Patent classifications
B81B3/0083
TUNABLE WAVELENGTH FILTERING DEVICE THAT IS TUNED BY ALTERING THE ANGLE OF THE OPTICAL BEAM THAT IS INCIDENT ON A FILTER
A tunable wavelength filtering device is presented in which the tuning mechanism is based on altering the incident angle to an optical thin film coating stack, or thin film optical filter. Rotating mirrors, such as Micro-Electro-Mechanical Systems (MEMS) tilt-mirrors, are used to alter the incident angle of the optical beam coming from an input fiber, and also to aim or align the exiting beam to an output optical fiber. The optical thin film coating stack can be implemented onto a glass substrate, to form a thin film filter chip. The thin film filter chip can be fixed in place, and the incident angle and exiting angle of the optical beam is varied by adjusting the tilt angle of the two rotating mirrors.
LASERCOM ACQUISITION AND TRACKING SENSOR
An acquisition and tracking sensor includes a quad detector with a narrow field of view (NFOV) and a micro-electromechanical system (MEMS) mirror with a wide field of view (WFOV). The quad detector is placed behind the MEMS mirror to produce a WFOV to allow the quad detector to scan a larger area for the incoming laser beam.
FEEDTHROUGH REJECTION FOR OPTOMECHANICAL DEVICES USING ELEMENTS
An optomechanical device comprising an assembly, one or more laser devices configured to generate a first optical signal and a second optical signal, and a circuit. The assembly includes a first beam structure comprising a first spatial frequency and a second beam structure comprising a second spatial frequency. The circuit is configured to modulate the second optical signal and output the first optical signal and the second optical signal to the assembly. A first element of a first beam structure shifts the first spatial frequency of the assembly by approximately 180 degrees and a second element of a second beam structure shifts the second spatial frequency of the assembly by approximately 180 degrees such that a first optical resonance is generated, which is probed by the first optical signal interacting with the assembly, and a second optical resonance is generated, which is probed by the second optical signal interacting with the assembly, where the first optical resonance and the second optical resonance are spectrally separated by a minimum threshold.
MEMs Phased-Array for LiDAR Applications
An optical scanner including micro-electromechanical system phased-arrays suitable for use in a LiDAR system, and methods of operating the same are described. Generally, the scanner includes an optical transmitter having first phased-arrays to receive light from a light source, form a swath of illumination in a far field scene and to modulate phases of the light to sweep or steer the swath over the scene in two-dimensions (2D). An optical receiver in the scanner includes second phased-arrays to receive light from the far field scene and direct at least some of the light onto a detector. The second phased-arrays are configured to de-scan the received light by directing light reflected from the far field scene onto the detector while rejecting background light. In one embodiment the second phased-arrays direct light from a slice of the far field scene onto a 1D detector array.
OPTOMECHANICAL RESONATOR STABILIZATION FOR OPTOMECHANICAL DEVICES
An optomechanical device optomechanical device for stabilizing an optomechanical resonator comprising a circuit configured to generate a first optical signal and a second optical signal, modulate the first optical signal, modulate the second optical signal, and combine the first optical signal and the second optical signal into a combined optical signal to direct the combined optical signal into an assembly. An inner sidewall of a first beam structure of the assembly has a first inner spatial frequency correspond to a second inner spatial frequency of an inner sidewall of a second beam structure of the assembly and an outer sidewall of the first beam structure has a first outer spatial frequency correspond to a second outer spatial frequency of an outer sidewall of the second beam structure.
MEMS-DRIVEN OPTICAL PACKAGE WITH MICRO-LED ARRAY
An optical light package includes an optical output lens, an optical filter located thereunder and between the output lens and LEDS, a tray of LEDs arrayed on a stage mounted on a linear comb based MEMS device that is distributed in such a way that the stage is movable, and a driver that controls movement of the stage.
Scanning reflector system
An apparatus includes a reflector system having a support, a reflector and a spring structure for scanning motion of the reflector in two orthogonal oscillation modes. A frequency response peaks at a natural resonant frequency with an initial bandwidth. A first transducer structure provides mechanical actuation of the reflector; a second transducer structure generates sense signals representing mechanical motion of the reflector. A feedback circuit receives from the second transducer structure a sense signal and generates to the first transducer structure a drive signal. The feedback circuit is adjusts amplitude and frequency of the drive signal to a non-linear vibration range where a frequency shift at the peak frequency is at least ten times the initial bandwidth, varies the amplitude of the drive signal in proportion to a waveform of a modulation signal, and sets frequency of the modulation signal component smaller than the frequency shift at the peak frequency.
Optical electronics device
An optical electronics device includes first, second and third wafers. The first wafer has a semiconductor substrate with a dielectric layer on a side of the semiconductor substrate. The second wafer has a transparent substrate with an anti-reflective coating on a side of the transparent substrate. The first wafer is bonded to the second wafer at a silicon dioxide layer between the semiconductor substrate and the anti-reflective coating. The first and second wafers include a cavity extending from the dielectric layer through the semiconductor substrate and through the silicon dioxide layer to the anti-reflective coating. The third wafer includes micromechanical elements. The third wafer is bonded to the dielectric layer, and the micromechanical elements are contained within the cavity.
OPTICAL SCANNING DEVICE AND METHOD OF CONTROL THEREFOR
The present invention provides an optical scanning device capable of optical scanning without reducing the spatial resolution even when the scanning range is expanded. The optical scanning device 100 comprises: a light source 101 emitting a light; a scanning mirror 106 that includes a reflecting plane reflecting a light entering from the light source and that is allowed to oscillate independently around each of a first axis extending in the reflecting plane and a second axis orthogonal to the first axis and extending in the reflecting plane; and a controller 103 controlling the scanning mirror in terms of a first frequency and a first amplitude of oscillation around the first axis as well as a second frequency and a second amplitude of oscillation around the second axis for scanning with the light reflected by the reflecting plane of the scanning mirror. The controller 103 controls the second frequency based on the maximum scanning angle in the sub-scanning direction.
PACKAGED DEVICE WITH DIE WRAPPED BY A SUBSTRATE
A die-wrapped packaged device includes at least one flexible substrate having a top side and a bottom side that has lead terminals, where the top side has outer positioned die bonding features coupled by traces to through-vias that couple through a thickness of the flexible substrate to the lead terminals. At least one die includes a substrate having a back side and a topside semiconductor surface including circuitry thereon having nodes coupled to bond pads. One of the sides of the die is mounted on the top side of the flexible circuit, and the flexible substrate has a sufficient length relative to the die so that the flexible substrate wraps to extend over at least two sidewalls of the die onto the top side of the flexible substrate so that the die bonding features contact the bond pads.