A MEM vibration sensor includes a substrate including a first supporting-portion and a cavity and a sensing-device disposed on the substrate. The sensing-device includes a second supporting-portion correspondingly disposed over and connected with the first supporting-portion, a first sensing-unit disposed on the cavity, a first mass-block disposed on the cavity, a second sensing-unit disposed on the first sensing-unit and the first mass-block, a first metal pad disposed on the third supporting-portion and electrically coupled with the first sensing-unit, and a second metal pad disposed on the third supporting-portion and electrically coupled with the second sensing-unit.

A method includes a step of forming a sacrificial layer on a first film, a step of forming a second film on the sacrificial layer, a step of forming an etching opening that extends through at least one of the first film and the second film so as to communicate with the sacrificial layer, and a step of forming a hollow portion by etching the sacrificial layer using a gas containing a fluorine-containing gas and hydrogen via the etching opening, wherein a composition ratio of silicon to nitrogen in a first region having a face in contact with the sacrificial layer is larger than a composition ratio of silicon to nitrogen in a second region not including the first region.

A method for operating a capacitive MEMS sensor. The method includes: supplying a defined electrical potential on a deflectably mounted, seismic mass of the MEMS sensor; capacitively inducing a vibrational motion of the seismic mass with the aid of a clocked electrical control voltage; compensating for fluctuations in the supplied electrical potential on the seismic mass caused by the clocked electrical control voltage, by selectively charging and/or discharging an electrical storage element connected to the seismic mass in accordance with the frequency of the clocked electrical control voltage.

A transducer assembly can include a base. The transducer assembly can include a stress isolation standoff located on the base. The transducer assembly can include a MEMS die disposed on the stress isolation standoff. The transducer assembly can include a die attach adhesive disposed between the MEMS die and the base. The die attach adhesive can bond the MEMS die to the base. The stress isolation standoff can be embedded in the die attach adhesive between the base and the MEMS die.

A diaphragm-based sensor includes a deflectable diaphragm, a base layer opposite the diaphragm, and a corrugated wall extending between the diaphragm and the base layer. The diaphragm is suspended over a cavity enclosed by the diaphragm, the base layer and the corrugated wall. The diaphragm includes a first electrode and the base layer includes a second electrode such that a capacitance between the first and second electrodes changes when the diaphragm is deflected relative to the cavity.

Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device includes an interconnect structure disposed over a semiconductor substrate. A dielectric structure is disposed over the interconnect structure. A plurality of cavities are disposed in the dielectric structure. A microelectromechanical system (MEMS) substrate is disposed over the dielectric structure, where the MEMS substrate comprises a plurality of movable membranes, and where the movable membranes overlie the cavities, respectively. A plurality of fluid communication channels are disposed in the dielectric structure, where each of the fluid communication channels extend laterally between two neighboring cavities of the cavities, such that each of the cavities are in fluid communication with one another.

A light deflector 2 includes: a mirror section 9 that reflects light; a movable frame 8 provided in such a manner as to surround the mirror section 9; a pair of torsion bars 13a and 13b having one end of each torsion bar connected to the mirror section 9 and the other end thereof connected to the movable frame 8 on a Y-axis; and semi-annular piezoelectric actuators 10a and 10b that are provided on the movable frame 8 and rotate the torsion bars 13a and 13b around the Y-axis in a reciprocating manner. The torsion bars 13a and 13b each have a constricted shape in which the transverse width at both end parts is the largest and the transverse width gradually decreases toward the central part thereof in a length direction.

A system of flexural, actuating, and semiconducting elements of part-types necessary to assemble actuated robotic systems. These parts are joined with a common interface, interlocking with neighboring parts to form a regular lattice structure. Primary considerations for the design of the part interfaces include ease of assembly and the ability to transfer mechanical loads and electronic signals to neighboring parts. The parts are designed to be assembled vertically so structures can he built incrementally one part at a time. They can be easily fabricated at a range of length-scales using a variety of two-dimensional manufacturing processes. These processes include, for example, stamping and laminating, which enable high-throughput production. The simple mechanical interfaces between parts also enable disassembly allowing for reconfigurability and reuse. The interlocking nature of these assemblies allows loads to be distributed through many parallel load-paths.

A dual-output microelectromechanical system (MEMS) resonator can be operated selectively and concurrently in an in-plane mode of vibration and an out-of-plane mode of vibration to obtain, respectively, a first electrical signal having a first frequency and a second electrical signal having a second frequency that is less than the first frequency. The first and second electrical signals are mixed to obtain a third electrical signal having a third frequency, where the third frequency is proportional to a temperature of the MEMS resonator. The temperature is determined based on the third frequency. Values of the first and second frequencies can be adjusted based on the determined temperature to compensate for frequency deviations due to temperature deviations. Also described herein are methods and systems for determining the temperature of the dual-output MEMS and for performing frequency compensation, as well as a method of manufacturing the dual-output MEMS.

A force-measuring device (FMD) assembly for a portable electronic apparatus includes a mid-frame including a base portion, a sidewall portion, and a transition region between the base portion and the sidewall portion, and force-measuring devices coupled to the inner surface of the sidewall portion. The sidewall portion and the transition region are elongate along a longitudinal axis. FMDs are coupled to the inner surface at respective contact regions of the sidewall portion and are separated from each other along the longitudinal axis. Each of the FMDs includes strain-sensing element(s). Each of the FMDs corresponds to a respective sense region of the sidewall portion. The transition region includes a respective elongate slit or trough for each of the sense regions. The respective elongate slit or trough is elongate along the longitudinal axis. Adjacent elongate slits or troughs are separated by a respective rib.