A semiconductor device includes a microelectromechanical system (MEMS) die, an encapsulation material, a via element, a non-conductive lid, and a conductive layer. The encapsulation material laterally surrounds the MEMS die. The via element extends through the encapsulation material. The non-conductive lid is over the MEMS die and defines a cavity. The conductive layer is over the MEMS die and the encapsulation material and is electrically coupled to the via element.

A component which can be produced at wafer level has a first chip and a second chip connected thereto. The connection is (at least partially) established via a first and a second connecting structure and a first and a second contact structure of the second chip. An adaptation structure between the first chip and the first connecting structure equalizes a height difference between the first and the second contact structure.

The present invention discloses a system for protecting a MEMS product from an ESD event, including, a control circuit; a MEMS product, electrically connected with the control circuit; an ESD protection device, electrically connected with the control circuit, and electrically connected with the MEMS product in parallel; wherein, the ESD protection device comprises: a top electrode assembly electrically connected with the control circuit; a flexible beam comprising a first electrode layer electrically connected with the control circuit, a second electrode layer electrically connected with the MEMS product, and a moving metal contact electrically connected with the second electrode layer; a bottom electrode assembly having a bottom electrode layer electrically connected with the MEMS product and a fixed metal contact electrically connected with the bottom electrode layer and facing the moving metal contact.

MEMS devices comprise a filter configured and arranged to inhibit the entry of particles into at least a region of the interior of the substrate cavity from a region underlying the substrate.

A microphone assembly comprises a substrate. An acoustic transducer is disposed on the substrate, the acoustic transducer configured to generate an electrical signal responsive to acoustic activity. An integrated circuit is disposed on the substrate and electrically coupled to the acoustic transducer, the integrated circuit configured to generate an output signal indicative of the acoustic activity based on the electrical signal from the acoustic transducer. An enclosure is coupled to the substrate and defines an internal volume between the enclosure and the substrate, the enclosure having an outer surface exposed to an outside environment of the microphone assembly, and an inner surface adjacent the internal volume. An insulating layer is disposed on the inner surface of the enclosure. The insulating layer comprises a fluoropolymer.

A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.

The invention relates to antenna apparatus comprising: an antenna, a signal conductor and one or more RF MEMS switches, the antenna being conductively connected to the signal conductor, the MEMS switches and at least a portion of the signal conductor being supported by a crystalline MEMS substrate; and a capping substrate comprising a capping portion, wherein an enclosed volume is formed around the said MEMS switches between the capping portion and at least a portion of the crystalline MEMS substrate, and wherein the capping substrate comprises the said antenna.

Provided are a chip packaging method and a chip packaging structure. A passivation layer is provided on a pad of a wafer, a first metal bonding layer is then formed on the passivation layer, a second metal bonding layer is formed on a substrate, the substrate and the wafer are bonded and packaged together through bonding of the first metal bonding layer and the second metal bonding layer, a first shielding layer is provided on the substrate, and the first shielding layer is connected to the second metal bonding layer; and after the wafer and the substrate are bonded, semi-cutting is performed on the wafer until the first metal bonding layer is exposed, and a second shielding layer is then formed, and the second shielding layer is electrically connected to the first metal bonding layer, such that an electromagnetic shielding structure jointly composed of the first shielding layer, the second metal bonding layer, the second shielding layer and the first metal bonding layer is obtained. The shielding structure is thus approximately closed, thereby improving the electromagnetic shielding effect.

The present disclosure relates to a sensor assembly (100) comprising: a base (102) having a host-device interface (104), a lid (108) mounted on the base (102) to form a housing (110), the lid (108) having an insulative structural core (112) between an inner metal skin (114) and an outer metal skin (116); and a transduction element (118) disposed in the housing (112). Advantageously, the lid (108) of the sensor assembly (100) can help to minimize and reduce undesirable thermo-acoustic effects produced by external environmental conditions that may result in acoustic artifacts.

To realize a substrate shape capable of ensuring a required substrate thickness while improving acoustic characteristics. A package on which a microphone element is to be mounted, the package including a substrate includes at least one recessed portion in a region corresponding to a mounting portion of the microphone element in the package. A bottom surface of the recessed portion in the substrate is a thin plate portion that is thinner than thicknesses of other regions. The substrate includes a plurality of through holes in the thin plate portion.