A transduction detection device includes a substrate, at least one movable ground relative to the substrate and a suspended stress gauge provided with a piezoresistive element which includes a first anchoring and a second anchoring, different from the first anchoring, relative to the movable ground, wherein it includes at least one thermal dissipator element thermally conductively connected: to a connection portion of the piezoresistive element located outside of the anchorings, and to a thermal discharge part.

One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operatein effect, heating the MEMS component and optionally related circuitry to a steady-state oven temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).

A MEMS resonator is equipped with a substrate, a moving structure suspended above the substrate in a horizontal plane formed by first and second axes, having first and second arms, parallel to one another and extending along the second axis, coupled at their respective ends by first and second transverse joining elements, forming an internal window. A first electrode structure is positioned outside the window and capacitively coupled to the moving structure. A second electrode structure is positioned inside the window. One of the first and second electrode structures causes an oscillatory movement of the flexing arms in opposite directions along the first horizontal axis at a resonance frequency, and the other electrode structure has a function of detecting the oscillation. A suspension structure has a suspension arm in the window. An attachment arrangement is coupled to the suspension element centrally in the window, near the second electrode structure.

A sensor element for thermal anemometry includes a semiconductor substrate and a thin-film diaphragm attached to the semiconductor substrate and having a front side and a rear side. A resistive heating element and a temperature-dependent resistor are attached to the front side of the thin-film diaphragm. In the area of the rear side of the thin-film diaphragm, the semiconductor substrate has a first recess. A silicon layer including a recess which merges with the first recess of the semiconductor substrate is located between the thin-film diaphragm and the semiconductor substrate.

A method for manufacturing a multi-layer MEMS component includes: providing a multi-layer substrate that has a monocrystalline carrier layer, a monocrystalline functional layer having a front side and a back side, and a bonding layer located between the back side and the carrier layer; growing a first polycrystalline layer over the front side of the monocrystalline functional layer; removing the monocrystalline carrier layer; and growing a second polycrystalline layer over the back side of the monocrystalline functional layer.

A process for manufacturing a timepiece oscillator made up of a balance and of at least two spring portions that are arranged in parallel, which includes (a) choosing the frequency f of the oscillator, (b) choosing a balance and spring portions so that the inertia of the balance and the angular stiffnesses of the spring portions allow an oscillator of chosen frequency f to be formed and so that the variations in angular stiffness of the spring portions as a function of temperature are able to thermo-compensate the oscillator, and (c) assembling the chosen spring portions with the chosen balance.

A MEMS device comprises a suspended membrane structure having an inner membrane section and an outer membrane section. The outer membrane section surrounds the inner membrane section. The membrane structure comprises an elastically deformable spring structure in the outer membrane section, such that the spring structure is arranged to convert a thermal-induced compressive stress in the suspended membrane structure into a spring displacement.

The present disclosure relates to an apparatus comprising a substrate, wherein a MEMS module is arranged on a first side of the substrate, the output signal from said MEMS module changing in the event of a change in temperature. Furthermore, the apparatus has a housing structure which is arranged on a first side of the substrate and has a recess in which the MEMS module is arranged. The apparatus also has a layer which is applied to the housing structure and increases the heat capacity of the apparatus. The present disclosure also relates to a method for producing an apparatus of this kind.

The invention provides a micro-electro-mechanical device which is manufactured by a CMOS manufacturing process. The micro-electro-mechanical device includes a stationary unit, a movable unit, and a connecting member. The stationary unit includes a first capacitive sensing region and a fixed structure region. The movable unit includes a second capacitive sensing region and a proof mass, wherein the first capacitive sensing region and the second capacitive sensing region form a capacitor, and the proof mass region consists of a single material. The connecting member is for connecting the movable unit in a way to allow a relative movement of the movable unit with respect to the stationary unit.

A micromechanical sensor device and a corresponding manufacturing method. The micromechanical sensor device is equipped with a substrate which includes a diaphragm area, multiple sensor layer areas being formed on the diaphragm area, which have a particular structured sensor layer; and a particular electrode device, via which the sensor layer areas are electrically connectable outside of the diaphragm area, the sensor layer areas being structured in such a way that they have length and width dimensions of a magnitude between 1 and 10 micrometers.