A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.

A sub-millimeter packaged microsystem includes a microsystem located in a sealed cavity defined between first and second portions of a micropackage. One or both micropackage portions can be fabricated from a metal suitable for use in a harsh environment, such as an oil well environment. The microsystem includes electronic components and can be configured to communicate with external components through a wall of the micropackage by wireless communication or by conductive feedthroughs. Pluralities of microsystems, first micropackage portions, and/or second micropackage portions are simultaneously placed during a batch assembly process. The assembly process may include micro-crimping the first and second micropackaging portions together without the need for bonding materials and related process steps.

According to an example aspect of the present invention, there is provided a Microelectrical System, MEMS, mirror apparatus, comprising a MEMS mirror, at least two pairs of actuation units, wherein each pair comprises a first and a second actuation unit and a first actuation unit of a first pair of actuation units comprises a stress relief unit, an inner actuator and an outer actuator, and the stress relief unit is coupled to the MEMS mirror and to the inner actuator, one end of the inner actuator is coupled to the stress relief unit of the actuation unit and another end of the inner actuator is coupled to the outer actuator of the actuation unit, the stress relief unit of the first actuation unit of the first pair of actuation units is in between the MEMS mirror and an inner actuator of a second actuation unit of a second pair of actuation units, and the inner actuator of the first actuation unit of the first pair of actuation units is in between a stress relief unit of a second actuation unit of the first pair of actuation units and an outer actuator of a second actuation unit of a second pair of actuation units.

A micro-electro-mechanical device formed in a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region above the first buried cavity; and a second buried cavity extending in the sensitive region. A decoupling trench extends from a first face of the monolithic body as far as the first buried cavity and laterally surrounds the second buried cavity. The decoupling trench separates the sensitive region from a peripheral portion of the monolithic body.

A micro-electro-mechanical device formed in a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region above the first buried cavity; and a second buried cavity extending in the sensitive region. A decoupling trench extends from a first face of the monolithic body as far as the first buried cavity and laterally surrounds the second buried cavity. The decoupling trench separates the sensitive region from a peripheral portion of the monolithic body.

A sub-millimeter packaged microsystem includes a microsystem located in a sealed cavity defined between first and second portions of a micropackage. One or both micropackage portions can be fabricated from a metal suitable for use in a harsh environment, such as an oil well environment. The microsystem includes electronic components and can be configured to communicate with external components through a wall of the micropackage by wireless communication or by conductive feedthroughs. Pluralities of microsystems, first micropackage portions, and/or second micropackage portions are simultaneously placed during a batch assembly process. The assembly process may include micro-crimping the first and second micropackaging portions together without the need for bonding materials and related process steps.

Suspending a microelectromechanical system (MEMS) pressure sensing element inside a cavity using spring-like corrugations or serpentine crenellations, reduces thermally-mismatched mechanical stress on the sensing element. Overlaying the spring-like structures and the sensing element with a gel further reduces thermally-mismatched stress and vibrational dynamic stress.

A micro-electro-mechanical device formed in a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region above the first buried cavity; and a second buried cavity extending in the sensitive region. A decoupling trench extends from a first face of the monolithic body as far as the first buried cavity and laterally surrounds the second buried cavity. The decoupling trench separates the sensitive region from a peripheral portion of the monolithic body.

The present invention is to provide an hermetic-sealing package member including a substrate and at least one frame-like sealing material for defining a sealing region formed on the substrate, in which the sealing material is formed of a sintered body obtained by sintering at least one metal powder selected from gold, silver, palladium, or platinum having a purity of 99.9 wt % or greater and an average particle size of 0.005 m to 1.0 m, and with respect to an arbitrary cross-section toward an outside from the sealing region, a length of an upper end of the sealing material is shorter than a length of a lower end. Examples of a cross-sectional shape of the sealing material may include one formed to have a base portion having a certain height and at least one mountain portion protruding from the base portion or one formed to have a mountain portion having substantially a triangular shape in which the length of the lower end of the sealing material is a bottom. By use of the hermetic-sealing package member of the present invention, a load is reduced at the time of hermetic-sealing and a sufficient sealing effect can be obtained.

According to an example aspect of the present invention, there is provided a Microelectrical System, MEMS, mirror apparatus, comprising a MEMS mirror, at least two pairs of actuation units, wherein each pair comprises a first and a second actuation unit and a first actuation unit of a first pair of actuation units comprises a stress relief unit, an inner actuator and an outer actuator, and the stress relief unit is coupled to the MEMS mirror and to the inner actuator, one end of the inner actuator is coupled to the stress relief unit of the actuation unit and another end of the inner actuator is coupled to the outer actuator of the actuation unit, the stress relief unit of the first actuation unit of the first pair of actuation units is in between the MEMS mirror and an inner actuator of a second actuation unit of a second pair of actuation units, and the inner actuator of the first actuation unit of the first pair of actuation units is in between a stress relief unit of a second actuation unit of the first pair of actuation units and an outer actuator of a second actuation unit of a second pair of actuation units.