A thin-film filter includes thin-film part having a film surface and a rear film surface arranged at the rear side of the film surface, a plurality of through holes, being formed to penetrate the thin-film part from the film surface to the rear film surface, the through holes are formed along by a slanting direction being made an acute angle or an obtuse angle with the film surface, and stripes-formed inner wall surfaces. The stripes-formed inner wall surfaces include stripe-like parts formed along by the slanting direction. The stripes-formed inner wall surfaces are formed inside the respective through holes.

A pressure sensor includes a lidless structure defining an internal chamber for a sealed environment and presenting an aperture; a chip including a membrane deformable on the basis of external pressure, the chip being mounted outside the lidless structure in correspondence to the aperture so that the membrane closes the sealed environment; and a circuitry configured to provide a pressure measurement information based on the deformation of the membrane.

A system including a plurality of cooling cells is described. Each of the cooling cells includes a support structure and a cooling element. The cooling element has a central region having an axis and a perimeter. The cooling element IS supported by the support structure at the central region and along the axis. At least a portion of the perimeter being unpinned. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. A portion of the cooling cells aligned along the axis are physically connected such that the cooling cells form an integrated cooling cell tile.

Micro-electro-mechanical system (MEMS) devices are disclosed, including a MEMS device comprising a semiconductor die including integrated circuitry, a structure mounted on the semiconductor die and covering at least a portion of the circuitry, the structure defining a space between the structure and the at least a portion of the circuitry, and a transducer including a membrane, the transducer located outside of the space.

A water-proof microphone is provided in embodiments of the present invention, comprising: a substrate on which microphone components are mounted; a packaging housing arranged on top of the substrate; a plurality of water-proof sound apertures being formed on the packaging housing; wherein the packaging housing is connected to the substrate in a leak-tight manner. In the present invention, a plurality of water-proof sound apertures are formed on the packaging housing of the microphone, and the water-proof sound apertures prevent water drops from entering the interior of the microphone while allowing sound signals enter the microphone. Water tension may prevent the water drops from entering the microphone through the sound apertures. In this way, the microphone is resistant to water and its acoustic performance is not affected. In addition, since there is no need for the provision of the water-proof membranes, a simpler structure is obtained, and costs are reduced.

The disclosed technology provides solutions for preventing the ingress of potentially harmful materials, such as moisture and debris, into a sensor housing. In some aspects, an ingress-protection sub-assembly is provided. The sub-assembly can include a t-protector mounted to an outer surface of a face-plate, wherein the t-protector is disposed above an inlet in the face-plate, a printed circuit board (PCB) mounted to an inner surface of the face-plate, and a membrane disposed between the PCB and the face-plate. Methods for assembling and mounting a sub-assembly are also provided.

Technologies are provided for microelectromechanical microphones that can be robust to substantial pressure changes in the environment in which the micromechanical microphones operate. In some embodiments, a microelectromechanical microphone device can include a rigid plate defining multiple openings that permit passage of a pressure wave. The microelectromechanical microphone device also includes a stiffener member integrated into the rigid plate. The stiffener member causes stress to be distributed within the rigid plate in response to the pressure wave inducing deformation of the rigid plate.

The present application describes a MEMS transducer package having a substrate layer which defines a recess. The recess extends in the plane of the substrate layer and defines a channel for directing sound waves that are incident on a side surface of the package substrate.

A device having both an electronic assembly having an electronic component assembled on a first substrate, and also a body defining a cavity having a first end in fluid flow communication with a fluid, the electronic component extending inside the cavity and the first substrate including a portion in contact with a wall of the cavity. The coefficient of thermal expansion of the material of the first substrate is less than that of the electronic component, and the electronic component is assembled on the first substrate by a brazing type assembly method involving the application of heat. A method of making an electronic assembly. An assembly obtained by the method.

A sound producing package structure includes a shell and a chip. The shell includes a top structure, a bottom structure and a sidewall structure. The chip is disposed inside the shell and configured to produce an acoustic wave, wherein the chip includes a thin film structure and an actuator configured to actuate the thin film structure, and the thin film structure is substantially parallel to the top structure and the bottom structure. A first opening is formed on the sidewall structure, and the acoustic wave propagates outwards through the first opening.