A system includes a semiconductor substrate having a first cavity. The semiconductor substrate forms a pedestal adjacent the first cavity. A device overlays the pedestal and is bonded to the semiconductor substrate by metal within the first cavity. A plurality of second cavities are formed in a surface of the pedestal beneath the device, wherein the second cavities are smaller than the first cavity. In some of these teachings, the second cavities are voids. In some of these teachings, the metal in the first cavity comprises a eutectic mixture. The structure relates to a method of manufacturing in which a layer providing a mask to etch the first cavity is segmented to enable easy removal of the mask-providing layer from the area over the pedestal.

A silicone member used for a micro device and a micro device which achieve both electrification suppression and light transmittance are provided. The silicone member is used as a micro device and has a holding part for holding samples, or defines the holding part through the combination with a counterpart member. The silicone member includes a silicone material which has silicone and an ionic conductive agent, and the content of the ionic conductive agent is 0.01 part by mass or higher and 1 part by mass or lower with respect to 100 parts by mass of the silicone. The micro device includes the silicone member.

Controllable electromechanical adhesive devices including three-dimensional dielectrically-coated microstructures that are mechanically compliant are provided. The microstructures can be controlled to provide tunable electromechanical surface adhesion, allowing for dexterous gripping of microscale and/or macroscale objects. For example, the devices can tune the surface adhesion strength of one or more microstructures without complex mechanical actuation in a wide range of on/off ratios with low voltage. The devices can be configured as a force sensor capable of providing tactile feedback for determining the load applied against the microstructures by the surface of an object. For example, the devices can provide output indicative of changes in an electrical property of one or more microstructures for determining the applied load of an object. The devices can be pixelated or otherwise configured to provide localized force sensing and/or surface adhesion. Related systems and methods for controlling the disclosed electromechanical adhesive devices are also described.

A system includes a semiconductor substrate having a first cavity. The semiconductor substrate forms a pedestal adjacent the first cavity. A device overlays the pedestal and is bonded to the semiconductor substrate by metal within the first cavity. A plurality of second cavities are formed in a surface of the pedestal beneath the device, wherein the second cavities are smaller than the first cavity. In some of these teachings, the second cavities are voids. In some of these teachings, the metal in the first cavity comprises a eutectic mixture. The structure relates to a method of manufacturing in which a layer providing a mask to etch the first cavity is segmented to enable easy removal of the mask-providing layer from the area over the pedestal.

A packaged pressure sensor, comprising: a MEMS pressure-sensor chip; and an encapsulating layer of elastomeric material, in particular PDMS, which extends over the MEMS pressure-sensor chip and forms a means for transferring a force, applied on a surface thereof, towards the MEMS pressure-sensor chip.

A packaged pressure sensor, comprising: a MEMS pressure-sensor chip; and an encapsulating layer of elastomeric material, in particular PDMS, which extends over the MEMS pressure-sensor chip and forms a means for transferring a force, applied on a surface thereof, towards the MEMS pressure-sensor chip.

A micromechanical structure includes a fixing point, a silicon spring, and a movable part. The silicon spring is connected to the fixing point at a first end and to the movable part at a second end. At least one copper circuit trace is situated on the silicon spring and extends at least from the first end to the second end. The copper circuit trace has a layer structure including a plurality of contiguous copper layers.

A system is disclosed for detecting movement of a microelectromechanical system (MEMS) device. The system may include a drive voltage signal source for generating a drive voltage signal for driving the MEMS device. A modulation voltage signal source generates a modulation signal having a frequency above a physical response capability of the MEMS device. A capacitor voltage divider network may be included having a first capacitor, coupled in series with the modulation voltage signal source, and a capacitance of the MEMS device representing a second capacitor which changes in response to movement of the MEMS device. An output component may be coupled in parallel with the second capacitor and produces an output voltage signal. A filter removes the drive voltage signal from the output voltage signal. The output voltage signal is indicative of a position of the MEMS device.

Active superhydrophobic surface structures are actively-controlled surface structures exhibiting a superhydrophobic state and an ordinary state. Active superhydrophobic surface structures comprise an outer elastomeric covering defining an exposed surface, a controlled group of MEMS (micro-electro-mechanical system) actuators at least covered by the elastomeric covering, and, a controlled region of the exposed surface corresponding to the controlled group. The controlled region has a superhydrophobic state in which the controlled region is textured. The controlled region also has an ordinary state in which the controlled region is smooth (i.e., less textured than in the superhydrophobic state). Active superhydrophobic surface structures may be part of an apparatus that includes a controller and/or one or more sensors. The controller, sensors, and the controlled region may form a feedback loop in which the active superhydrophobic surface is actively controlled.

A packaged integrated device includes a package substrate having a first surface and a second surface opposite the first surface, and the package substrate has a hole therethrough. The integrated device package also includes a first lid mounted on the first surface of the package substrate to define a first cavity, and a second lid mounted on the second surface of the package substrate to define a second cavity. A microelectromechanical systems (MEMS) die can be mounted on the first surface of the package substrate inside the first cavity and over the hole. A port can be formed in the first lid or the second lid.