The present disclosure provides a microelectronic isolation system comprising a base, vibration isolator, primary sensor, and microprocessor. The base supports the vibration isolator, the primary sensor, and the microprocessor. The vibration isolator has a platform, isolation material, and at least one isolation sensor. The isolation material dampens an overall vibrational frequency experienced by the microelectronic isolation system. The isolation sensor measures a displacement. The displacement is a measurement of a displacement of the platform with respect to the base. The primary sensor measures a primary sensor response, which is received by the microprocessor to calculate a plurality of responses. The plurality of responses of the microprocessor being one or a combination of a measured compensation response, an inertial response, and a restored primary sensor response.

A robust MEMS transducer includes a kinetic energy diverter disposed within its frontside cavity. The kinetic energy diverter blunts or diverts kinetic energy in a mass of air moving through the frontside cavity, before that kinetic energy reaches a diaphragm of the MEMS transducer. The kinetic energy diverter renders the MEMS transducer more robust and resistant to damage from such a moving mass of air.

The present invention relates to a vibration sensor comprising a pressure generating element for generating pressure differences between a first and a second volume in response to vibrations of the vibration sensor, the first and second volumes being acoustically sealed from each other, and a pressure transducer for measuring pressure differences between the first and second volumes. The present invention also relates to an associated method for detecting vibrations.

A micro-electrical-mechanical system (MEMS) actuator includes a first set of actuation fingers, a second set of actuation fingers, and a first spanning structure configured to couple at least two fingers of the first set of actuation fingers while spanning at least one finger of the second set of actuation fingers.

A micro-electrical-mechanical system (MEMS) actuator includes: a MEMS actuation core, and a multi-piece MEMS electrical connector assembly electrically coupled to the MEMS actuation core and configured to be electrically coupled to a printed circuit board, wherein the multi-piece MEMS electrical connector includes: a plurality of subcomponents, and a plurality of coupling assemblies configured to couple the plurality of subcomponents together.

A semiconductor structure includes a substrate, a sensing device disposed over the substrate and including a plurality of protruding members protruded from the sensing device; a sensing structure disposed adjacent to the sensing device and including a plurality of sensing electrodes protruded from the sensing structure towards the sensing device; and an actuating structure disposed adjacent to the sensing device and configured to provide an electrostatic force on the sensing device based on a feedback from the sensing structure. Further, a method of manufacturing the semiconductor structure is also disclosed.

A semiconductor die is proposed, wherein the semiconductor die comprises a microelectronic section and a sensor section. The microelectronic section comprises an integrated circuit. The sensor section adjoins an edge of the semiconductor die. A sensor is also proposed, which comprises such a semiconductor die.

A micromechanical arm array is provided. The micromechanical arm array comprises: a plurality of micromechanical arms spaced from each other in a first horizontal direction and extending in a second horizontal direction, wherein each micromechanical arm comprises a protrusion at a top of each micromechanical arm and protruding upwardly in a vertical direction; a plurality of protection films, each protection film encapsulating one of the plurality of micromechanical arms; and a metal connection structure extending in the first horizontal direction. The metal connection structure comprises: a plurality of joint portions, each joint portion corresponding to and surrounding the protrusion of one of the plurality of micromechanical arms; and a plurality of connection portions extending in the first horizontal direction and connecting two neighboring joint portions.

A method for producing damper structures on a micromechanical wafer. The method includes: providing an at least partially UV-transparent master mold for molding damper structures; inserting and pressing a micromechanical wafer into the master mold so that micromechanical structures in the wafer are aligned in relation to the damper structures; filling the master mold with UV-curing LSR and subsequent UV irradiation; and mold release and removal of the connected structure of the micromechanical wafer with attached dampers. A method for producing a singulated MEMS chip comprising a UV-cured damper is also described.

Piezoresistive detection resonant device comprising a substrate, a mobile par configured to move with respect the substrate, suspension elements suspending the mobile part to the substrate, a piezoresistive detection device to detect the motions of the mobile part, said piezoresistive detection device comprising at least one strain gauge, wherein the piezoresistive detection resonant device also comprises a folded spring with at least two spring arms, connected to the mobile part and configured to be deformed by the motion of the mobile part, the at least one gauge being suspended between the substrate and the folded spring in such manner that the deformation of the gauge is reduced compared to the motion of the mobile part.