An optical scanner including micro-electromechanical system phased-arrays suitable for use in a LiDAR system, and methods of operating the same are described. Generally, the scanner includes an optical transmitter having first phased-arrays to receive light from a light source, form a swath of illumination in a far field scene and to modulate phases of the light to sweep or steer the swath over the scene in two-dimensions (2D). An optical receiver in the scanner includes second phased-arrays to receive light from the far field scene and direct at least some of the light onto a detector. The second phased-arrays are configured to de-scan the received light by directing light reflected from the far field scene onto the detector while rejecting background light. In one embodiment the second phased-arrays direct light from a slice of the far field scene onto a 1D detector array.

An optoelectronic module includes an optical filter and can have a relatively small overall height. The module includes a semiconductor die for the optical filter, where the die has a cavity in its underside. The cavity provides space to accommodate an optoelectronic device such as a light sensor or light emitter. Such an arrangement can reduce the overall height of the module, thereby facilitating its integration into a host device in which space is at a premium.

A transducer modulus, comprising: a substrate; a cap on the substrate, defining a chamber; and a sensor modulus in the chamber, integrating a first MEMS transducer facing the chamber, and a second MEMS transducer facing the supporting substrate. The cap has a first opening that forms a path for access of the first environmental quantity exclusively towards a sensitive element of the first transducer, and the supporting substrate has a second opening that forms a path for access of the second environmental quantity exclusively towards a sensitive element of the second transducer.

Wafer level encapsulated packages includes a wafer, a glass substrate hermetically sealed to the wafer, and an electronic component. The glass substrate includes a glass cladding layer fused to a glass core layer and a cavity formed in the glass substrate. The electronic component is encapsulated within the cavity. In various embodiments, the floor of the cavity is planar and substantially parallel to a plane defined by a top surface of the glass cladding layer. The glass cladding layer has a higher etch rate in an etchant than the glass core layer. In various embodiments, the wafer level encapsulated package is substantially optically transparent. Methods for forming the wafer level encapsulated package and electronic devices formed from the wafer level encapsulated package are also described.

An optical electronics device includes first, second and third wafers. The first wafer has a semiconductor substrate with a dielectric layer on a side of the semiconductor substrate. The second wafer has a transparent substrate with an anti-reflective coating on a side of the transparent substrate. The first wafer is bonded to the second wafer at a silicon dioxide layer between the semiconductor substrate and the anti-reflective coating. The first and second wafers include a cavity extending from the dielectric layer through the semiconductor substrate and through the silicon dioxide layer to the anti-reflective coating. The third wafer includes micromechanical elements. The third wafer is bonded to the dielectric layer, and the micromechanical elements are contained within the cavity.

A die-wrapped packaged device includes at least one flexible substrate having a top side and a bottom side that has lead terminals, where the top side has outer positioned die bonding features coupled by traces to through-vias that couple through a thickness of the flexible substrate to the lead terminals. At least one die includes a substrate having a back side and a topside semiconductor surface including circuitry thereon having nodes coupled to bond pads. One of the sides of the die is mounted on the top side of the flexible circuit, and the flexible substrate has a sufficient length relative to the die so that the flexible substrate wraps to extend over at least two sidewalls of the die onto the top side of the flexible substrate so that the die bonding features contact the bond pads.

A hermetic capsule including a semiconductor/metal base with sensitive semiconductor/polymer electrical and optical components formed thereon and a semiconductor/metal lid. The semiconductor/metal lid sealed to the semiconductor/metal base by metallization so as to form a chamber including all of the sensitive semiconductor/polymer electrical and optical components and hermetically sealing the chamber and all sensitive components from the ambient. External access to the sensitive semiconductor/polymer electrical and optical components is provided through a metallization.

A multi-purpose Micro-Electro-Mechanical Systems (MEMS) thermopile sensor able to use as a thermal conductivity sensor, a Pirani vacuum sensor, a thermal flow sensor and a non-contact infrared temperature sensor, respectively. The sensor comprises a rectangular membrane created in a silicon substrate which has a thin polysilicon layer and a thin residual thermal reorganized porous silicon layer both attached on its back side, and configured to have its three sides clamped to the frame formed in the silicon substrate which surrounds and supports the membrane and the other side free to the frame, a cavity created in the silicon substrate, positioned under the membrane and having its flat bottom opposite to the membrane, its three side walls shaped as curved planes and the other side wall shaped as a vertical plane, a heater or an infrared absorber positioned on the membrane, close to and parallel with the free side of the membrane and a thermopile positioned on the membrane and consists of several thermocouples connected in series and having its hot junctions close to the heater and its cold junctions extended to the frame.

A method for producing a micromechanical device having inclined optical windows, and a corresponding micromechanical device are described. The production method includes: providing a first substrate having a front side and a rear side; forming a plurality of spaced-apart through holes in the first substrate which are arranged along a plurality of spaced-apart rows in the first substrate; forming a respective continuous beveled groove along each of the rows, the grooves defining a seat for the inclined optical windows; and inserting the optical windows into the grooves above the through holes.

In a method of generating a microelectromechanical system, MEMS, device, a MEMS substrate including a movable element is provided. A glass cover member including a glass cover is formed by hot embossing. The glass cover member is bonded to the MEMS substrate so as to hermetically seal by the glass cover a cavity in which the movable element is arranged.