An electromechanical microsystem including an electromechanical transducer, a deformable diaphragm and a cavity hermetically containing a deformable medium keeping a constant volume under the action of an external pressure change. The deformable diaphragm forms a wall of the cavity and has at least one free area so as to be elastically deformed. The electromechanical transducer is configured so that its movement depends on the change in the external pressure, and vice versa. The free area cooperates with an external member so that its deformation induces, or is induced by, a movement of the external member. Thus, the electromechanical microsystem is adapted to displace the external member or to detect a movement of this member, the electromechanical microsystem includes at least one pin, configured to bear on a peripheral portion of the free area so that a deformation of the free rea causes an inclination of the pin.

A microelectromechanical system (MEMS) sensor includes a MEMS layer that includes fixed and movable electrodes. In response to an in-plane linear acceleration, the movable electrodes move with respect to the fixed electrodes, and acceleration is determined based on the resulting change in capacitance. A plurality of auxiliary electrodes are located on a substrate of the MEMS sensor and below the MEMS layer, such that a capacitance between the MEMS layer and the auxiliary loads changes in response to an out-of-plane movement of the MEMS layer or a portion thereof. The MEMS sensor compensates for the acceleration value based on the capacitance sensed by the auxiliary electrodes.

Embodiments of a packaged electronic device and method of fabricating such a device are provided, where the packaged electronic device includes: a pressure sensor die having a diaphragm on a front side; an encapsulant material that encapsulates the pressure sensor die, wherein the front side of the pressure sensor die is exposed at a first major surface of the encapsulant material; an interconnect structure formed over the front side of the pressure sensor die and the first major surface of the encapsulant material, wherein an opening through the interconnect structure is generally aligned to the diaphragm; and a cap attached to an outer dielectric layer of the interconnect structure, the cap having a vent hole generally aligned with the opening through the interconnect structure.

A microelectromechanical device includes: a substrate; a semiconductor die, bonded to the substrate and incorporating a microstructure; an adhesive film layer between the die and the substrate; and a protective layer between the die and the adhesive film layer. The protective layer has apertures, and the adhesive film layer adheres to the die through the apertures of the protective layer.

Embodiments generally relate to drives for microelectromechanical devices for generating a sound pressure that can be implemented in a microelectromechanical system (MEMS). The movable legs of the actuators are connected to one another by means of connecting elements and form a lateral surface, the volume of which can be changed by the movement of the legs to generate a sound pressure.

In accordance with an embodiment, a method producing a microelectromechanical system (MEMS) device includes: providing a substrate comprising a first substrate surface and an opposite second substrate surface, wherein the substrate comprises a sacrificial layer arranged at the first substrate surface; depositing a membrane material layer onto the sacrificial layer; the membrane material layer forms a free-standing membrane structure covering the cavity; and creating nanostructures in at least one of a first membrane surface or an opposite second membrane surface of the membrane material layer, wherein the nanostructures protrude from the respective membrane surface of the membrane material layer, and the nanostructures are created by applying a laser structuring process.

A non-electrical battery can include a backing plate; a plurality of strings disposed in parallel relation on the backing plate, each string comprising a first end and a second end, wherein the first end of each string is attached to the backing plate and each string extends away from the backing plate; and a charging mechanism attached to the second end of each string to apply a force to the strings to increase a potential energy stored by the strings.

In accordance with an embodiment, a MEMS sensor includes a MEMS arrangement having a movable electrode and a stator electrode arranged opposite the movable electrode. The MEMS sensor includes a first bias voltage source, which is connected to the stator electrode and which is configured to apply a first bias voltage to the stator electrode. The MEMS sensor further includes a common-mode read-out circuit connected to the stator electrode by a capacitive coupling and comprising a second bias voltage source, which is configured to apply a second bias voltage to a side of the capacitive coupling that faces away from the stator electrode.

A MEMS device includes at least two masses and at least one spring assembly, each of the spring assemblies including at least two folded-shape springs and at least two connection portions. The folded-shape springs are directly connected to each other at a connection point, and the folded-shape springs are respectively connected to the masses through the corresponding connection portions, for operably driving the masses to move simultaneously inward or outward in a first direction.

An acceleration detection device includes: a substrate including cavity; an anchor mechanically connected to the substrate inside the cavity; a spring mechanically connected to the anchor; a mass mechanically connected to the spring; a first movable electrode mechanically connected to and electrically insulated from the mass; a first fixed electrode mechanically connected to and electrically insulated from the substrate; a pair of second movable electrodes facing each other by being mechanically connected to and electrically insulated from the mass; and a second fixed electrode mechanically connected to and electrically insulated from the substrate to be interposed between the pair of second movable electrodes, the second fixed electrode generating an electrostatic force between the pair of second movable electrodes and the second fixed electrode when a voltage is applied to each of the pair of second movable electrodes and the second fixed electrode.