An inertial sensor such as a MEMS accelerometer or gyroscope has a proof mass that is driven by a self-test signal, with the response of the proof mass to the self-test signal being used to determine whether the sensor is within specification. The self-test signal is provided as a non-periodic self-test pattern that does not correlate with noise such as environmental vibrations that are also experienced by the proof mass during the self-test procedure. The sense output signal corresponding to the proof mass is correlated with the non-periodic self-test signal, such that an output correlation value corresponds only to the proof mass response to the applied self-test signal.

A semiconductor device includes a substrate, a beam, a movable structural body, a first stopper member, a second stopper member and a third stopper member. The first stopper member is arranged with a first gap from the movable structural body in an in-plane direction. The second stopper member is arranged with a second gap from the movable structural body in an out-of-plane direction. The third stopper member is arranged opposite to the second stopper member with the movable structural body interposed therebetween in the out-of-plane direction, and is arranged with a third gap from the movable structural body. Consequently, there can be provided a semiconductor device in which excessive displacement of the movable structural body can be suppressed to thereby suppress damage to and breakage of the beam supporting the movable structural body, and a method of manufacturing the same.

Caging structures are disclosed for caging or otherwise reducing the mechanical shock pulse experienced by MEMS device beam structures during events that may cause mechanical shock to the MEMS device. The caging structures at least partially surround the beam such that they limit the motion of the beam in a direction perpendicular to the beam's longitudinal axis, thereby reducing stress on the beam during a mechanical shock event. The caging structures may be used in combination with mechanical shock-resistant beams.

An acceleration sensor includes a substrate, a support beam, a weight body a stationary section and an engaging section. The weight body is divided into a first weight section and a second weight section based on the support beam as a boundary line, and the first weight section and the second weight section have different weights from each other. The first weight section and the second weight section include a facing section which faces a side of the engaging section opposite to a side facing the support beam. In an X axis direction intersecting the Y axis direction, if a distance between a corner section of the engaging section in the vicinity of one end portion and the support beam is L1 and a distance between the engaging section and the facing section is L2, a relational expression, L1>L2 is satisfied.

An MEMS chip includes a substrate, a movable assembly, a fastening assembly, and a drive assembly. The fastening assembly is located between the substrate and the movable assembly. The movable assembly includes a fastening portion, a movable portion, and a first support beam. The first support beam is connected to the movable portion and the fastening portion. A first avoidance slot is disposed on a face that is of the movable portion and that faces the fastening assembly. The fastening assembly is grounded. A boss and a first position limiting pole are disposed on a face that is of the fastening assembly and that faces the movable assembly. The boss is connected to the fastening portion and configured to support the fastening portion. The first position limiting pole corresponds to the first avoidance slot. The drive assembly is connected to the movable portion to drive the movable portion to move.

Angular accelerometers are described, as are systems employing such accelerometers. The angular accelerometers may include a proof mass and rotational acceleration detection beams directed toward the center of the proof mass. The angular accelerometers may include sensing capabilities for angular acceleration about three orthogonal axes. The sensing regions for angular acceleration about one of the three axes may be positioned radially closer to the center of the proof mass than the sensing regions for angular acceleration about the other two axes. The proof mass may be connected to the substrate though one or more anchors.

Aspects of transducers with feedback transduction are described. One aspect is a transducer system comprising an operational amplifier having an inverting input, a non-inverting input, and an output. The transducer system also includes a piezoelectric microelectromechanical system (MEMS) transducer having a first node and a second node, wherein the first node is coupled to the inverting input of the operational amplifier, and wherein the piezoelectric MEMS transducer is configured to generate an electrical signal across the first node and the second node in response to a signal incident upon the piezoelectric MEMS transducer. The transducer system also includes an attenuator having an input and an output, wherein the input of the attenuator is coupled to the output of the operational amplifier, and wherein the output of the attenuator is coupled to the second node of the piezoelectric MEMS transducer.

An electromechanical device includes a stack formed of an insulating layer interposed between two solid layers, and a micromechanical structure of predetermined thickness suspended above a recess of predetermined depth, the recess and the micromechanical structure forming one of the two solid layers of the stack, and the insulating layer forming the bottom of the recess.

In various embodiments, a measuring arrangement is provided. The measuring arrangement may include a micromechanical sensor including a capacitor, a bridge circuit including a plurality of capacitors, at least one capacitor of which is the capacitor of the micromechanical sensor, an amplifier coupled, on the input side, to an output of the bridge circuit, a DC voltage source configured to provide an electrical DC voltage, a chopper including at least one first charge store and a switch structure, The switch structure is configured to couple the first charge store alternately to the DC voltage and the bridge circuit for the purpose of coupling an electrical mixed voltage into the bridge circuit.

A MEMS micro-mirror device includes a middle substrate, a movable structure, at least one stopper coupled with the movable structure, at least one flexure, an upper cap, and a lower cap. The movable structure includes a micro-mirror plate having a reflective surface. The flexure connects the stopper and the middle substrate. The upper cap, bonded with the middle substrate, has a first opening for allowing the movable structure's movement and has at least one first recess facing a first side of the flexure and a first side of the stopper. The lower cap, bonded with the middle substrate, has a second opening for allowing space for the movement and has at least one second recess facing a second side of the flexure and a second side of the stopper.