The present invention provides a substrate that is highly resistant to ESD, on which a reverse sound hole type MEMS microphone can be mounted. The substrate has one surface connected to a MEMS microphone, and comprises a substrate sound hole that penetrates through the substrate and communicates with a sound hole of the MEMS microphone, and a GND pad disposed around the substrate sound hole on another surface of the substrate.

A microelectronic device contains a high performance silicon nitride layer which is stoichiometric within 2 atomic percent, has a low stress of 600 MPa to 1000 MPa, and has a low hydrogen content, less than 5 atomic percent, formed by an LPCVD process. The LPCVD process uses ammonia and dichlorosilane gases in a ratio of 4 to 6, at a pressure of 150 millitorr to 250 millitorr, and at a temperature of 800 C. to 820 C.

The MEMS device includes a cap sheet defining a recess, and a device sheet bonded with the cap sheet and defining a functional cavity directly facing the recess. The cap sheet includes a substrate having a first surface facing the device sheet, a ground structure and a first metal layer disposed on a portion of the first surface outside the recess, and the ground structure disposed along perimeter of an area where the first metal layer located. The device sheet includes a substrate, a structure layer and a second metal layer sequentially stacked. The structure layer includes a first portion located in the functional cavity and a second portion surrounding the first portion, and the second metal layer is located on the second portion. By the first and second metal layer, the cap sheet is bonded with the device sheet, and all electrodes of the MEMS device are electrically connected.

Disclosed in the present application are a microphone structure, a packaging structure, and an electronic apparatus. The microphone structure comprises a base component and a functional assembly, wherein the base component is provided with a sound hole; the functional assembly comprises a first functional assembly and a second functional assembly; and the first functional assembly comprises an acoustic device and a third functional assembly, and the second functional assembly comprises a second metal portion and a second insulating portion. By means of the present application, the antistatic discharge performance of a product can be improved, and the damage of electrostatic discharge to a device can be reduced.

A component (8) adapted to engage with a receiver (6) has an array of contact pads (16) to removeably connect with a corresponding array of connectors (18) on the receiver (6). Each contact pad (16) of the array is electrically connected to the electrode (26) of a corresponding recess or well (28) that is part of a sensor, wherein a membrane is formable across each recess. A conductive grid (102) is configured between the contact pads (16) of the array, to inhibit an electrostatic discharge (ESD) conducting across the recesses or wells and/or direct an ESD away from the recesses or wells.