The present invention provides a linear actuator. The linear actuator includes: a substrate having a cavity; a first fixed electrode structure fixed on the substrate; an elastic linkage; and a movable electrode structure connected to the substrate through the elastic linkage, wherein: the cavity has a first area; at least one of the first fixed electrode structure and the movable electrode structure has a second projection area on the substrate; and the first area and the second projection area overlap. The linear actuator allows the making of an out-of-plane linear motion motor with a large motion stroke, the robustness of impact, the easy removal of residual process contaminants, an improvement of the efficiency of electrical-to-mechanical energy conversion and the off-axis motion decoupling of movable comb structure.

A micro-electromechanical actuating device is disclosed. The micro-electromechanical actuating device includes a substrate having a cavity having a first area; a fixing portion disposed on the substrate; a first frame disposed around the fixing portion; and an elastic element connecting the first frame and the fixing portion, and causing the first frame to be suspended above the substrate, wherein the first frame has a projecting area onto the substrate; and the first area and the projecting area have an overlapping portion.

A light sensing apparatus is disclosed. The light sensing apparatus, includes a sensor configured for sensing a light; an in-plane motion motor, including a circuit board having a first bottom base with an central cavity and a circuit board frame disposed thereon, wherein the first bottom base has a first bottom surface; a lead frame disposed inside the central cavity and having a second bottom surface; and an in-plane motion actuator having a movable inner frame and a fixed outer frame both allocated in a reference plane, wherein the movable inner frame moves along at least one of two directions perpendicular to each other and parallel to the first bottom surface; and an out-of-plane motion motor, including: a base plate having a base plate surface and a base plate frame disposed on a periphery of the base plate surface; four single-axis actuators disposed on the base plate surface, each of which has an actuating end, and each of which moves the respective actuating end along a direction perpendicular to the base plate surface, wherein the first bottom surface is attached to the base plate frame, and the second bottom surface is attached to the four actuating ends.

The present invention provides a tunable spectrum sensing device. The tunable spectrum sensing device includes: a device body; an out-of-plane motion motor mounted on the device body and including: a base having a normal direction; and a single-axis actuator having a motion direction parallel to the normal direction, and including: a substrate with an electronic element; and an actuating end driven by the electronic element; a first glass mounted on and moved by the actuating end; and a second glass mounted on the device body. The out-of-plane motion motor can keep an object at a specific rotation angle, position the object at a specific out-of-plane displacement or be programmed for the object to perform a specific scan trajectory motion. The out-of-plane motion motor also has a large motion stroke, and thus, there is no need to use multiple tunable spectrum sensing devices to satisfy the spectral bandwidth requirement.

A reflector device is provided in the present disclosure, and includes a base, a first single-axis motion motor, a fulcrum structure and a reflector. The base includes a base plate having a base plate surface. The first single-axis motion motor is disposed on the base plate surface, and has a motion direction parallel to a normal direction of the base plate surface. The fulcrum structure is disposed on the base plate surface. The reflector has a first and a second ends connected with the first single-axis motion motor and the fulcrum structure respectively.

A method for manufacturing an apparatus having in-plane and out-of-plane motions is provided. The method includes the steps of providing an in-plane motion motor capable of moving in a first set of three degrees of freedom with respect to a reference plane for mounting thereon a functional device for performing the application function; providing an out-of-plane motion motor having a base plate surface and supporting thereon the in-plane motion motor; and providing four single-axis motors in the out-of-plane motion motor, wherein: each of the four single-axis motors has a single-axis actuator having an actuating end, a planar surface and a side surface; the side surface is attached to the base plate surface; and the four single-axis motors cooperatively enable the reference plane to be capable of moving in a second set of three degrees of freedom, wherein the first set of three degrees of freedom are all different from the second set of three degrees of freedom.

A micro electrical mechanical systems (MEMS) device includes a flexible membrane disposed over a substrate, and a first backplate disposed over the flexible membrane. The first backplate includes a first plurality of bumps facing the flexible membrane. The MEMS device further includes a plurality of features disposed at the flexible membrane, where each of the plurality of features being associated with a corresponding one of the first plurality of bumps.

Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. A two-fold symmetric switch may be formed by a primary, secondary, and optionally tertiary set of voids formed in the movable plate. These voids may define the spring beams which provide a stable and reliable restoring force to the switch.

Embodiments of a packaged electronic device and method of fabricating such a device are provided, where the packaged electronic device includes: a pressure sensor die having a diaphragm on a front side; an encapsulant material that encapsulates the pressure sensor die, wherein the front side of the pressure sensor die is exposed at a first major surface of the encapsulant material; an interconnect structure formed over the front side of the pressure sensor die and the first major surface of the encapsulant material, wherein an opening through the interconnect structure is generally aligned to the diaphragm; and a cap attached to an outer dielectric layer of the interconnect structure, the cap having a vent hole generally aligned with the opening through the interconnect structure.

Embodiments of a packaged electronic device and method of fabricating such a device are provided, where the packaged electronic device includes: a pressure sensor die having a diaphragm on a front side; an encapsulant material that encapsulates the pressure sensor die, wherein the front side of the pressure sensor die is exposed at a first major surface of the encapsulant material; an interconnect structure formed over the front side of the pressure sensor die and the first major surface of the encapsulant material, wherein an opening through the interconnect structure is generally aligned to the diaphragm; and a cap attached to an outer dielectric layer of the interconnect structure, the cap having a vent hole generally aligned with the opening through the interconnect structure.