A semiconductor package with design features, including an isolation structure for internal components and a flexible electrical connection, that minimizes errors due to environmental temperature, shock, and vibration effects. The semiconductor package may include a base having a first portion surrounded by a second portion. A connector assembly may be attached to the first portion. The connector assembly may extend through an opening in the base. A lid attached may be attached to, at least, the second portion. The attached lid may form a hermetically-sealed cavity defined by an upper surface of the first portion, the connector assembly, and an inner surface of the lid. An elastomer pad may be on the first portion and a sub-assembly may be on the elastomer pad. A flexible electrical connection may be formed between the connector assembly and the sub-assembly.

Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.

MEMS devices comprise a filter configured and arranged to inhibit the entry of particles into at least a region of the interior of the substrate cavity from a region underlying the substrate.

A MEMS device formed by a substrate, having a surface; a MEMS structure arranged on the surface; a first coating region having a first Young's modulus, surrounding the MEMS structure at the top and at the sides and in contact with the surface of the substrate; and a second coating region having a second Young's modulus, surrounding the first coating region at the top and at the sides and in contact with the surface of the substrate. The first Young's modulus is higher than the second Young's modulus.

A MEMS pressure sensor packaged with a molding compound. The MEMS pressure sensor features a lead frame, a MEMS semiconductor die, a second semiconductor die, multiple pluralities of bonding wires, and a molding compound. The MEMS semiconductor die has an internal chamber, a sensing component, and apertures. The MEMS semiconductor die and the apertures are exposed to an ambient atmosphere. A method is desired to form a MEMS pressure sensor package that reduces defects caused by mold flashing and die cracking. Fabrication of the MEMS pressure sensor package comprises placing a lead frame on a lead frame tape; placing a MEMS semiconductor die adjacent to the lead frame and on the lead frame tape with the apertures facing the tape and being sealed thereby; attaching a second semiconductor die to the MEMS semiconductor die; attaching pluralities of bonding wires to form electrical connections between the MEMS semiconductor die, the second semiconductor die, and the lead frame; and forming a molding compound.

Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) package comprising a wire-bond damper. A housing structure overlies a support substrate, and a MEMS structure is between the support substrate and the housing structure. The MEMS structure comprises an anchor, a spring, and a movable mass. The spring extends from the anchor to the movable mass to suspend and allow movement of the movable mass in a cavity between the support substrate and the housing structure. The wire-bond damper is on the movable mass or structure surrounding the movable mass. For example, the wire-bond damper may be on a top surface of the movable mass. As another example, the wire-bond damper may be on the support substrate, laterally between the anchor and the movable mass. Further, the wire-bond damper comprises a wire formed by wire bonding and configured to dampen shock to the movable mass.

The present disclosure provides a microelectronic isolation system comprising a base, vibration isolator, primary sensor, and microprocessor. The base supports the vibration isolator, the primary sensor, and the microprocessor. The vibration isolator has a platform, isolation material, and at least one isolation sensor. The isolation material dampens an overall vibrational frequency experienced by the microelectronic isolation system. The isolation sensor measures a displacement. The displacement is a measurement of a displacement of the platform with respect to the base. The primary sensor measures a primary sensor response, which is received by the microprocessor to calculate a plurality of responses. The plurality of responses of the microprocessor being one or a combination of a measured compensation response, an inertial response, and a restored primary sensor response.

A sensor package comprising: a sensor, wherein the sensor comprises a sensing structure formed in a material layer and one or more further material layers arranged to seal the sensing structure to form a hermetically sealed sensor unit; a support structure; one or more springs flexibly fixing the hermetically sealed sensor unit to the support structure; wherein the one or more springs are formed in the same material layer as the sensing structure of the sensor unit; and one or more external package wall(s) encapsulating the sensor unit, the support structure, and the one or more springs, wherein the support structure is fixed to at least one of the package wall(s). The springs decouple mechanical stresses between the sensor unit and the external package wall(s) so as to reduce the long term drift of scale factor and bias.

To realize a substrate shape capable of ensuring a required substrate thickness while improving acoustic characteristics. A package on which a microphone element is to be mounted, the package including a substrate includes at least one recessed portion in a region corresponding to a mounting portion of the microphone element in the package. A bottom surface of the recessed portion in the substrate is a thin plate portion that is thinner than thicknesses of other regions. The substrate includes a plurality of through holes in the thin plate portion.

A system is provided for providing vibration isolation and acceleration compensation for a device such as a vibration-sensitive oscillator or sensor. The system has an assembly that moves or vibrates relative to an external component. The assembly includes a plurality of components mounted to either side of a PCB. One or more accelerometers are configured to detect acceleration of the PCB in at least one of an X-axis direction, a Y-axis direction, and a Z-axis direction. The system includes plurality of isolators coupled to the assembly and configured to isolate or dampen vibrations that would otherwise transfer to the assembly from an underlying component to which the assembly is configured to attach to. In certain embodiments, the isolators are located between the assembly and the underlying component within vertical confines of an exterior perimeter of the PCB.