Various embodiments of the present disclosure are directed towards an integrated chip (IC) including a substrate. A plurality of adhesive structures is disposed on the substrate. A microelectromechanical systems (MEMS) structure is disposed on the adhesive structures. The MEMS structure comprises a movable element disposed within a cavity. A first plurality of stopper bumps is disposed between the movable element and the substrate.

MEMS-based sensors can experience undesirable signal frequencies caused by vibrations, shocks, and accelerations, among other phenomena. A microisolation system can isolate individual MEMS-based sensors from undesirable signal frequencies and shocks. An embodiment of a system for microisolation of a MEMS-based sensor can include an isolation platform connected to one or more folded springs. Another embodiment of a system for microisolation can include an isolation platform and/or a frame connected to a mesh damping mechanism. In at least one embodiment, a mesh damping mechanism can be a microfibrous metal mesh damper. In one or more embodiments, a system for microisolation can include an isolation platform connected to one or more L-shaped springs, and a thickness of the one or more L-shaped springs can be less than a thickness of the isolation platform.

A PMUT device includes a membrane element adapted to generate and receive ultrasonic waves by oscillating, about an equilibrium position, at a corresponding resonance frequency. A piezoelectric element is located over the membrane element along a first direction and configured to cause the membrane element to oscillate when electric signals are applied to the piezoelectric element, and generate electric signals in response to oscillations of the membrane element. A damper is configured to reduce free oscillations of the membrane element, and the damper includes a damper cavity surrounding the membrane element, and a polymeric member having at least a portion over the damper cavity along the first direction.

A PMUT device includes a membrane element extending perpendicularly to a first direction and configured to generate and receive ultrasonic waves by oscillating about an equilibrium position. At least two piezoelectric elements are included, with each one located over the membrane element along the first direction and configured to cause the membrane element to oscillate when electric signals are applied to the piezoelectric element, and generate electric signals in response to oscillations of the membrane element. The membrane element has a lobed shape along a plane perpendicular to the first direction, with the lobed shape including at least two lobes. The membrane element includes for each piezoelectric member a corresponding membrane portion including a corresponding lobe, with each piezoelectric member being located over its corresponding membrane portion.

Described herein are methods and systems useful in the fabrication of ultrasound transducer devices. Fabrication of ultrasound transducer devices can comprise manipulation of components having extremely small cross-sectional thicknesses, which can increase the risk of damage to the components. For example, inadvertent application of forces sufficient to damage such components is a significant risk during fabrication steps. As described herein, the risk of damage to an ultrasound transducer device component having a small cross-sectional thickness, such as an ultrasound microelectromechanical system (MEMS) wafer, can be reduced by partially or completely coating or filling all or a portion of the component with a stabilizing material, for example, prior to subjecting the component to forces associated with manipulation of the component during the fabrication process.

A method for producing damper structures on a micromechanical wafer. The method includes: (A) providing an edge adhesive film and a molding wafer, which includes a first side having a molding structure; (B) applying the edge adhesive film to the first side of the molding wafer at a low atmospheric pressure; (C) joining the edge adhesive film to the first side of the molding wafer by increasing the atmospheric pressure; (D) filling the molding structures with an adhesive; (E) curing the adhesive to form damper structures; (F) bonding the damper structures to a second side of a micromechanical wafer.

Exemplary embodiment of a tilting z-axis, out-of-plane sensing MEMS accelerometers and associated structures and configurations are described. Disclosed embodiments facilitate improved offset stabilization. Non-limiting embodiments provide exemplary MEMS structures and apparatuses characterized by one or more of having a sensing MEMS structure that is symmetric about the axis orthogonal to the springs or flexible coupling axis, a spring or flexible coupling axis that is aligned to one of the symmetry axes of the electrodes pattern, a different number of reference electrodes and sense electrodes, a reference MEMS structure having at least two symmetry axes, one which is along the axis of the springs or flexible coupling, and/or a reference structure below the spring or flexible coupling axis.

A micromechanical component for a sensor or microphone device, including a substrate, a frame structure, which is situated on the substrate surface and/or at least one intermediate layer, and a diaphragm, which spans an inner volume, which is at least partially framed by the frame structure. The micromechanical component includes a bending beam structure, which is situated in the inner volume and includes at least one anchoring area, which is attached to the frame structure, to the substrate surface and/or to the at least one intermediate layer, and at least one self-supporting area, which is connected via at least one coupling structure to the diaphragm inner side of the diaphragm in such a way that the at least one self-supporting area is bendable by way of a warping of the diaphragm.

In an inertial sensor, a first movable body configured to swing around a first rotation axisrotation axis along a first direction has an opening; the opening includes a second movable body configured to swing around a second rotation axisrotation axis along a second direction, a second support beam supporting the second movable body as the second rotation axisrotation axis, a third movable body configured to swing around a third rotation axisrotation axis along the second direction, and a third support beam supporting the third movable body as the third rotation axisrotation axis; and a protrusion is provided at a surface facing the second movable body and the third movable body, or at the second movable body and the third movable body, the protrusion protruding toward the second movable body and the third movable body or the surface.

A micromechanical sensor structure. The micromechanical sensor structure including: a substrate; a mass which can be elastically deflected relative to the substrate; a measuring unit for detecting a deflection of the mass; and a damping structure for damping a deflection of the mass. The damping structure includes first and second damping combs which mesh together. The first damping comb is arranged on the mass and the second damping comb is arranged movably on a deflecting structure. When the mass is deflected in a first direction, the second damping comb is moved via the deflecting structure relative to the substrate in a second direction opposite the first direction.