Embodiments of the present disclosure relate generally to acoustically decoupled microelectromechanical system devices and, more particularly, to acoustically decoupled microelectromechanical system devices anchored upon phononic crystals. In some embodiments described herein, a device may comprise a resonator, a handle layer, and a pedestal disposed between the resonator and the handle layer, the pedestal connecting the resonator to the handle layer. In the devices described herein, the resonator and the handle layer may be non-coplanar. In some embodiments, the handle layer comprises a phononic crystal to acoustically decouple the resonator from the substrate of the handle layer.

A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a substrate having a first surface and a second surface arranged opposite to the first surface; a stress-sensitive sensor disposed at the first surface of the substrate, where the stress-sensitive sensor is sensitive to mechanical stress; a stress-decoupling trench that has a vertical extension that extends from the first surface into the substrate, where the stress-decoupling trench vertically extends partially into the substrate towards the second surface although not completely to the second surface; and a plurality of particle filter trenches that vertically extend from the second surface into the substrate, wherein each of the plurality of particle filter trenches have a longitudinal extension that extends orthogonal to the vertical extension of the stress-decoupling trench.

A micro-electrical-mechanical system (MEMS) device includes one or more slidable connection assemblies for releasably coupling the micro-electrical-mechanical system (MEMS) device to a wafer from which the micro-electrical-mechanical system (MEMS) device was made. The MEMS device may include a MEMS actuation core, and a MEMS electrical connector assembly electrically coupled to the MEMS actuation core configured to be electrically coupled to a printed circuit board.

The present disclosure relates to a MEMS vibrator or the like that has excellent chemical resistance and an excellent mechanical strength and that is easily thinned. The present disclosure is a MEMS vibrator comprising: a vibrating film including a graphite film; and a silicon member supporting the vibrating film, the graphite film having a thickness of 50 nm or more and less than 20 m, and the graphite film having a Young's modulus along a graphite film plane direction of 700 GPa or more.

A micromechanical component includes a micromirror connected to a mounting support via at least one spring such that the micromirror is adjustable about at least one axis of rotation relative to the mounting support, where the micromirror includes a reflective surface developed at least partially on a first diaphragm surface of a mounted diaphragm of the micromirror, the diaphragm including a second diaphragm surface that faces away from the first diaphragm surface and that is mounted in air or vacuum.

A sensor unit includes: a sensor module having an inertial sensor installed therein and having a bottom wall and a sidewall; abase where the sensor module is provided; a first bonding member bonding the base and the sidewall together; and a second bonding member bonding the base and the bottom wall together. The sensor module is a polygon as viewed in a plan view of the bottom wall. The base and the sidewall are bonded together via the first bonding member at a part of at least one side of the polygon except corners.

A micromechanical device having a substrate wafer, a functional layer situated above it which has a mobile micromechanical structure, and a cap situated on top thereof, having a first cavity, which is formed at least by the substrate wafer and the cap and which includes the micromechanical structure. The micromechanical device has a fixed part and a mobile part, which are movably connected to each other with at least one spring element, and the first cavity is situated in the mobile part. Also described is a method for producing the micromechanical device.

A micro-electromechanical systems (MEMS) driving arrangement for an electronic device, the micro-electromechanical systems (MEMS) driving arrangement including a driven wheel; a driving actuation assembly for causing rotation of the driven wheel; an indicator assembly including an indicator; and a force absorbing assembly coupled intermediate the indicator assembly and the driven wheel; whereby a force acting upon the indicator assembly is absorbed by the force absorbing assembly so as to inhibit rotation of the driven wheel relative to the driving actuation assembly.

An ultrasonic MEMS acoustic transducer formed in a body of semiconductor material having first and second surfaces opposite to one another. A first cavity extends in the body and delimits at the bottom a sensitive portion, which extends between the first cavity and the first surface of the body. The sensitive portion houses a second cavity and forms a membrane that extends between the second cavity and the first surface of the body. An elastic supporting structure extends between the sensitive portion and the body and is suspended over the first cavity.

A MEMS device includes: a substrate as a base including a support portion and a detection electrode as a fixed electrode; a movable body supported to the support portion with a major surface of the movable body facing the fixed electrode; and an abutment portion facing at least a portion of an outer edge of the movable body and restricting rotational displacement in an in-plane direction of the major surface. The abutment portion includes an abutment surface including an abutment position at which the movable body abuts against the abutment portion due to the rotational displacement of the movable body, and a hollow portion provided opposing the abutment surface.