A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.

A force sensor includes a leadframe comprising a plurality of electrically conductive leads, a sense die coupled to the leadframe, and an encapsulant disposed over at least a portion of the leadframe and the sense die. The sense die is electrically coupled to the plurality of leads, and the plurality of leads extends from the encapsulant.

A sensor assembly for being mounted on a circuit board comprises an interposer with at least one opening extending between a first and a second main surface of the interposer. The interposer comprises at least two stress decoupling elements, each comprising a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening. A sensor die is connected to the flexible structures on the first main surface. At least two board connection elements are arranged on the first main surface and adapted for connecting the assembly to the circuit board.

A manufacturing method for a micromechanical window structure including the steps: providing a substrate, the substrate having a front side and a rear side; forming a first recess on the front side; forming a coating on the front side and on the first recess; and forming a second recess on the rear side, so that the coating is at least partially exposed, whereby a window is formed by the exposed area of the coatings.

A waterproofed environmental sensing device with water detection provisions includes an environmental sensor to sense one or more environmental properties. The device further includes an electronic integrated circuit implemented on a substrate and coupled to the environmental sensor via a wire bonding. An air-permeable cap structure is formed over the environmental sensor, and a protective layer is formed over the wire bonding to protect the wire bonding against damage.

In described examples, a bondline structure is arranged along a periphery of a cavity. The bondline structure extends from a first substrate and is configured to bond with an interposer arranged on a second substrate. A diffusion barrier is arranged on the first substrate for contacting the interposer. The diffusion barrier is arranged to impede a contaminant against migrating from the bondline structure and entering the cavity.

The application describes a package for a MEMS transducer. The package has a package substrate having an acoustic port formed in the package substrate. The acoustic port comprises a first acoustic port volume portion and a second acoustic port volume portion, the first acoustic port volume portion being separated from the second acoustic port volume potion by a discontinuity in a sidewall of the substrate. The cross sectional area of the first acoustic port volume portion is greater than the cross sectional area of the second acoustic port volume portion. A barrier may be attached to the upper surface of the package substrate so as to seal or cover the acoustic port.

Systems and methods for suppressing bias in a non-degenerate vibratory structure are provided. In certain embodiments, a vibratory structure includes a first proof mass; a second proof mass, wherein the first proof mass and the second proof mass are driven into motion along a first axis, wherein the first proof mass and the second proof mass move in anti-phase along a second axis, wherein the motion of the first proof mass and the second proof mass along the second axis is such that the centers of mass of the first proof mass and the second proof mass move collinearly along a same axis.

An auxetic interposer includes: a frame enclosing an interior space; a pad arranged within the interior space; and a plurality of micro auxetic lattices extending between the frame and the pad.

A MEMS microphone and a manufacturing method thereof are provided. The MEMS microphone comprises a MEMS microphone chip and a housing with an acoustic port. The MEMS microphone chip is mounted in the housing, and a mesh plug is mounted in the acoustic port and made from a mesh material which has a mesh structure that is suitable for passage of sound.