B81B3/0086

MEMS DEVICE WITH MEANDERING ELECTRODES
20220219969 · 2022-07-14 ·

This disclosure describes a microelectromechanical device comprising a mobile rotor and a fixed stator, a rotor electrode and a stator electrode. The rotor and stator electrodes are meandering electrodes which comprises two or more first lateral sections which lie on a first lateral baseline, a first lateral gap in the rotor electrode is adjacent to a second lateral gap in the stator electrode and at least partially aligned with said second lateral gap in the transversal direction.

MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE
20220250901 · 2022-08-11 ·

A micromechanical component for a sensor device, including a seismic mass, which is situated at and/or in a mounting and which includes a first electrode area, a second electrode area electrically insulated from the first electrode area, and a connecting area made up of at least one electrically insulating material. The first electrode area and the second electrode area each mechanically contact the connecting area and are connected to one another via the connecting area. At least one first conductive area of the first electrode area and a second conductive area of the second electrode area are structured out of a first semiconductor and/or metal layer. The first electrode area also includes a third conductive area. The second electrode area also includes a fourth conductive area. The third conductive area and the fourth conductive area are structured out of a second semiconductor and/or metal layer.

DROPLET JETTING DEVICE

A droplet jetting device comprising a membrane layer defining a pressure chamber that is in fluid communication with a nozzle, the membrane layer carrying, on a membrane that covers the pressure chamber, an actuator for generating pressure waves in a liquid in the pressure chamber, the device further comprising a distribution layer bonded to the membrane layer on the side of the membrane and defining a supply line for supplying the liquid to the pressure chamber, the supply line being connected to the pressure chamber via a restrictor passage extending through the distribution layer in the thickness direction of that layer, and via a window formed in the membrane, characterized in that the restrictor passage has a uniform cross-section, and the membrane window is delimited by a contour that is inwardly offset from the contour of the restrictor passage on the entire periphery of the restrictor passage.

Low-parasitic capacitance MEMS inertial sensors and related methods

Microelectromechanical system (MEMS) inertial sensors exhibiting reduced parasitic capacitance are described. The reduction in the parasitic capacitance may be achieved by forming localized regions of thick dielectric material. These localized regions may be formed inside trenches. Formation of trenches enables an increase in the vertical separation between a sense capacitor and the substrate, thereby reducing the parasitic capacitance in this region. The stationary electrode of the sense capacitor may be placed between the proof mass and the trench. The trench may be filled with a dielectric material. Part of the trench may be filled with air, in some circumstances, thereby further reducing the parasitic capacitance. These MEMS inertial sensors may serve, among other types of inertial sensors, as accelerometers and/or gyroscopes. Fabrication of these trenches may involve lateral oxidation, whereby columns of semiconductor material are oxidized.

METHOD FOR MANUFACTURING A MICROELECTROMECHANICAL STRUCTURE AND MICROELECTROMENCHANICAL STRUCTURE
20220081286 · 2022-03-17 ·

A method for manufacturing a microelectromechanical structure. The method includes: forming a first and a second functional layer including recesses, a third functional layer, and three insulating layers situated therebetween, a structured lateral area of the third functional layer defining a movable structure, the insulating layers and the first and second functional layers each including a lateral area situated beneath the structured lateral area of the third functional layer and corresponding to a perpendicular projection of the structured lateral area; etching the insulating layers to remove the lateral area of the third insulating layer, and expose the movable structure, all recesses of the first functional layer situated in the lateral area of the first functional layer being formed by narrow trenches, the first functional layer being formed to include an electrically insulated segment in the lateral area which is separated from the remainder of the first functional layer by trenches.

MEMS element and electrical circuit
11837425 · 2023-12-05 · ·

According to one embodiment, a MEMS element includes a first member, and an element part. The element part includes a first fixed electrode fixed to the first member, and a first movable electrode facing the first fixed electrode, a first conductive member electrically connected with the first movable electrode, and a second conductive member electrically connected with the first movable electrode. The first movable electrode is supported by the first and second conductive members to be separated from the first fixed electrode in a first state before a first electrical signal is applied between the second conductive member and the first fixed electrode. The first conductive member is separated from the first movable electrode in a second state after the first electrical signal is applied. The first movable electrode is supported by the second conductive member to be separated from the first fixed electrode in the second state.

MEMS devices and methods of forming thereof

In a non-limiting embodiment, a MEMS device may include a substrate having a device stopper. The device stopper may be integral to the substrate and formed of the substrate material. A thermal dielectric isolation layer may be arranged over the device stopper and the substrate. A device cavity may extend through the substrate and the thermal dielectric isolation layer. The thermal dielectric isolation layer and the device stopper at least partially surround the device cavity. An active device layer may be arranged over the thermal dielectric isolation layer and the device cavity.

CASCADABLE MEMS LOGIC DEVICE BASED ON MODES ACTIVATION
20220069824 · 2022-03-03 ·

A cascadable resonator logic system includes a substrate; a first straight beam anchored with a first end to the substrate; a second straight beam anchored with a first end to the substrate; a first arch beam, which is curved, and is attached with a first end to a second end of the first straight beam, at a first joint, and with a second end to a second end of the second straight beam, at a second joint, so that both the first and second ends of the first arch beam are suspended above the substrate; and a second arch beam, which is also curved, and is attached with a first end to the second joint, and a second end is anchored to the substrate.

Broad Range Micro Pressure Sensor
20210323808 · 2021-10-21 ·

Disclosed is a micro pressure sensor including a plurality of modules that are operative over different ranges of pressure. The modules include a stack of at least two module layers, each module layer including a module body having walls that define a compartment and with the defined compartment partitioned into at least two sub-compartments, a port for fluid ingress or egress disposed in a first wall of the body, with remaining walls of the body being solid walls, a membrane affixed to a first surface of the module body covering the compartment, and an electrode affixed over a surface of the membrane.

Device for suppressing stray radiation

A device for suppressing stray radiation includes a Micro-ElectroMechanical System (MEMS) sensor module and a conductive cage structure. The conductive cage structure may enclose the MEMS sensor module in order to suppress penetration of stray electromagnetic radiation with a stray wavelength λ.sub.o into the conductive cage structure, and the conductive cage structure may be arranged to be thermally insulated from the MEMS sensor module. The device may also include a connecting line. The connecting line may be connected to the MEMS sensor module and fed through the conductive cage structure by a capacitive element.