A rotation rate sensor having a first structure movable with respect to the substrate, a second structure movable with respect to the substrate and with respect to the first structure, a first drive structure for deflecting the first structure with a motion component parallel to a first axis, and a second drive structure for deflecting the second structure with a motion component parallel to the first axis. The first and second structures are excitable to oscillate in counter-phase, with motion components parallel to the first axis, the first drive structure having a first spring mounted on the substrate to counteract a pivoting of the first structure around an axis parallel to a second axis extending perpendicularly to a principal extension plane, the second drive structure having a second spring mounted on the substrate to counteracts a pivoting of the second structure around a further axis parallel to the second axis.

Micro-electromagnetically actuated latched miniature relay switches formed from laminate layers comprising a spring and magnet, electromagnetic coils, magnetic latching material, and transmission line with contacts. Preferably the miniature relay switches transmit up to about 50 W of DC or AC line power, and carry up to about 10 A of load current, with an overall volume of less than about 100 mm.sup.3. In addition to switching large power, the device preferably requires less than 3 V to actuate, and has a latching feature that retains the switch state after actuation without the need for external applied voltage or current.

The invention relates to a damping system for a mobile mass (2) of a MEMS device (1), the system being capable of preventing direct contact between the mass (2) and a surface element (3) of the MEMS device (1), the damping system comprising: a mechanical bumper (4) positioned between the mass (2) and the surface element (3); a system (5) for locking/unlocking the bumper (4), which comprises one branch (51) oriented towards the bumper (4) having a blocking end (53) and a pin joint (54) capable of pivoting the branch (51), the locking/unlocking system (5) defining two subsequent positions of the mass (2).

The present invention disclosed a micro acoustic collector and CMOS microphone single chip. The micro acoustic collector comprising: a plurality of leaf-shaped structures annularly arranged with symmetry, each of the plurality of leaf-shaped structure having a suspended arm and a restrained arm, and the suspended arm of the plurality of leaf-shaped structures connected to a suspended fulcrum, and a plurality of through-vias formed in the suspended fulcrum and the plurality of leaf-shaped structures; a plurality of support pillars uniformly disposed under edges of the plurality of leaf-shaped structures corresponding to the restrained arms and the suspend arms; and a base metal layer formed under and insulated from the plurality of support pillars, and facing towards the inner-annular-supported acoustic collection film to form a hollow space.

The present invention disclosed a micro acoustic collector with a lateral cavity, comprising: a base metal layer; a movable film, an annular side wall; a lateral metal layer. The movable film faces towards the base metal layer to form a hollow space. The lateral metal layer is formed at a side of the movable film and around the movable film, fixed by the annular side wall and spaced apart from peripheral of the movable film by a distance, and the lateral metal layer faces towards the base metal layer to form a lateral cavity to assist an acoustic collection.

A MEMS microphone includes a substrate defining a cavity, a diaphragm being spaced apart from the substrate, covering the cavity, and configured to generate a displacement of the diaphragm in response to an applied acoustic pressure, an anchor extending from an end portion of the diaphragm, and fixed to an upper surface of the substrate to support the diaphragm and a back plate disposed over the diaphragm, the back plate being spaced apart from the diaphragm such that an air gap is maintained between the back plate and the diaphragm, and defining a plurality of acoustic holes, wherein the anchor has a repetitive concave-convex shape in a direction toward a center of the diaphragm so that the anchor acts as a resistance to an acoustic wave.

There is provided a MOMS sensor comprising a fiber interface comprising a fiber passthrough for one or more optical fibers, a cavity comprising an element hermetically encapsulated within the cavity, wherein the element is movably anchored by SiN arms, which are movable with respect to walls of the cavity, wherein the SiN arms comprise anchor portions at first ends of the SiN arms, which are connected to the element, and at second ends of the SiN arms, which are connected to the walls of the cavity, and the fiber interface is configured to receive the fibers through the fiber passthrough into positions for communications of light between the element and the fibers. In this way a robust structure that supports sensitivity of the sensor is provided.

A compliant structure including a frame and a shuttle distant from the frame mounted on a cantilever that is supported by the frame. The cantilever and shuttle together are movable transversely to and out of a plane of the frame. The structure also includes one or more flexures that connect the cantilever with the frame. The cantilever includes a body at least in part extending in a first direction which points to the shuttle. The one or more flexures connect to the shuttle and/or to the cantilever in the vicinity of the shuttle. The flexures are oriented in a second direction, which second direction is generally transverse with respect to the first direction.

An MEMS sound transducer comprises a first and a second backplate, as well as a diaphragm, which is arranged between the first and the second backplate and is held by an edge fastening between the first and the second backplate. The MEMS sound transducer comprises a clamping structure, which is configured to provide fixing for the diaphragm when an electrostatic force acting in an operating state is applied between the first and the second backplate and at a distance from the edge fastening, and to release the fixing in absence of the electrostatic force.

A micro-electro-mechanical systems (MEMS) terminal structure of board-to-board electrical connector and manufacturing method thereof are provided. The terminal of the terminal structure includes a side arm, a bent portion, and a flexible arm integrally formed as one component. The flexible arm includes a first portion and a second portion. The first portion and the side arm form an insertion space. The second portion and the side arm form a locking space. The second portion of the flexible arm has a contact portion. The insertion space is greater than the locking space. The terminal has curved and locking features to extend the moment arm of the terminal for improving the terminal flexibility. The terminal contacts a mating terminal through multiple points, thereby improving the contact stability and providing the locking function. Furthermore, by using the MEMS techniques for semiconductor industries, the terminal of micro board-to-board electrical connector can be manufactured.