A thermal regulation system includes an inertial measurement unit (IMU), one or more temperature adjusting devices in thermal communication with the IMU, and configured to adjust a temperature of the IMU from an initial temperature to a predetermined temperature, a filler provided in a space between the IMU and at least one temperature adjusting device of the one or more temperature adjusting devices, and a shared substrate configured to bear a weight of the IMU and the one or more temperature adjusting devices. The shared substrate includes a metallic board.

An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.

Described herein is a hydrogen sensor on medium or low temperature solid micro heating platform, comprising: a substrate; a thermal-insulating layer disposed above the substrate; a heating structure disposed above the thermal-insulating layer, and thermally and electrically isolated from the substrate by the thermal-insulating layer; a thermal-conducting layer covering the heating structure; and a sensitive layer disposed on the thermal-conducting layer. The sensitive layer can be heated to a set temperature by the heating structure to improve sensitivity and reduce the response time.

A dual-output microelectromechanical system (MEMS) resonator can be operated selectively and concurrently in an in-plane mode of vibration and an out-of-plane mode of vibration to obtain, respectively, a first electrical signal having a first frequency and a second electrical signal having a second frequency that is less than the first frequency. The first and second electrical signals are mixed to obtain a third electrical signal having a third frequency, where the third frequency is proportional to a temperature of the MEMS resonator. The temperature is determined based on the third frequency. Values of the first and second frequencies can be adjusted based on the determined temperature to compensate for frequency deviations due to temperature deviations. Also described herein are methods and systems for determining the temperature of the dual-output MEMS and for performing frequency compensation, as well as a method of manufacturing the dual-output MEMS.

A gas sensor and the drive circuit for the sensor are installed within a mobile electronic device. The gas sensor is intermittently heated to an operating temperature for detecting gases and kept at an ambient temperature for other periods. When a sensor of the mobile electronic device detects that the device is placed in a closed space, the heating of the metal oxide semiconductor is halted. When the sensor detects that the mobile electronic device has been taken out from the closed space, the heating of the metal oxide semiconductor is resumed. The poisoning of the gas sensor by siloxanes or the like is prevented.

A microelectromechanical heating device includes a substrate, a thermal insulator, and a heater. The thermal insulator includes a plurality of supporting structures and at least one thermal insulation layer. The supporting structures are disposed on the substrate. The thermal insulation layer is located above the substrate and connected to the plurality of supporting structures. The thermal insulation layer is spaced apart from the substrate by a distance. The heater is disposed on the at least one thermal insulation layer.

A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.

There is provided a dual-output microelectromechanical system (MEMS) resonator. The MEMS resonator can be operated selectively and concurrently in an in-plane mode of vibration and an out-of-plane mode of vibration to obtain respectively a first electrical signal having a first frequency, and a second electrical signal having a second frequency being less than the first frequency. The first and second electrical signals are mixed to obtain a third electrical signal having a third frequency, where the third frequency is proportional to a temperature of the MEMS resonator. The temperature is determined based on the third frequency. Values of the first and second frequencies can be adjusted based on the determined temperature to compensate for frequency deviations due to temperature deviations. There is also provided methods and systems for determining the temperature of the dual-output MEMS, for compensating the frequency, and a method of manufacturing the dual-output MEMS.

Described herein are methods and systems for configuring sensors to compensate for a temperature gradient. Multiple sensor sets, each having at least two sensors of a same type with orthogonal axes, are positioned to form at least one opposing sensor pair, in which an axis of one sensor of one sensor set is in an opposite orientation to an axis of one sensor of another sensor set. A combined measurement of each opposing sensor pair may be output which is compensated for an effect of a temperature gradient on sensor measurements of the sensors.

A sensor component. The sensor component includes a microelectromechanical z inertial sensor, including two sensor elements situated on a substrate and each designed in the form of a z rocker. The sensor elements each includes a seismic mass structure, elastically deflectable with respect to the substrate with the aid of a torsion spring, which has a heavy side and an oppositely situated light side with regard to the torsion springs. The seismic mass structure of the two sensor elements have different perforations on its heavy and/or light side(s), which effectuate a different sensitivity of the two sensor elements to a temperature gradient running in the z direction. The sensor component also includes an evaluation circuit designed to ascertain an acceleration in the z direction by evaluating the deflection of the seismic mass structure of the two sensor elements.