The heat sink comprises a base comprising a thermal transfer surface configured to be placed in thermal contact with the heat-generating component, an external surface opposite from the thermal transfer surface and an inlet side of the base extending between an edge of the thermal transfer surface and an edge of the external surface and a plurality of fins extending from the external surface. The fins define a plurality of fin passages therebetween, at least one fin of the plurality of fins having non-straight longitudinal edges extending along the external surface and defining at least in part at least one non-straight fin passage.

A rack system for housing an electronic device comprising: an immersion case configured to provide housing to the electronic device, and to receive an immersion cooling liquid, wherein the immersion case includes a drainage opening, wherein the drainage opening is configured to remove at least a part of the immersion cooling liquid from the immersion case, based on a user actuated action, during a de-racking operation of the immersion case; and a rack frame configured to slidably accommodate racking and de-racking operations of the immersion case.

A rack system for housing an electronic device comprises an immersion case configured to provide housing to the electronic device. The immersion case includes a first wall, and a second wall. The first wall and the second wall define means for controlling deformation of the immersion case, such that when an immersion cooling liquid is inserted in the immersion case, the means for controlling deformation limit the deformation of the immersion case.

A rack system for use, e.g., in data centers is disclosed. The rack system includes a rack frame and a rack-mounted assembly, including an electronic device disposed within the rack-mounted assembly, the electronic device including a heat-generating component. The heat-generating component is in thermal contact with a liquid cooling block through which a channelized cooling fluid is conveyed. The electronic device is immersed in a dielectric immersion cooling liquid. The rack-mounted assembly includes a non-sealed immersion case in which the electronic device is immersed in the dielectric immersion cooling liquid, the non-sealed immersion case configured to permit the rack-mounted assembly to be individually inserted into or removed from the rack frame. Also disclosed are container-based data center modules based on the disclosed rack system, and a data center using numerous such container-based modules.

A cooling device mountable on an electronic component comprising: a body having an internal fluid conduit for allowing a heat-transfer fluid to flow therethrough. The body comprises a first surface configured for mounting on the electronic component and permitting thermal transfer therethrough; a second surface; at least one side wall extending between the first surface and the second surface; and a gasket extending along the at least one side wall or a perimeter of the first surface, the gasket configured to extend away from the body beyond the first surface in a direction transverse thereto, to fluidly insulate the first surface when the first surface is mounted on the electronic component and submerged in the immersion cooling liquid in use.