A chip package is provided. The chip package includes a substrate having a first surface and a second surface opposite thereto. A dielectric layer is disposed on the first surface of the substrate and includes a conducting pad structure. A first opening penetrates the substrate and exposes a surface of the conducting pad structure. A second opening is communication with the first opening and penetrates the conducting pad structure. A redistribution layer is conformally disposed on a sidewall of the first opening and the surface of the conducting pad structure and is filled into the second opening. A method for forming the chip package is also provided.

A microfabricated optical apparatus that includes a light source driven by a waveform, a turning mirror, and a beam shaping element, wherein the waveform is delivered to the light source by at least one through silicon via.

An assembly body for micromirror chips that partly encloses an internal cavity, the assembly body including at two sides oriented away from one another, at least one respective partial outer wall that is fashioned transparent for a specified spectrum, and the assembly body having at least one first outer opening on which a first micromirror chip can be attached, and a second outer opening on which a second micromirror chip can be attached, in such a way that a light beam passing through the first partial outer wall is capable of being deflected by the first micromirror chip onto the second micromirror chip, and is capable of being deflected by the second micromirror chip through the second partial outer wall. A mirror device and a production method for a mirror device are also described.

For an optical electronic device and method that forms cavities through an interposer wafer after bonding the interposer wafer to a window wafer, the cavities are etched into the bonded interposer/window wafer pair using the anti-reflective coating of the window wafer as an etch stop. After formation of the cavities, the bonded interposer/window wafer pair is bonded peripherally of die areas to the MEMS device wafer, with die area micromechanical elements sealed within respectively corresponding ones of the cavities.

A handheld electronic product includes a case and a temperature sensing device. The case has a first opening. The temperature sensing device is disposed inside the case of the handheld electronic product. The temperature sensing device includes a first substrate, a sensor chip, and a metal shielding structure. The sensor chip is disposed on the first substrate. The metal shielding structure surrounds the sensor chip, and has a second opening. The sensor chip faces towards the first opening and the second opening.

A device can comprise an outer frame, a platform, and a motion control mechanism. The motion control mechanism can be adapted to permit movement of the platform in a desired direction with respect to the outer frame and inhibit rotation of the platform with respect to the outer frame. An actuator can be contained at least partially within the motion control mechanism.

A first ion rich dielectric substrate with a patterned dielectric barrier and a oxidizable metal layer is anodically bonded to a second ion rich dielectric substrate. To bond the substrates, the oxidizable metal layer is oxidized. The dielectric barrier may inhibit the migration of these ions to the bondline, which might otherwise poison the bond strength. Accordingly, when joining the two substrates, a strong bond is maintained between the wafers.

The present invention relates to a cover glass with an outer frame including: a flat glass having a first main surface and a second main surface that are opposite sides; and an outer frame bonded to the first main surface of the flat glass via a glass adhesive layer, in which the outer frame is made of a glass ceramic in which a filler is dispersed in a borosilicate glass, the borosilicate glass and the filler both contain aluminum oxide, the filler has a volume fraction of 40% to 65% in the glass ceramic, the aluminum oxide contained in the filler has a volume fraction of 10% to 65% in the glass ceramic, and an absolute value of a difference in average thermal expansion coefficient at 50 C. to 350 C. between the flat glass and the outer frame is 2010.sup.7/ C. or less.

A method for producing a composite cap element for encapsulation of a MEMS component includes providing a base substrate having a window formed through an opening, providing a transparent cover substrate for transparently covering the window in the base substrate, producing a hermetic connection between the base substrate and the cover substrate in a connection region which extends peripherally around the window, heating the interconnected substrates in an edge region of the window to a temperature at which the base substrate becomes deformable and the cover substrate remains dimensionally stable, and displacing the dimensionally stable cover substrate in the region of the window while simultaneously deforming the deformable base substrate in a region around the window. A composite cap element is also provided.

A microelectromechanical systems (MEMS) mirror package assembly includes: a MEMS wafer including a stator portion and a rotor portion that includes a MEMS mirror configured to rotate about an axis, wherein the MEMS mirror is suspended over a back cavity, wherein the MEMS wafer defines a first portion of the back cavity; a spacer wafer, wherein the backside of the spacer wafer is bonded to the frontside of the MEMS wafer, wherein the spacer wafer defines a first portion of a front cavity arranged over the MEMS mirror; a transparent cover wafer, wherein the backside of the transparent cover wafer is bonded to the frontside of the spacer wafer, wherein the transparent cover wafer includes a transparent dome structure arranged over the MEMS mirror and defining a second portion of the front cavity. The center of the MEMS mirror is arranged substantially at a vertex of the transparent dome structure.