A sensor device includes a first and second Micro-Electro-Mechanical (MEM) structures. The first MEM structure includes a first heating element on a first layer of the first MEM structure. The first heating element includes an input adapted to receive an input signal. The first MEM structure also includes a first temperature sensing element on a second layer of the first MEM structure. The second MEM structure includes a second heating element on a first layer of the second MEM structure and a second temperature sensing element on a second layer of the second MEM structure. An output circuit has a first input coupled to the first temperature sensing element and a second input coupled to the second temperature sensing element.

The present invention provides a MEMS pressure sensor and a manufacturing method. The pressure is formed by a top cap wafer, a MEMS wafer and a bottom cap wafer. The MEMS wafer comprises a frame and a membrane, the frame defining a cavity. The membrane is suspended by the frame over the cavity. The bottom cap wafer closes the cavity. The top cap wafer has a recess defining with the membrane a capacitance gap. The top cap wafer comprises a top cap electrode located over the membrane and forming, together with the membrane, a capacitor to detect a deflection of the membrane. Electrical contacts on the top cap wafer are connected to the top cap electrode. A vent extends from outside of the sensor into the cavity or the capacitance gap. The pressure sensor can include two cavities and two capacitance gaps to form a differential pressure sensor.

A microphone assembly comprising a microphone unit secured to a mounting element. The microphone unit has a first side comprising an audio port, and the mounting element comprises a rigid body having a mounting side. The first side of the microphone unit is arranged at a right angle to the mounting side of the mounting element. The microphone unit may comprise a micro electromechanical systems (MEMS) microphone package holding a MEMS microphone die, and the mounting side of the mounting element may be configured for being mounted or soldered to a printed circuit board. The microphone assembly may be mounted to a device printed circuit board.

Embodiments may relate to a microelectronic package that includes a substrate with an overmold material. The microelectronic package may include a die in the overmold material, and an inactive side of the die may be coupled with a face of the substrate. A through-mold via (TMV) may be present in the overmold material. The TMV may be communicatively coupled with the substrate, and an active side of the die may be communicatively coupled with the TMV by a trace in the overmold material. Other embodiments may be described or claimed.

Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.

A microelectromechanical system (MEMS) sensor testing device, system and method are provided. The testing device includes a socket having a plurality of pads configured to receive a respective plurality of pins of the MEMS sensor, a body having a plurality of operable positions associated with a respective plurality of orientations of the MEMS sensor and circuitry which performs a method for testing the MEMS sensor in the plurality of operable positions. The method includes, for each position of the plurality of operable positions, outputting an indication of the position to the plurality of operable positions, receiving one or more measurements made by the MEMS sensor at the respective position and determining whether the one or more measurements satisfy a reliability criterion. The method includes generating a report based on the plurality of measurements and indicating whether the plurality of measurements satisfy a plurality of reliability criteria, respectively.

In an embodiment an electronic device includes a carrier board having an upper surface, an electronic chip mounted on the upper surface of the carrier board, the electronic chip having a mounting side facing the upper surface of the carrier board, a flexible mounting layer arranged between the upper surface of the carrier board and the mounting side of the electronic chip, the flexible mounting layer mounting the electronic chip to the carrier board, wherein the mounting side has at least one first region and a second region, and wherein the electronic chip has at least one chip contact element in the first region and at least one connection element arranged on the at least one first region and connecting the at least one chip contact element to the upper surface of the carrier board, wherein the flexible mounting layer separates the second region from the connection element.

The disclosure describes techniques to adjust the geometry of a pendulous proof mass VBA to operate with sufficient signal-to-noise performance while avoiding nonlinear mechanical coupling at specified frequencies. The techniques of this disclosure include adding anchor support flexures to a resonator connection structure, adjusting shape, thickness, and the material of VBA components and of the VBA support structure to both control the frequency of any mechanical resonant modes and to adjust the mechanical mode frequencies away from desired operating frequencies and, in some examples, away from harmonics of desired operating frequencies.

This disclosure describes techniques of configuring capacitive comb fingers of an accelerometer resonator into discreet electrodes with drive electrodes and at least two sense electrodes. The routing of electrical signals is configured to produce parasitic feedthrough capacitances that are approximately equal. The sense electrodes may be placed on opposite sides of the moving resonator beams such that the changes in capacitance with respect to displacement (e.g. dC/dx) are approximately equal in magnitude and opposite in sign. The arrangement may result in sense currents that are also opposite in sign and result in feedthrough currents of the same sign. The sense outputs from the resonators may be connected to a differential amplifier, such that the difference in output currents may mitigate the effect of the feedthrough currents and cancel parasitic feedthrough capacitance. Parasitic feedthrough capacitance may cause increased accelerometer noise and reduced bias stability.

The disclosure describes techniques to damp the proof mass motion of an accelerometer while achieving an underdamped resonator. In an example of an in-plane micro-electromechanical systems (MEMS) VBA, the proof mass may contain one or more damping combs that include one or more banks of rotor comb fingers attached to the proof mass. The rotor comb fingers may be interdigitated with stator comb fingers that are attached to fixed geometry. These damping comb fingers may provide air damping for the proof mass when the MEMS die is placed into a package containing a pressure above a vacuum. The geometry of the damping combs with a reduced air gap and large overlap area between the rotor comb fingers and stator comb fingers. The geometry of resonator of the VBA of this disclosure may be configured to avoid air damping.