A physical quantity sensor includes: a base substrate; a movable portion; a plurality of movable electrode fingers which are provided in the movable portion; a fixed electrode finger which is provided on the base substrate; and a fixing portion which fixes the movable portion to the base substrate. In the movable electrode fingers, a movable electrode finger which opposes the fixing portion in the first direction is included. A clearance between the movable electrode finger and the fixing portion is smaller than a clearance between the movable electrode finger and the fixed electrode finger. The width of the movable electrode finger is greater than the width of other movable electrode finger.

A micro check valve includes a substrate body having a top side and an underside, at least the top side having a sealing bar between a first trough and a second trough. The substrate body also has a passage which leads from the underside of the substrate body to the top side of the substrate body and ends on the top side of the substrate body in the first trough. In addition arranged on the top side of the substrate body is a diaphragm which is mounted flexibly at least in the region of the sealing bar and the first and second troughs. The diaphragm also has at least one through opening arranged above the second trough.

Various embodiments of the present disclosure are directed towards a microelectromechanical system (MEMS) device. The MEMS device includes a first dielectric structure disposed over a first semiconductor substrate, where the first dielectric structure at least partially defines a cavity. A second semiconductor substrate is disposed over the first dielectric structure and includes a movable mass, where opposite sidewalls of the movable mass are disposed between opposite sidewall of the cavity. A first piezoelectric anti-stiction structure is disposed between the movable mass and the first dielectric structure, wherein the first piezoelectric anti-stiction structure includes a first piezoelectric structure and a first electrode disposed between the first piezoelectric structure and the first dielectric structure

A functional device includes a movable body displaceable along a first axis, a fixed section configured to support the movable body in a coupling section, a movable electrode section extending from the movable body, a fixed electrode section arranged to be opposed to the movable electrode section, and an extending section extending from the fixed section and including an opposed section opposed to a side surface of the movable electrode section. The distance between the opposed section and the movable electrode section is smaller than the distance between the fixed electrode section and the movable electrode section.

A microelectromechanical system (MEMS) transducer includes a transducer substrate including an opening; a back plate including a plurality of protrusions oriented substantially perpendicular to the back plate; and a diaphragm between the transducer substrate and the back plate. The diaphragm includes a lead and a plurality of spring members. The lead is structured to suspend the diaphragm over the transducer substrate. The spring members are structured to separate the diaphragm from the transducer substrate and the back plate in the absence of a bias voltage.

Provided are a method for preparing a silicon wafer with a rough surface and a silicon wafer, for solving the problem that a viscous force is likely to be generated when a smooth surface of the silicon wafer approaches another film layer. The method includes: depositing a porous oxide film layer on a surface of the first silicon planar layer that has been subjected to planar planarization, and then etching the porous oxide film layer by XeF.sub.2 vapor etching, during which XeF.sub.2 gas passes through the porous oxide film layer to etch the first silicon planar layer in an irregular way. Therefore, the first silicon planar layer has a greater surface roughness. When the silicon wafer approaches to another film layer, the viscous force generated therebetween is reduced, improving the sensitivity of the MEMS device and reducing the probability of out-of-work MEMS devices.

Various embodiments of the present disclosure are directed towards a microelectromechanical system (MEMS) device. The MEMS device includes a first dielectric structure disposed over a first semiconductor substrate, where the first dielectric structure at least partially defines a cavity. A second semiconductor substrate is disposed over the first dielectric structure and includes a movable mass, where opposite sidewalls of the movable mass are disposed between opposite sidewall of the cavity. A first piezoelectric anti-stiction structure is disposed between the movable mass and the first dielectric structure, wherein the first piezoelectric anti-stiction structure includes a first piezoelectric structure and a first electrode disposed between the first piezoelectric structure and the first dielectric structure.

A method of manufacturing a semiconductor structure includes following operations. A first substrate is provided. A plate is formed over the first substrate. The plate includes a first tensile member, a second tensile member, a semiconductive member between the first tensile member and the second tensile member, and a plurality of apertures penetrating the first tensile member, the semiconductive member and the second tensile member. A membrane is formed over and separated from the plate. The membrane include a plurality of holes. A plurality of conductive plugs passing through the plate or membrane are formed. A plurality of semiconductive pads are formed over the plurality of conductive plugs. The plate is bonded to a second substrate. The second substrate includes a plurality of bond pads, and the semiconductive pads are in contact with the bond pads.

A micromechanical z-inertial sensor. The micromechical z-inertial sensor includes at least one first seismic mass element; and torsion spring elements joined to the first seismic mass element. In each case, first torsion spring elements are connected to a substrate, and second torsion spring elements are connected to the first seismic mass element. A first and a second torsion spring element in each case is joined to one another with the aid of a lever element. The lever element is designed to strike against a stop element.

Systems and methods to reduce stiction in MEMS devices are disclosed. A microelectromechanical system (MEMS) device includes a substrate; a via supported by the substrate, the via comprising a first metal layer comprising a material; an arm extending away from and supported by the via, the arm comprising the material; and a second metal layer within the via on the first metal layer, wherein the second metal layer comprises nitrogen.