The present disclosure describes an image forming element having a semiconductor chip with micro-electro-mechanical-system (MEMS) devices and voltage generators, each voltage generator being configured to generate a voltage used by one or more of the MEMS devices. A floating ground may be used to add a voltage to the voltage generated by the voltage generators. The semiconductor chip may include electrical connections, where each voltage generator is configured to provide the voltage to the one or more MEMS devices through the electrical connections. The MEMS devices may define a boundary in the semiconductor chip within which the MEMS devices, the voltage generators, and the electrical connections are located. Each MEMS device may generate an electrostatic field to manipulate an electron beamlet of a multi-beam charged particle microscope. The MEMS devices may be organized into groups based on a distance to a reference location (e.g., optical axis) in the semiconductor chip.

An organic light-emitting diode (OLED) device, a brightness adjustment method thereof and a display device are provided. The OLED device includes: an OLED substrate provided with at least one OLED element; a package structure configured to form a closed space with the OLED substrate; and an external compensation component including at least one photosensitive sensor and at least one compensation adjustment unit. The at least one photosensitive sensor is configured to detect the light intensity emitted by the at least one OLED element; and the at least one compensation adjustment unit is provided on a side wall on a light-emitting side of the package structure facing the closed space and configured to adjust light intensity emitted by the at least one OLED element according to a detected signal by the at least one photosensitive sensor.

A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.

A micromechanical device includes a tiltable structure that is rotatable about a first rotation axis. The tiltable structure is coupled to a fixed structure through an actuation structure of a piezoelectric type. The actuation structure is formed by spring elements having a spiral shape. The spring elements each include actuation arms extending transversely to the first rotation axis. Each actuation arm carries a respective piezoelectric band of piezoelectric material. The actuation arms are divided into two sets with the piezoelectric bands thereof biased in phase opposition to obtain rotation in opposite directions of the tiltable structure about the first rotation axis.

A system includes an optical reflector to reflect the light, the optical reflector having a rotor, a first stator, and a second stator. The system further includes a controller in communication with the optical reflector. The controller is to drive the optical reflector by applying a first actuation voltage to the first stator, and a second actuation voltage to the second stator. Further, the controller is to apply an excitation voltage to the first stator. Furthermore, the controller is to determine a relationship between a first capacitance between the rotor and the first stator, and a second capacitance between the rotor and the second stator. Based on the relationship, the controller is to determine a position attribute of the optical reflector.

An optical scanning system includes one or more Micro-Electro-Mechanical System (MEMS) Micro-Mirror Arrays (MMAs) used to scan a field-of-view (FOV) over a field-of-regard (FOR). The MEMS MMA is configured such that optical radiation from each point in the FOV does not land on or originate from out-of-phase mirror segments and a diffraction limited resolution of the optical system is limited by the size of the entrance pupil and not by the size of individual mirrors.

A micro-electro-mechanical system (MEMS) transducer including an enclosure defining an interior space and having an acoustic port formed through at least one side of the enclosure. The transducer further including a compliant member positioned within the interior space and acoustically coupled to the acoustic port, the compliant member being configured to vibrate in response to an acoustic input. A back plate is further positioned within the interior space, the back plate being positioned along one side of the compliant member in a fixed position. A filter is positioned between the compliant member and the acoustic port, and the filter includes a plurality of axially oriented pathways and a plurality of laterally oriented pathways which are acoustically interconnected and dimensioned to prevent passage of a particle from the acoustic port to the compliant member.

An optical electronics device includes first, second and third wafers. The first wafer has a semiconductor substrate with a dielectric layer on a side of the semiconductor substrate. The second wafer has a transparent substrate with an anti-reflective coating on a side of the transparent substrate. The first wafer is bonded to the second wafer at a silicon dioxide layer between the semiconductor substrate and the anti-reflective coating. The first and second wafers include a cavity extending from the dielectric layer through the semiconductor substrate and through the silicon dioxide layer to the anti-reflective coating. The third wafer includes micromechanical elements. The third wafer is bonded to the dielectric layer, and the micromechanical elements are contained within the cavity.

An object is to continuously apply voltage to a MEMS device using first to fifth or sixth transistors. One of a source and a drain of the first transistor is electrically connected to one of a source and a drain of the second transistor. One of a source and a drain of the third transistor is electrically connected to one of a source and a drain of the fourth transistor. A gate of the first transistor is electrically connected to one of a source and a drain of the fifth transistor. A gate of the second transistor is electrically connected to the one of the source and the drain of the third transistor. A gate of the fourth transistor is electrically connected to the gate of the first transistor. The MEMS device is electrically connected to the one of the source and the drain of the first transistor.

According to an embodiment, an optical MEMS transducer includes a diffraction structure including alternating first reflective elements and openings arranged in a first plane, a reflection structure including second reflective elements and configured to deflect with respect to the diffraction structure, and an optical element configured to direct a first optical signal at the diffraction structure and the reflection structure and to receive a second optical signal from the diffraction structure and the reflection structure. The second reflective elements are arranged in the first plane when the reflection structure is at rest. Other embodiments include corresponding systems and apparatus, each configured to perform various embodiment methods.